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公开(公告)号：US20090218586A1
公开(公告)日：2009-09-03
申请号：US12160836
申请日：2007-01-10
申请人： Jae Ho Cho , Jung Yun Kim , Kang Hyun Cho
发明人： Jae Ho Cho , Jung Yun Kim , Kang Hyun Cho
IPC分类号： H01L33/00
CPC分类号： F21V29/004 , F21S41/19 , F21S45/47 , F21V19/04 , F21V29/2212 , F21V29/767 , F21Y2115/10 , H05K3/325 , H05K2201/09063 , H05K2201/10106 , H05K2201/10651 , H05K2203/167
摘要： The present invention relates to a light emitting diode (LED) lamp, and an object of the present invention is to provide an LED lamp in which an LED can be easily exchanged and external vibration can be absorbed to prevent the play thereof. To this end, an LED lamp according to the present invention comprises an LED package having a lead frame; a printed circuit board separated from the LED package and having a conductive pattern formed on a surface thereof facing the lead frame; and a pressing means for pressing the LED package toward the PCB so that the lead frame is in contact with the conductive pattern.
摘要翻译： 发光二极管（LED）灯技术领域本发明涉及一种发光二极管（LED）灯，其目的在于提供一种能够容易地进行LED交换的LED灯，能够吸收外部振动，防止其发挥。 为此，根据本发明的LED灯包括具有引线框架的LED封装; 印刷电路板，与LED封装分离并且具有形成在其面向引线框架的表面上的导电图案; 以及用于将LED封装朝向PCB按压使得引线框架与导电图案接触的按压装置。
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公开(公告)号：US08053799B2
公开(公告)日：2011-11-08
申请号：US12443293
申请日：2007-09-27
申请人： You Jin Kwon , Jung Hu Seo , Byoung Ki Pyo , Kang Hyun Cho
发明人： You Jin Kwon , Jung Hu Seo , Byoung Ki Pyo , Kang Hyun Cho
IPC分类号： H01L33/00
CPC分类号： H01L33/483 , H01L33/508 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/642 , H01L2224/48091 , H01L2933/0041 , H01L2924/00014
摘要： The present invention has an object to provide a LED package having a means capable of precisely limiting a region in which a resin containing a phosphor is dotted on a member on which an LED chip is supported. To this end, an LED package according to the present invention comprises a package body having an inner space with an LED chip mounted therein, the inner space being open toward a light emission direction; a chip support member mounted to the inner space of the package body to support the LED chip; a phosphor resin member formed by dotting resin containing a phosphor onto the LED chip; and a region limitation means provided on the chip support member and defining a region in which the phosphor resin member is formed.
摘要翻译： 本发明的目的是提供一种LED封装，其具有能够精确地限制含有荧光体的树脂在其上支撑LED芯片的部件上被点缀的区域的装置。 为此，根据本发明的LED封装包括具有安装在其中的LED芯片的内部空间的封装体，所述内部空间朝向发光方向开放; 安装到所述封装主体的内部空间以支撑所述LED芯片的芯片支撑构件; 通过将含有荧光体的树脂点到LED芯片上形成的荧光体树脂构件; 以及区域限制装置，其设置在所述芯片支撑构件上并且限定形成有所述荧光体树脂构件的区域。
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公开(公告)号：US09046252B2
公开(公告)日：2015-06-02
申请号：US12160836
申请日：2007-01-10
申请人： Jae Ho Cho , Jung Yun Kim , Kang Hyun Cho
发明人： Jae Ho Cho , Jung Yun Kim , Kang Hyun Cho
CPC分类号： F21V29/004 , F21S41/19 , F21S45/47 , F21V19/04 , F21V29/2212 , F21V29/767 , F21Y2115/10 , H05K3/325 , H05K2201/09063 , H05K2201/10106 , H05K2201/10651 , H05K2203/167
摘要： The present invention relates to a light emitting diode (LED) lamp, and an object of the present invention is to provide an LED lamp in which an LED can be easily exchanged and external vibration can be absorbed to prevent the play thereof. To this end, an LED lamp according to the present invention comprises an LED package having a lead frame; a printed circuit board separated from the LED package and having a conductive pattern formed on a surface thereof facing the lead frame; and a pressing means for pressing the LED package toward the PCB so that the lead frame is in contact with the conductive pattern.
摘要翻译： 发光二极管（LED）灯技术领域本发明涉及一种发光二极管（LED）灯，其目的在于提供一种能够容易地进行LED交换的LED灯，能够吸收外部振动，防止其发挥。 为此，根据本发明的LED灯包括具有引线框架的LED封装; 印刷电路板，与LED封装分离并且具有形成在其面向引线框架的表面上的导电图案; 以及用于将LED封装朝向PCB按压使得引线框架与导电图案接触的按压装置。
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公开(公告)号：US20100072499A1
公开(公告)日：2010-03-25
申请号：US12443293
申请日：2007-09-27
申请人： You Jin Kwon , Jung Hu Seo , Byoung Ki Pyo , Kang Hyun Cho
发明人： You Jin Kwon , Jung Hu Seo , Byoung Ki Pyo , Kang Hyun Cho
IPC分类号： H01L33/00
CPC分类号： H01L33/483 , H01L33/508 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/642 , H01L2224/48091 , H01L2933/0041 , H01L2924/00014
摘要： The present invention has an object to provide a LED package having a means capable of precisely limiting a region in which a resin containing a phosphor is dotted on a member on which an LED chip is supported. To this end, an LED package according to the present invention comprises a package body having an inner space with an LED chip mounted therein, the inner space being open toward a light emission direction; a chip support member mounted to the inner space of the package body to support the LED chip; a phosphor resin member formed by dotting resin containing a phosphor onto the LED chip; and a region limitation means provided on the chip support member and defining a region in which the phosphor resin member is formed.
摘要翻译： 本发明的目的是提供一种LED封装，其具有能够精确地限制含有荧光体的树脂在其上支撑LED芯片的部件上被点缀的区域的装置。 为此，根据本发明的LED封装包括具有安装在其中的LED芯片的内部空间的封装体，所述内部空间朝向发光方向开放; 安装到所述封装主体的内部空间以支撑所述LED芯片的芯片支撑构件; 通过将含有荧光体的树脂点到LED芯片上形成的荧光体树脂构件; 以及区域限制装置，其设置在所述芯片支撑构件上并且限定形成有所述荧光体树脂构件的区域。
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