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公开(公告)号：US20110100687A1
公开(公告)日：2011-05-05
申请号：US12710926
申请日：2010-02-23
申请人： Tae Ki Hong , Dong Guk Jo , Han Mo Koo , Jun Young Lim , Ki Tae Park , Sang Ki Cho , Dae Sung Yoo , Nak Ho Song , Joo Chul Kim , Jae Sung Jo
发明人： Tae Ki Hong , Dong Guk Jo , Han Mo Koo , Jun Young Lim , Ki Tae Park , Sang Ki Cho , Dae Sung Yoo , Nak Ho Song , Joo Chul Kim , Jae Sung Jo
CPC分类号： H01L24/50 , H01L23/49838 , H01L23/4985 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/37001 , H05K1/11 , Y10T29/49155 , H01L2924/00
摘要： The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a wiring pattern and a metal plating layer formed on a base film comprises a transfer area including a row of sprocket holes arranged along the edges of the base film at predetermined intervals, and wherein the transfer area includes an exposure area from which the base film is exposed, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.
摘要翻译： 本发明涉及一种用于TAB封装的载带及其制造方法，其中包括布线图案和形成在基膜上的金属镀层的TAB带包括传送区域，其包括沿着边缘布置的一排链轮孔 并且其中转印区域包括暴露于基膜的曝光区域，使得本发明具有如下优点：在链轮的一部分处不存在Cu层或金属层 在驱动IC和芯片/驱动IC和面板之间的组装工作期间由驱动辊产生摩擦的孔，以省去诸如Cu颗粒的异物的产生，从而提高产品的可靠性。
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公开(公告)号：US08791370B2
公开(公告)日：2014-07-29
申请号：US12710926
申请日：2010-02-23
申请人： Tae Ki Hong , Dong Guk Jo , Han Mo Koo , Jun Young Lim , Ki Tae Park , Sang Ki Cho , Dae Sung Yoo , Nak Ho Song , Joo Chul Kim , Jae Sung Jo
发明人： Tae Ki Hong , Dong Guk Jo , Han Mo Koo , Jun Young Lim , Ki Tae Park , Sang Ki Cho , Dae Sung Yoo , Nak Ho Song , Joo Chul Kim , Jae Sung Jo
CPC分类号： H01L24/50 , H01L23/49838 , H01L23/4985 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/181 , H01L2924/3025 , H01L2924/37001 , H05K1/11 , Y10T29/49155 , H01L2924/00
摘要： The present invention relates to a carrier tape for TAB-package and a manufacturing method thereof, wherein a TAB tape including a wiring pattern and a metal plating layer formed on a base film comprises a transfer area including a row of sprocket holes arranged along the edges of the base film at predetermined intervals, and wherein the transfer area includes an exposure area from which the base film is exposed, such that the present invention has an advantageous effect in that no Cu layer or a metal layer exists at a portion of the sprocket holes from which friction is generated by a driving roller during assembly work between a drive IC and chips/drive IC and panel to dispense with generation of foreign objects such as Cu particles, thereby enhancing reliability of the product.
摘要翻译： 本发明涉及一种用于TAB封装的载带及其制造方法，其中包括布线图案和形成在基膜上的金属镀层的TAB带包括传送区域，其包括沿着边缘布置的一排链轮孔 并且其中转印区域包括暴露于基膜的曝光区域，使得本发明具有如下优点：在链轮的一部分处不存在Cu层或金属层 在驱动IC和芯片/驱动IC和面板之间的组装工作期间由驱动辊产生摩擦的孔，以省去诸如Cu颗粒的异物的产生，从而提高产品的可靠性。
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