知搜-全球专利检索

  1. 登录
  2. 注册

搜索结果

8 条记录 (耗时 0.013 秒)

    Tape removal in semiconductor structure fabrication
    3.
    发明授权
    Tape removal in semiconductor structure fabrication 失效
    半导体结构制造中的磁带去除

    公开(公告)号：US07572739B2

    公开(公告)日：2009-08-11

    申请号：US10905914

    申请日：2005-01-26

    申请人： Steven R. Codding ,  Timothy C Krywanczyk ,  Steven G. Perrotte ,  Jason P. Ritter

    发明人： Steven R. Codding ,  Timothy C Krywanczyk ,  Steven G. Perrotte ,  Jason P. Ritter

    IPC分类号： H01L21/302 ,  H01L21/461

    CPC分类号： H01L21/6835 ,  H01L2221/6834 ,  H01L2924/19041

    摘要： A semiconductor structure fabrication method for removing a tape physically attached to a device side of the semiconductor substrate by an adhesive layer of the tape, wherein the adhesive layer comprises an adhesive material. The method includes the step of submerging the tape in a liquid chemical comprising monoethanolamine or an alkanolamine for a pre-specified period of time sufficient to allow for a separation of the tape from the semiconductor substrate without damaging devices on the semiconductor substrate.

    摘要翻译： 一种半导体结构制造方法，用于通过所述带的粘合剂层去除物理地附接到所述半导体衬底的器件侧的带，其中所述粘合剂层包括粘合剂材料。 该方法包括将胶带浸入包含单乙醇胺或链烷醇胺的液体化学品中的步骤，其预定时间足以允许胶带从半导体衬底上分离而不损坏半导体衬底上的装置。

    PRESSURIZED OXYGEN FOR EVALUATION OF MOLDING COMPOUND STABILITY IN SEMICONDUCTOR PACKAGING
    4.
    发明申请
    PRESSURIZED OXYGEN FOR EVALUATION OF MOLDING COMPOUND STABILITY IN SEMICONDUCTOR PACKAGING 审中-公开
    用于评估半导体封装中模塑复合稳定性的加压氧化

    公开(公告)号：US20090064763A1

    公开(公告)日：2009-03-12

    申请号：US12175703

    申请日：2008-07-18

    申请人： Joseph K. V. Comeau ,  Adele M. Mahoney ,  Jason P. Ritter ,  Gerald J. Scilla ,  Charles H. Wilson

    发明人： Joseph K. V. Comeau ,  Adele M. Mahoney ,  Jason P. Ritter ,  Gerald J. Scilla ,  Charles H. Wilson

    IPC分类号： G01M19/00

    CPC分类号： G01N27/205 ,  Y10T436/16 ,  Y10T436/20

    摘要： A test environment and an associated method of testing and analyzing a semiconductor package material containing a molding compound, for stability in a sustained oxygen environment. Test samples are exposed to a pressurized gas containing oxygen, under elevated temperature below the glass transition temperature of the molding compound. Control samples are exposed to a pressurized inert gas under similar or more severe conditions of gas pressure, temperature, and humidity. At least one characteristic common to the test samples and the control samples is measured. A determination is made as to whether there exists at least one significant difference between the at least one measured characteristic of the test samples and the control samples.

    摘要翻译： 用于测试和分析含有模塑料的半导体封装材料的测试环境和相关方法，用于在持续的氧气环境中稳定。 在低于模塑料的玻璃化转变温度的高温下，将测试样品暴露于含氧气的加压气体中。 在气体压力，温度和湿度的类似或更严格的条件下，对照样品暴露于加压惰性气体。 测量样品和对照样品的至少一个特征。 确定测试样品的至少一个测量特征与对照样品之间是否存在至少一个显着差异。

    Pressurized oxygen for evaluation of molding compound stability in semiconductor packaging
    5.
    发明授权
    Pressurized oxygen for evaluation of molding compound stability in semiconductor packaging 有权
    加压氧气用于评估半导体封装中的化合物稳定性

    公开(公告)号：US07300796B2

    公开(公告)日：2007-11-27

    申请号：US10658859

    申请日：2003-09-09

    申请人： Joseph K. V. Comeau ,  Adele M. Mahoney ,  Jason P. Ritter ,  Gerald J. Scilla ,  Charles H. Wilson

    发明人： Joseph K. V. Comeau ,  Adele M. Mahoney ,  Jason P. Ritter ,  Gerald J. Scilla ,  Charles H. Wilson

    IPC分类号： G01N31/00

    CPC分类号： G01N27/205 ,  Y10T436/16 ,  Y10T436/20

    摘要： A test environment and an associated method of testing and analyzing a semiconductor package material containing a molding compound, for stability in a sustained oxygen environment. Test samples are exposed to a pressurized gas containing oxygen, under elevated temperature below the glass transition temperature of the molding compound. Control samples are exposed to a pressurized inert gas under similar or more severe conditions of gas pressure, temperature, and humidity. At least one characteristic common to the test samples and the control samples is measured. A determination is made as to whether there exists at least one significant difference between the at least one measured characteristic of the test samples and the control samples.

    摘要翻译： 用于测试和分析含有模塑料的半导体封装材料的测试环境和相关方法，用于在持续的氧气环境中稳定。 在低于模塑料的玻璃化转变温度的高温下，将测试样品暴露于含氧气的加压气体中。 在气体压力，温度和湿度的类似或更严格的条件下，对照样品暴露于加压惰性气体。 测量样品和对照样品的至少一个特征。 确定测试样品的至少一个测量特征与对照样品之间是否存在至少一个显着差异。

    Pressurized oxygen for evaluation of molding compound stability in semiconductor packaging
    7.
    发明授权
    Pressurized oxygen for evaluation of molding compound stability in semiconductor packaging 失效
    加压氧气用于评估半导体封装中的化合物稳定性

    公开(公告)号：US07442552B2

    公开(公告)日：2008-10-28

    申请号：US11861369

    申请日：2007-09-26

    申请人： Joseph K. V. Comeau ,  Adele M. Mahoney ,  Jason P. Ritter ,  Gerald J. Scilla ,  Charles H. Wilson

    发明人： Joseph K. V. Comeau ,  Adele M. Mahoney ,  Jason P. Ritter ,  Gerald J. Scilla ,  Charles H. Wilson

    IPC分类号： G01N31/00

    CPC分类号： G01N27/205 ,  Y10T436/16 ,  Y10T436/20

    摘要： A test environment and an associated method of testing and analyzing a semiconductor package material containing a molding compound, for stability in a sustained oxygen environment. Test samples are exposed to a pressurized gas containing oxygen, under elevated temperature below the glass transition temperature of the molding compound. Control samples are exposed to a pressurized inert gas under similar or more severe conditions of gas pressure, temperature, and humidity. At least one characteristic common to the test samples and the control samples is measured. A determination is made as to whether there exists at least one significant difference between the at least one measured characteristic of the test samples and the control samples.

    摘要翻译： 用于测试和分析含有模塑料的半导体封装材料的测试环境和相关方法，用于在持续的氧气环境中稳定。 在低于模塑料的玻璃化转变温度的高温下，将测试样品暴露于含氧气的加压气体中。 在气体压力，温度和湿度的类似或更严格的条件下，对照样品暴露于加压惰性气体。 测量样品和对照样品的至少一个特征。 确定测试样品的至少一个测量特征与对照样品之间是否存在至少一个显着差异。