Abstract:
Methods, systems, and products are disclosed for terminating an application message subscription that include: receiving, by messaging middleware of a subscribing client device, application messages having one or more message topics on one or more message streams from one or more message transmitting devices; receiving, by the messaging middleware from a stream administration server, a subscription termination message specifying a particular message topic for application messages that the subscription client device is no longer authorized to receive; and ceasing, by the messaging middleware, to provide the received application messages having the particular message topic to an application on the subscribing client device, including providing the received application messages having other message topics to the application.
Abstract:
A system and method for wafer level global bitmap characterization include determining chip level defect data bitmaps from a semiconductor wafer, and consolidating the chip level defect data bitmaps into a global wafer level bitmap that characterizes substantially the entire wafer failure configuration. The global wafer level bitmap is then analyzed and compared with other global wafer level bitmaps to develop correlations thereamong and develop global wafer level bitmap definitions for conducting at least one of wafer-to-wafer, boat-to-boat, and lot-to-lot process analysis based upon the global wafer level bitmap definitions.
Abstract:
A method and apparatus for an integrated circuit on a semiconductor substrate having good metal contact points. A first polysilicon layer is formed onto the substrate, and is etched to provide contact regions to the substrate. An ONO layer is formed onto the first polysilicon layer. A second polysilicon layer is formed onto the ONO layer, and a metal silicide layer is formed onto the second polysilicon layer. The second polysilicon layer and the metal silicide layer are etched at particular locations in order to form contact regions to the first polysilicon layer and to the substrate. A selective layer is formed onto the second polysilicon layer, the selective layer being etch selective with respect to the first polysilicon layer. An interlayer dielectric is formed onto the selective layer. A first etching is performed to provide a contact path through the interlayer dielectric, and then a second etching is performed to provide a contact path through the selective layer. Based on these two contact paths, a contact point can be provided externally to the first polysilicon layer.
Abstract:
Methods, systems, and products for subscribing for application messages in a multicast messaging environment as disclosed that include: requesting, by a message receiving device, a stream administration server to initialize a message subscription for application messages from a message sending device; receiving, in the message receiving device from the stream administration server, a data communications endpoint of a multicast message stream from the message sending device; beginning to listen, by the message receiving device, for the application messages at the data communications endpoint; and notifying, by the message receiving device after beginning to listen for the application messages, the message sending device to publish the application messages at the data communications endpoint.
Abstract:
Methods, systems, and products for subscribing for application messages in a multicast messaging environment as disclosed that include: requesting, by a message receiving device, a stream administration server to initialize a message subscription for application messages from a message sending device; receiving, in the message receiving device from the stream administration server, a data communications endpoint of a multicast message stream from the message sending device; beginning to listen, by the message receiving device, for the application messages at the data communications endpoint; and notifying, by the message receiving device after beginning to listen for the application messages, the message sending device to publish the application messages at the data communications endpoint.
Abstract:
Methods, systems, and products are disclosed for application message subscription tracking in a high speed, low latency data communications environment that includes: receiving, by a stream administration server from a subscribing client device, a subscription initiation request, the subscription initiation request specifying a message topic, the message topic specifying application messages for transmission to the subscribing client device from a message transmitting device; brokering, by the stream administration server, establishment of a message stream that provides the application messages for the specified message topic from the message transmitting device to the subscribing client device; and updating, by the stream administration server, a client subscription repository for monitoring application message subscriptions in dependence upon the subscription initiation request.
Abstract:
A method for determination of tunnel oxide weakness is provided. A tunnel oxide layer is formed on a semiconductor wafer. At least one poly gate is formed on the tunnel oxide layer in a flash memory region of the semiconductor wafer. At least one poly island, which is substantially larger than the poly gate, is formed on the tunnel oxide layer in a voltage contrast cell region of the semiconductor wafer. The poly island and the tunnel oxide layer therebeneath form a voltage contrast tunnel oxide cell. A voltage contrast measurement is performed on the voltage contrast tunnel oxide cell. The voltage contrast measurement is then compared with prior such voltage contrast measurements on other such voltage contrast tunnel oxide cells. The tunnel oxide weakness of the tunnel oxide layer is then determined from the voltage contrast measurement comparisons.
Abstract:
For electrically determining the level of misalignment of floating gate structures closest to a gate stack bending point in an array of flash memory cells, a plurality of test flash memory cells are formed with each test flash memory cell having a respective floating gate structure designed to be disposed a respective displacement distance from a respective gate stack bending point. An erase operation is performed for each of the test flash memory cells by biasing the test flash memory cells with voltages from a plurality of voltage sources. Each of the test flash memory cells are then biased with test voltages from the plurality of voltage sources. A respective current meter then measures a respective amount of current flowing through each of the test flash memory cells when biased with the test voltages. The level of misalignment is determined depending on which of the test flash memory cells conducts a current level that is greater than a threshold current level when biased with the test voltages. The level of misalignment is approximately equal to a highest one of the respective displacement distance corresponding to one of the test flash memory cells that conducts a current level that is greater than the threshold current level.
Abstract:
An improved method for fabricating a NAND-type memory cell structure. The present invention forgoes providing a contact mask implantation process prior to deposition of a metal barrier layer, which is a typical order of processing the NAND-type memory cell. Instead, in the present invention, the metal barrier layer is deposited on a core area of the NAND-type memory cell prior to contact mask implantation. Thereafter, the contact mask implantation process is performed on the structure in a conventional manner.
Abstract:
A method and apparatus for an integrated circuit on a semiconductor substrate having good metal contact points. A first polysilicon layer is formed onto the substrate, and is etched to provide contact regions to the substrate. An ONO layer is formed onto the first polysilicon layer. A second polysilicon layer is formed onto the ONO layer, and a metal silicide layer is formed onto the second polysilicon layer. The second polysilicon layer and the metal silicide layer are etched at particular locations in order to form contact regions to the first polysilicon layer and to the substrate. A selective layer is formed onto the second polysilicon layer, the selective layer being etch selective with respect to the first polysilicon layer. An interlayer dielectric is formed onto the selective layer. A first etching is performed to provide a contact path through the interlayer dielectric, and then a second etching is performed to provide a contact path through the selective layer. Based on these two contact paths, a contact point can be provided externally to the first polysilicon layer.