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公开(公告)号：US20120230136A1
公开(公告)日：2012-09-13
申请号：US13042881
申请日：2011-03-08
申请人： Kevin William Gorman , John Robert Goss , Michael Richard Ouellette , Troy Joseph Perry , Michael Anthony Ziegerhofer
发明人： Kevin William Gorman , John Robert Goss , Michael Richard Ouellette , Troy Joseph Perry , Michael Anthony Ziegerhofer
IPC分类号： G11C29/00
CPC分类号： G11C29/4401 , G11C29/76 , G11C29/802 , G11C2029/0401 , G11C2229/726
摘要： The present invention relates to a method and circuit for selectively repairing an embedded memory module having memory elements in an integrated circuit chip. The method comprises performing a plurality of tests on the embedded memory module under operating conditions to identify a plurality of non-operational memory elements in the embedded memory module and, in response to identifying the non-operational memory elements, generating a plurality of corresponding repair solutions. The method further comprises storing the plurality of corresponding repair solutions in a non-volatile storage element and determining from a mask a subset of the plurality of repair solutions that should be restored.
摘要翻译： 本发明涉及一种用于选择性地修复在集成电路芯片中具有存储元件的嵌入式存储器模块的方法和电路。 该方法包括在操作条件下对嵌入式存储器模块执行多个测试以识别嵌入式存储器模块中的多个非操作存储器元件，并且响应于识别非操作存储器元件，生成多个相应的修复 解决方案 该方法还包括将多个对应的修复解决方案存储在非易失性存储元件中，并从掩模确定应该被恢复的多个修复解决方案的子集。
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公开(公告)号：US08570820B2
公开(公告)日：2013-10-29
申请号：US13042881
申请日：2011-03-08
申请人： Kevin William Gorman , John Robert Goss , Michael Richard Ouellette , Troy Joseph Perry , Michael Anthony Ziegerhofer
发明人： Kevin William Gorman , John Robert Goss , Michael Richard Ouellette , Troy Joseph Perry , Michael Anthony Ziegerhofer
IPC分类号： G11C7/10
CPC分类号： G11C29/4401 , G11C29/76 , G11C29/802 , G11C2029/0401 , G11C2229/726
摘要： The present invention relates to a method and circuit for selectively repairing an embedded memory module having memory elements in an integrated circuit chip. The method includes performing a plurality of tests on the embedded memory module under operating conditions to identify a plurality of non-operational memory elements in the embedded memory module and, in response to identifying the non-operational memory elements, generating a plurality of corresponding repair solutions. The method further includes storing the plurality of corresponding repair solutions in a non-volatile storage element and determining from a mask a subset of the plurality of repair solutions that should be restored.
摘要翻译： 本发明涉及一种用于选择性地修复在集成电路芯片中具有存储元件的嵌入式存储器模块的方法和电路。 该方法包括在操作条件下对嵌入式存储器模块执行多个测试以识别嵌入式存储器模块中的多个非操作存储器元件，并且响应于识别非操作存储器元件，生成多个相应的修复 解决方案 该方法还包括将多个相应的修复解决方案存储在非易失性存储元件中，并且从掩模确定应该被恢复的多个修复解决方案的子集。
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公开(公告)号：US20080148197A1
公开(公告)日：2008-06-19
申请号：US11611623
申请日：2006-12-15
IPC分类号： G06F17/50
CPC分类号： G06F17/5045 , G06F2217/10
摘要： A parametric-based design methodology interlocks the design of library elements used in a semiconductor product design with the testing protocol used for the resulting semiconductor products such that parametric assumptions made regarding library elements used in a semiconductor product design may be used to disposition products such as semiconductor chips incorporating a semiconductor product design. In particular, a parametric measurement element is incorporated into a product design along with one or more library elements, with the parametric measurement element used to test one or more parametric design points that are associated with the library elements when the product design is used in a manufactured product.
摘要翻译： 基于参数的设计方法将半导体产品设计中使用的库元素的设计与用于所得半导体产品的测试协议相互联系，使得关于半导体产品设计中使用的库元素的参数假设可用于配置诸如 采用半导体产品设计的半导体芯片。 特别地，将参数测量元素与一个或多个库元素一起并入产品设计中，其中参数测量元件用于测试当产品设计用于图形元素时与库元素相关联的一个或多个参数化设计点 制成品。
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公开(公告)号：US07487477B2
公开(公告)日：2009-02-03
申请号：US11611623
申请日：2006-12-15
CPC分类号： G06F17/5045 , G06F2217/10
摘要： A parametric-based design methodology interlocks the design of library elements used in a semiconductor product design with the testing protocol used for the resulting semiconductor products such that parametric assumptions made regarding library elements used in a semiconductor product design may be used to disposition products such as semiconductor chips incorporating a semiconductor product design. In particular, a parametric measurement element is incorporated into a product design along with one or more library elements, with the parametric measurement element used to test one or more parametric design points that are associated with the library elements when the product design is used in a manufactured product.
摘要翻译： 基于参数的设计方法将半导体产品设计中使用的库元素的设计与用于所得半导体产品的测试协议相互联系，使得关于半导体产品设计中使用的库元素的参数假设可用于配置诸如 采用半导体产品设计的半导体芯片。 特别地，将参数测量元素与一个或多个库元素一起并入产品设计中，其中参数测量元件用于测试当产品设计用于图形元素时与库元素相关联的一个或多个参数化设计点 制成品。
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