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公开(公告)号：US20130177730A1
公开(公告)日：2013-07-11
申请号：US13828729
申请日：2013-03-14
IPC分类号： C04B41/90
CPC分类号： C04B41/4505 , C04B41/90 , H01L41/0533 , H01L41/1876 , H01L41/23 , H01L41/338 , Y10T428/23 , Y10T428/232
摘要： A PZT (lead zirconate titanate) element including one or more outside surfaces including a layer of encapsulation and metallization material and the method of making the same including at least the steps of providing a wafer of ceramic material including a base and one or more walls defining one or more recesses in the wafer which are filled with an encapsulation material. The encapsulation material is then cured and a layer of metallization is applied to one or more of the outside surfaces of the wafer and encapsulation material. Cuts are then made through the layer of metallization and cured encapsulation material to divide the wafer into a plurality of individual and separate ceramic elements with one or more surfaces including a layer of metallization and encapsulation.
摘要翻译： 包括一个或多个外表面的PZT（锆钛酸铅）元件，包括一层封装和金属化材料，以及制造该PZT的方法至少包括提供包括基底和一个或多个壁的陶瓷材料晶片的步骤 晶片中的一个或多个凹陷，其填充有封装材料。 然后将封装材料固化，并将金属化层施加到晶片和封装材料的一个或多个外表面。 然后通过金属化层和固化的封装材料制成切割，以将晶片分成具有一个或多个包括金属化层和封装层的一个或多个表面的多个单独和分离的陶瓷元件。
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公开(公告)号：US20130177708A1
公开(公告)日：2013-07-11
申请号：US13828360
申请日：2013-03-14
IPC分类号： C04B41/45
CPC分类号： C04B41/4505 , C04B41/90 , H01L41/0533 , H01L41/1876 , H01L41/23 , H01L41/338 , Y10T428/23 , Y10T428/232
摘要： A PZT (lead zirconate titanate) element including one or more outside surfaces including a layer of encapsulation and metallization material and the method of making the same including at least the steps of providing a wafer of ceramic material including a base and one or more walls defining one or more recesses in the wafer which are filled with an encapsulation material. The encapsulation material is then cured and a layer of metallization is applied to one or more of the outside surfaces of the wafer and encapsulation material. Cuts are then made through the layer of metallization and cured encapsulation material to divide the wafer into a plurality of individual and separate ceramic elements with one or more surfaces including a layer of metallization and encapsulation.
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公开(公告)号：US08802196B2
公开(公告)日：2014-08-12
申请号：US13828360
申请日：2013-03-14
IPC分类号： B05D3/12
CPC分类号： C04B41/4505 , C04B41/90 , H01L41/0533 , H01L41/1876 , H01L41/23 , H01L41/338 , Y10T428/23 , Y10T428/232
摘要： A PZT (lead zirconate titanate) element including one or more outside surfaces including a layer of encapsulation and metallization material and the method of making the same including at least the steps of providing a wafer of ceramic material including a base and one or more walls defining one or more recesses in the wafer which are filled with an encapsulation material. The encapsulation material is then cured and a layer of metallization is applied to one or more of the outside surfaces of the wafer and encapsulation material. Cuts are then made through the layer of metallization and cured encapsulation material to divide the wafer into a plurality of individual and separate ceramic elements with one or more surfaces including a layer of metallization and encapsulation.
摘要翻译： 包括一个或多个外表面的PZT（锆钛酸铅）元件，包括一层封装和金属化材料，以及制造该PZT的方法至少包括提供包括基底和一个或多个壁的陶瓷材料晶片的步骤 晶片中的一个或多个凹陷，其填充有封装材料。 然后将封装材料固化，并将金属化层施加到晶片和封装材料的一个或多个外表面。 然后通过金属化层和固化的封装材料制成切割，以将晶片分成具有一个或多个包括金属化层和封装层的一个或多个表面的多个单独和分离的陶瓷元件。
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公开(公告)号：US08399059B2
公开(公告)日：2013-03-19
申请号：US12840464
申请日：2010-07-21
IPC分类号： B05D3/12
CPC分类号： C04B41/4505 , C04B41/90 , H01L41/0533 , H01L41/1876 , H01L41/23 , H01L41/338 , Y10T428/23 , Y10T428/232
摘要： A PZT (lead zirconate titanate) element including one or more outside surfaces including a layer of encapsulation and metallization material and the method of making the same including at least the steps of providing a wafer of ceramic material including a base and one or more walls defining one or more recesses in the wafer which are filled with an encapsulation material. The encapsulation material is then cured and a layer of metallization is applied to one or more of the outside surfaces of the wafer and encapsulation material. Cuts are then made through the layer of metallization and cured encapsulation material to divide the wafer into a plurality of individual and separate ceramic elements with one or more surfaces including a layer of metallization and encapsulation.
摘要翻译： 包括一个或多个外表面的PZT（锆钛酸铅）元件，包括一层封装和金属化材料，以及制造该PZT的方法至少包括提供包括基底和一个或多个壁的陶瓷材料晶片的步骤 晶片中的一个或多个凹陷，其填充有封装材料。 然后将封装材料固化，并将金属化层施加到晶片和封装材料的一个或多个外表面。 然后通过金属化层和固化的封装材料制成切割，以将晶片分成具有一个或多个包括金属化层和封装层的一个或多个表面的多个单独和分离的陶瓷元件。
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公开(公告)号：US20110020585A1
公开(公告)日：2011-01-27
申请号：US12840464
申请日：2010-07-21
CPC分类号： C04B41/4505 , C04B41/90 , H01L41/0533 , H01L41/1876 , H01L41/23 , H01L41/338 , Y10T428/23 , Y10T428/232
摘要： A PZT (lead zirconate titanate) element including one or more outside surfaces including a layer of encapsulation and metallization material and the method of making the same including at least the steps of providing a wafer of ceramic material including a base and one or more walls defining one or more recesses in the wafer which are filled with an encapsulation material. The encapsulation material is then cured and a layer of metallization is applied to one or more of the outside surfaces of the wafer and encapsulation material. Cuts are then made through the layer of metallization and cured encapsulation material to divide the wafer into a plurality of individual and separate ceramic elements with one or more surfaces including a layer of metallization and encapsulation.
摘要翻译： 包括一个或多个外表面的PZT（锆钛酸铅）元件，包括一层封装和金属化材料，以及制造该PZT的方法至少包括提供包括基底和一个或多个壁的陶瓷材料晶片的步骤 晶片中的一个或多个凹陷，其填充有封装材料。 然后将封装材料固化，并将金属化层施加到晶片和封装材料的一个或多个外表面。 然后通过金属化层和固化的封装材料制成切割，以将晶片分成具有一个或多个包括金属化层和封装层的一个或多个表面的多个单独和分离的陶瓷元件。
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