发明申请
- 专利标题: COPPER ALLOY SHEET AND METHOD FOR MANUFACTURING COPPER ALLOY SHEET
- 专利标题(中): 铜合金板和制造铜合金板的方法
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申请号: US14234964申请日: 2012-09-14
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公开(公告)号: US20140255248A1公开(公告)日: 2014-09-11
- 发明人: Keiichiro Oishi , Kouichi Suzaki
- 申请人: Keiichiro Oishi , Kouichi Suzaki
- 申请人地址: JP Tokyo
- 专利权人: MITSUBISHI SHINDOH CO., LTD.
- 当前专利权人: MITSUBISHI SHINDOH CO., LTD.
- 当前专利权人地址: JP Tokyo
- 优先权: JP2011-203452 20110916
- 国际申请: PCT/JP2012/073630 WO 20120914
- 主分类号: C22C21/10
- IPC分类号: C22C21/10
摘要:
An aspect of the copper alloy sheet contains 5.0 mass % to 12.0 mass % of Zn, 1.1 mass % to 2.5 mass % of Sn, 0.01 mass % to 0.09 mass % of P and 0.6 mass % to 1.5 mass % of Ni with a remainder of Cu and inevitable impurities, and satisfies a relationship of 20≦[Zn]+7×[Sn]+15×[P]+4.5×[Ni]≦32. The aspect of the copper alloy sheet is manufactured using a manufacturing process including a cold finishing rolling process in which a copper alloy material is cold-rolled, the average crystal grain diameter of the copper alloy material is 1.2 μm to 5.0 μm, round or oval precipitates are present in the copper alloy material, the average grain diameter of the precipitates is 4.0 nm to 25.0 nm or a proportion of precipitates having a grain diameter of 4.0 nm to 25.0 nm in the precipitates is 70% or more.
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