公开(公告)号：US20090291822A1

公开(公告)日：2009-11-26

申请号：US12165628

申请日：2008-06-30

Applicant: Jiin-Jyh Shyu ,  Chih-Hsien Yeh

Inventor： Jiin-Jyh Shyu ,  Chih-Hsien Yeh

IPC: C03C3/16

CPC classification number: C03C3/16 ,  C03C8/24 ,  C03C27/00

Abstract: A lead-free sealing material is provided, which contains a glass with a composition including 47.5-67.5 mole % SnO, 2.5-15 mole % MgO, and 30-40 mole % P2O5. The lead-free sealing material has excellent chemical durability, low melting temperature, and good flowability during heating. The lead-free material is particularly suitable to be used as a sealing material. The lead-free sealing material may additionally contain low-thermal-expansion powdered fillers to reduce the thermal expansion coefficient of the resulting sealing material.

Abstract translation: 提供了一种无铅密封材料，其包含具有47.5-67.5摩尔％SnO，2.5-15摩尔％MgO和30-40摩尔％P 2 O 5的组成的玻璃。 无铅密封材料具有优异的化学耐久性，低熔点温度，加热时流动性好。 无铅材料特别适合用作密封材料。 无铅密封材料还可以含有低热膨胀粉末填料，以降低所得密封材料的热膨胀系数。

公开(公告)号：US20110014423A1

公开(公告)日：2011-01-20

申请号：US12650927

申请日：2009-12-31

Applicant: Yu-Hsin YEH ,  Jiin-Jyh Shyu ,  Ren-Der Jean ,  Tzer-Shen Lin

Inventor： Yu-Hsin YEH ,  Jiin-Jyh Shyu ,  Ren-Der Jean ,  Tzer-Shen Lin

IPC: B32B3/00 ,  C04B35/10 ,  C04B35/14 ,  C03C14/00 ,  C03C10/14 ,  C03C10/02 ,  B32B18/00

CPC classification number: C04B35/481 ,  C04B2235/3206 ,  C04B2235/3208 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/3217 ,  C04B2235/3244 ,  C04B2235/3248 ,  C04B2235/3409 ,  C04B2235/3418 ,  C04B2235/3463 ,  C04B2235/36 ,  C04B2235/447 ,  C04B2235/77 ,  C04B2235/80 ,  C04B2235/9607 ,  Y10T428/24355

Abstract: A ceramic powder composition and an optoelectronic device substrate utilizing the ceramic powder composition are disclosed. The optoelectronic device substrate is formed by sintering a ceramic powder composition including 4 to 97 wt % (weight percent) of zircon, 0 to 60 wt % of silicon dioxide, and 0 to 80 wt % of alumina, wherein the sintered ceramic substrate includes first and second crystalline phases, the first crystalline phase is zircon, and the second crystalline phase is at least one of or a combination of alumina, silicon dioxide, and zirconia crystalline phases, furthermore, the second crystalline phase can also includes a mullite crystalline phase.

Abstract translation: 公开了陶瓷粉末组合物和利用该陶瓷粉末组合物的光电子器件衬底。 通过烧结含有4〜97重量％（重量％）的锆石，0〜60重量％的二氧化硅和0〜80重量％的氧化铝的陶瓷粉末组合物形成光电器件基板，其中烧结陶瓷基板包括第 和第二结晶相，第一结晶相是锆石，第二结晶相是氧化铝，二氧化硅和氧化锆结晶相中的至少一种或其组合，此外，第二结晶相也可以包括莫来石结晶相。

公开(公告)号：US07892996B2

公开(公告)日：2011-02-22

申请号：US12165628

申请日：2008-06-30

Applicant: Jiin-Jyh Shyu ,  Chih-Hsien Yeh

Inventor： Jiin-Jyh Shyu ,  Chih-Hsien Yeh

IPC: C03C8/24 ,  C03C3/16 ,  C03C3/19

CPC classification number: C03C3/16 ,  C03C8/24 ,  C03C27/00

Abstract: A lead-free sealing material is provided, which contains a glass with a composition including 47.5-67.5 mole % SnO, 2.5-15 mole % MgO, and 30-40 mole % P2O5. The lead-free sealing material has excellent chemical durability, low melting temperature, and good flowability during heating. The lead-free material is particularly suitable to be used as a sealing material. The lead-free sealing material may additionally contain low-thermal-expansion powdered fillers to reduce the thermal expansion coefficient of the resulting sealing material.

Abstract translation: 提供了一种无铅密封材料，其包含具有47.5-67.5摩尔％SnO，2.5-15摩尔％MgO和30-40摩尔％P 2 O 5的组成的玻璃。 无铅密封材料具有优异的化学耐久性，低熔点温度，加热时流动性好。 无铅材料特别适合用作密封材料。 无铅密封材料还可以含有低热膨胀粉末填料，以降低所得密封材料的热膨胀系数。