公开(公告)号：US20190383528A1

公开(公告)日：2019-12-19

申请号：US16457229

申请日：2019-06-28

申请人： Gavin Sung ,  Gerry Juan ,  Harish Jagadish ,  Ivan By Wang ,  Jason Y. Jiang ,  Sammi Wy Liu ,  Tim Liu ,  Jeff Ku

发明人： Gavin Sung ,  Gerry Juan ,  Harish Jagadish ,  Ivan By Wang ,  Jason Y. Jiang ,  Sammi Wy Liu ,  Tim Liu ,  Jeff Ku

IPC分类号： F25B21/02 ,  F25B25/00 ,  F25B9/00

摘要： Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC), and a heat pipe. The heat pipe can couple the heat source to the heat sink and to the TEC and transfer heat from the heat source to the heat sink and to the TEC.