MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF
    1.
    发明申请
    MULTILAYER CERAMIC ELECTRONIC COMPONENT AND FABRICATION METHOD THEREOF 审中-公开
    多层陶瓷电子元件及其制造方法

    公开(公告)号:US20130258546A1

    公开(公告)日:2013-10-03

    申请号:US13827258

    申请日:2013-03-14

    CPC classification number: H01G4/12 H01G4/008 H01G4/2325 H01G4/30

    Abstract: There are provided a multilayer ceramic electronic component and a fabrication method thereof. The multilayer ceramic component includes a ceramic main body in which internal electrodes and dielectric layers are alternately laminated; external electrodes formed on outer surfaces of the ceramic main body; intermediate layers formed on the external electrodes and including one or more selected from the group consisting of nickel, copper, and a nickel-copper alloy; and plating layers formed on the intermediate layers, whereby infiltration of a plating solution can be prevented.

    Abstract translation: 提供了一种多层陶瓷电子部件及其制造方法。 多层陶瓷部件包括:内部电极和电介质层交替层叠的陶瓷主体; 形成在陶瓷主体的外表面上的外部电极; 形成在外部电极上的中间层,并且包括选自镍,铜和镍 - 铜合金中的一种或多种; 以及形成在中间层上的镀层,从而可以防止电镀液的渗透。

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