公开(公告)号：US20120216167A1

公开(公告)日：2012-08-23

申请号：US13504374

申请日：2010-10-27

Applicant: Chen-Feng Chang ,  Chin-Fang Shen ,  Hsien-Shih Chiu ,  I-Jye Lin ,  Tien-Chang Hsu ,  Yao-Wen Chang ,  Chun-Wei Lin ,  Po-Wei Lee

Inventor： Chen-Feng Chang ,  Chin-Fang Shen ,  Hsien-Shih Chiu ,  I-Jye Lin ,  Tien-Chang Hsu ,  Yao-Wen Chang ,  Chun-Wei Lin ,  Po-Wei Lee

IPC: G06F17/50

CPC classification number: G06F17/5077 ,  H01L23/525 ,  H01L24/02 ,  H01L24/14 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/14131 ,  H01L2224/14136 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311

Abstract: Disclosed herein are rouging methods and devices for a flip-chip package. The flip chip includes several outer pads and several inner pads. The routing method includes: setting an outer sequence based on the arrangement order of the outer pads; setting several inner sequences based on the connection relationships between inner pads and the outer pads; calculating the longest common subsequence of each inner sequence and the outer sequence, defining the connection relationships between the inner pads and the outer pads corresponding to the longest common subsequence as direct connections, and defining the connection relationships between the inner pads and the outer pads that do not correspond to the longest common subsequence as detour connections; establishing the routing scheme of the flip chip based on the connection relationships between the inner pads and the outer pads.

Abstract translation: 这里公开了用于倒装芯片封装的粗化方法和装置。 倒装芯片包括几个外部焊盘和几个内部焊盘。 路由方法包括：基于外部焊盘的布置顺序设置外部序列; 基于内垫和外垫之间的连接关系设置几个内序列; 计算每个内部序列和外部序列的最长公共子序列，将内部焊盘和对应于最长公共子序列的外部焊盘之间的连接关系定义为直接连接，并且限定内部焊盘和外部焊盘之间的连接关系， 不符合迂回连线最长的共同后果; 基于内部焊盘和外部焊盘之间的连接关系建立倒装芯片的布线方案。

公开(公告)号：US08578317B2

公开(公告)日：2013-11-05

申请号：US13504374

申请日：2010-10-27

Applicant: Chen-Feng Chang ,  Chin-Fang Shen ,  Hsien-Shih Chiu ,  I-Jye Lin ,  Tien-Chang Hsu ,  Yao-Wen Chang ,  Chun-Wei Lin ,  Po-Wei Lee

Inventor： Chen-Feng Chang ,  Chin-Fang Shen ,  Hsien-Shih Chiu ,  I-Jye Lin ,  Tien-Chang Hsu ,  Yao-Wen Chang ,  Chun-Wei Lin ,  Po-Wei Lee

IPC: G06F17/50

CPC classification number: G06F17/5077 ,  H01L23/525 ,  H01L24/02 ,  H01L24/14 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/14131 ,  H01L2224/14136 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311

Abstract: Disclosed herein are rouging methods and devices for a flip-chip package. The flip chip includes several outer pads and several inner pads. The routing method includes: setting an outer sequence based on the arrangement order of the outer pads; setting several inner sequences based on the connection relationships between inner pads and the outer pads; calculating the longest common subsequence of each inner sequence and the outer sequence, defining the connection relationships between the inner pads and the outer pads corresponding to the longest common subsequence as direct connections, and defining the connection relationships between the inner pads and the outer pads that do not correspond to the longest common subsequence as detour connections; establishing the routing scheme of the flip chip based on the connection relationships between the inner pads and the outer pads.

Abstract translation: 这里公开了用于倒装芯片封装的粗化方法和装置。 倒装芯片包括几个外部焊盘和几个内部焊盘。 路由方法包括：基于外部焊盘的布置顺序设置外部序列; 基于内垫和外垫之间的连接关系设置几个内序列; 计算每个内部序列和外部序列的最长公共子序列，将内部焊盘和对应于最长公共子序列的外部焊盘之间的连接关系定义为直接连接，并且限定内部焊盘和外部焊盘之间的连接关系， 不符合迂回连线最长的共同后果; 基于内部焊盘和外部焊盘之间的连接关系建立倒装芯片的布线方案。