公开(公告)号：US20070249733A1

公开(公告)日：2007-10-25

申请号：US11628234

申请日：2005-06-02

申请人： Eunhee Bae ,  Dongsin Lee ,  Jisuk Choi ,  Kyung-Ho Roh

发明人： Eunhee Bae ,  Dongsin Lee ,  Jisuk Choi ,  Kyung-Ho Roh

IPC分类号： C08J3/215

CPC分类号： C08J3/212 ,  C08J2305/00 ,  C08K3/22 ,  C08K3/26 ,  C08K3/30 ,  C08K3/32 ,  C08L5/08

摘要： The present invention relates to polymer beads having a water-insoluble inorganic compound encapsulated therein, and their preparation method and use. In the present invention, the water-insoluble inorganic compound which has limitations on its use because of the characteristic of precipitates in an aqueous solution is encapsulated in the polymer beads. This encapsulation provides an increase in the utility of the water-insoluble inorganic compound and at the same time, imparts the activity of the water-insoluble inorganic compound to the polymer, thus increasing the function of the polymer. Accordingly, the polymer beads having the water-insoluble inorganic compound encapsulated therein, which are prepared by the inventive method, can be advantageously used in various fields, including medical and electronic industries.

摘要翻译： 本发明涉及包封有水不溶性无机化合物的聚合物珠粒及其制备方法和用途。 在本发明中，由于水溶液中的析出物的特征，其使用限制的水不溶性无机化合物被包封在聚合物珠粒中。 这种封装提高了水不溶性无机化合物的用途，同时赋予了水不溶性无机化合物对聚合物的活性，从而增加了聚合物的功能。 因此，通过本发明的方法制备的具有包封在其中的水不溶性无机化合物的聚合物珠粒可以有利地用于各种领域，包括医疗和电子工业。