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    Production method of a wired circuit board
    1.
    发明授权
    Production method of a wired circuit board 有权
    有线电路板的生产方法

    公开(公告)号：US07971353B2

    公开(公告)日：2011-07-05

    申请号：US12068502

    申请日：2008-02-07

    申请人： Yuichi Takayoshi ,  Kazushi Ichikawa ,  Toshiki Naito

    发明人： Yuichi Takayoshi ,  Kazushi Ichikawa ,  Toshiki Naito

    IPC分类号： H05K3/02 ,  H05K3/10

    CPC分类号： H05K1/0269 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3452 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/163 ,  H05K2203/166 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

    摘要： A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.

    摘要翻译： 一种能够在确保高生产率和成本降低的同时，在端子部与外部端子之间的连接方面提高可靠性的布线电路板及其制造方法。 在包括与电子部件21的外部端子22连接的端子部分6的导电图案3和标准标记8之间以确定由于形成绝缘覆盖层4而形成的抑制部分23的存在或不存在以禁止连接 在绝缘基底层2上同时形成端子部分6和外部端子22之间，覆盖导电图案3的绝缘覆盖层4和端子部分6和标准标记8暴露的开口7形成 。 此后，参照从绝缘覆盖层4的开口部7露出的基准标记8来确定抑制部23的有无。

    Wired circuit board and producing method thereof
    2.
    发明授权
    Wired circuit board and producing method thereof 有权
    有线电路板及其制造方法

    公开(公告)号：US07371971B2

    公开(公告)日：2008-05-13

    申请号：US11349188

    申请日：2006-02-08

    申请人： Yuichi Takayoshi ,  Kazushi Ichikawa ,  Toshiki Naito

    发明人： Yuichi Takayoshi ,  Kazushi Ichikawa ,  Toshiki Naito

    IPC分类号： H05K1/03

    CPC分类号： H05K1/0269 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3452 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/163 ,  H05K2203/166 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

    摘要： A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.

    摘要翻译： 一种能够在确保高生产率和成本降低的同时，在端子部与外部端子之间的连接方面提高可靠性的布线电路板及其制造方法。 在包括与电子部件21的外部端子22连接的端子部分6的导电图案3和标准标记8之间以确定由于形成绝缘覆盖层4而形成的抑制部分23的存在或不存在以禁止连接 在绝缘基底层2上同时形成端子部分6和外部端子22之间，覆盖导电图案3的绝缘覆盖层4和端子部分6和标准标记8暴露的开口7形成 。 此后，参照从绝缘覆盖层4的开口部7露出的基准标记8来确定抑制部23的有无。

    Wired circuit board and producing method thereof
    3.
    发明申请
    Wired circuit board and producing method thereof 有权
    有线电路板及其制造方法

    公开(公告)号：US20060176069A1

    公开(公告)日：2006-08-10

    申请号：US11349188

    申请日：2006-02-08

    申请人： Yuichi Takayoshi ,  Kazushi Ichikawa ,  Toshiki Naito

    发明人： Yuichi Takayoshi ,  Kazushi Ichikawa ,  Toshiki Naito

    IPC分类号： G01R31/26

    CPC分类号： H05K1/0269 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3452 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/163 ,  H05K2203/166 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

    摘要： A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.

    摘要翻译： 一种能够在确保高生产率和成本降低的同时，在端子部与外部端子之间的连接方面提高可靠性的布线电路板及其制造方法。 在包括与电子部件21的外部端子22连接的端子部分6的导电图案3和标准标记8之间以确定由于形成绝缘覆盖层4而形成的抑制部分23的存在或不存在以禁止连接 在绝缘基底层2上同时形成端子部分6和外部端子22之间，覆盖导电图案3的绝缘覆盖层4和端子部分6和标准标记8暴露的开口7形成 。 此后，参照从绝缘覆盖层4的开口部7露出的基准标记8来确定抑制部23的有无。

    Wired circuit board and production method thereof
    5.
    发明申请
    Wired circuit board and production method thereof 有权
    有线电路板及其制作方法

    公开(公告)号：US20090025963A1

    公开(公告)日：2009-01-29

    申请号：US12068501

    申请日：2008-02-07

    申请人： Yuichi Takayoshi ,  Kazushi Ichikawa ,  Toshiki Naito

    发明人： Yuichi Takayoshi ,  Kazushi Ichikawa ,  Toshiki Naito

    IPC分类号： H05K1/03

    CPC分类号： H05K1/0269 ,  H05K1/111 ,  H05K3/303 ,  H05K3/3452 ,  H05K2201/094 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2203/163 ,  H05K2203/166 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49155

    摘要： A wired circuit board that can provide improved reliability on connection between the terminal portions and the external terminals while ensuring high productivity and cost reduction, and a production method thereof. After a conductive pattern 3 including terminal portions 6 to connect with external terminals 22 of an electronic component 21 and criterion marks 8 to determine presence or absence of an inhibitory portion 23 that may be formed due to formation of an insulating cover layer 4 to inhibit connection between the terminal portions 6 and the external terminals 22 are formed on the insulating base layer 2 simultaneously, the insulating cover layer 4 to cover the conductive pattern 3 and an opening 7 from which the terminal portions 6 and the criterion marks 8 are exposed is formed. Thereafter, the presence or absence of the inhibitory portion 23 is determined with reference to the criterion marks 8 exposed from the opening 7 of the insulating cover layer 4.

    摘要翻译： 一种能够在确保高生产率和成本降低的同时，在端子部与外部端子之间的连接方面提高可靠性的布线电路板及其制造方法。 在包括与电子部件21的外部端子22连接的端子部分6的导电图案3和标准标记8之间以确定由于形成绝缘覆盖层4而形成的抑制部分23的存在或不存在以禁止连接 在绝缘基底层2上同时形成端子部分6和外部端子22之间，覆盖导电图案3的绝缘覆盖层4和端子部分6和标准标记8暴露的开口7形成 。 此后，参照从绝缘覆盖层4的开口部7露出的基准标记8来确定抑制部23的有无。