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    Segmented cold plate for rapid thermal processing (RTP) tool for conduction cooling
    3.
    发明授权
    Segmented cold plate for rapid thermal processing (RTP) tool for conduction cooling 失效
    用于快速热处理（RTP）的分段冷板用于传导冷却

    公开(公告)号：US06783630B2

    公开(公告)日：2004-08-31

    申请号：US10228788

    申请日：2002-08-27

    申请人： Ali Shajii ,  David Tao ,  Mathias Koch ,  Douglas Brown ,  Hossein Zarrin

    发明人： Ali Shajii ,  David Tao ,  Mathias Koch ,  Douglas Brown ,  Hossein Zarrin

    IPC分类号： H01L2100

    CPC分类号： C23C16/463 ,  C23C16/52 ,  H01L21/67109

    摘要： The present invention is directed to a semiconductor thermal processing system and an apparatus for thermally cooling a semiconductor substrate. According to one aspect of the present invention, a semiconductor thermal processing system and associated apparatus and method are disclosed which provides a segmented cold plate situated within a process chamber, wherein a plurality of segments of the cold plate are operable to radially translate between an engaged position and a disengaged position, wherein a substrate holder may pass between the plurality of segments when the segments are in the disengaged position. According to another aspect, an elevator is operable to linearly translate a substrate residing on a substrate holder between a heating position proximate to a heater assembly and a cooling position proximate to the segmented cold plate. According to another aspect, the cold plate comprises a plurality of holes through which one or more gases may flow, wherein an amount or mixture of the one or more gases is controllable via a controller, and wherein one or more temperature sensors are operable to provide temperature feedback at the substrate. According to another aspect the substrate resides within close proximity to the cold plate, wherein when gas is flowed through the holes, the substrate is cooled in the viscous regime, and the amount and/or mixture of gases flowed through the holes is controlled, based, at least in part, on the one or more measured temperatures.

    摘要翻译： 本发明涉及半导体热处理系统和用于热冷却半导体衬底的装置。 根据本发明的一个方面，公开了一种半导体热处理系统及相关设备和方法，其提供位于处理室内的分段冷板，其中冷板的多个段可操作以在啮合 位置和脱离位置，其中当所述段处于分离位置时，衬底保持器可以在所述多个段之间通过。 根据另一方面，电梯可操作以将位于基板保持器上的基板线性平移在靠近加热器组件的加热位置和靠近分段冷板的冷却位置之间。 根据另一方面，冷板包括一个或多个气体可流过的多个孔，其中一个或多个气体的量或混合物可经由控制器控制，并且其中一个或多个温度传感器可操作以提供 衬底温度反馈。 根据另一方面，衬底位于紧邻冷板的位置，其中当气体流过孔时，衬底在粘性状态下被冷却，并且基于孔流动的气体的量和/或混合物被基于 ，至少部分地基于一个或多个测量的温度。

    MULTI-ZONE PRESSURE CONTROL SYSTEM
    6.
    发明申请
    MULTI-ZONE PRESSURE CONTROL SYSTEM 审中-公开
    多区域压力控制系统

    公开(公告)号：US20090137192A1

    公开(公告)日：2009-05-28

    申请号：US11946388

    申请日：2007-11-28

    申请人： Hossein Zarrin ,  Gordon Hill ,  Anil Mavanur

    发明人： Hossein Zarrin ,  Gordon Hill ,  Anil Mavanur

    IPC分类号： B24B7/00

    CPC分类号： G05D16/206 ,  Y10T137/86493

    摘要： A pressure control system that controls the pressure of a fluid in a plurality of zones includes a distribution manifold, at least one main manifold connected to the distribution manifold, and at least one disposable manifold connected to the distribution manifold and the main manifold. The disposable manifold is adapted to be replaced independent of the distribution manifold and the main manifold, and is connected to each zone and to at least one vacuum source. The distribution manifold distributes the fluid to the plurality of zones, so as to cause flow of the fluid into and out of a measurement chamber located within each zone. The main manifold includes, for each zone, a pressure sensor configured to measure pressure in the measurement chamber in that zone, and a control valve configured to regulate the flow of the fluid through that zone.

    摘要翻译： 控制多个区域中的流体压力的压力控制系统包括分配歧管，连接到分配歧管的至少一个主歧管以及连接到分配歧管和主歧管的至少一个一次性歧管。 一次性歧管适于独立于分配歧管和主歧管而被替换，并且连接到每个区域和至少一个真空源。 分配歧管将流体分配到多个区域，以使流体流入和流出位于每个区域内的测量室。 主歧管包括对于每个区域，配置成测量该区域中的测量室中的压力的​​压力传感器，以及配置成调节通过该区域的流体流动的控制阀。

    Segmented cold plate for rapid thermal processing (RTP) tool for conduction cooling
    7.
    发明授权
    Segmented cold plate for rapid thermal processing (RTP) tool for conduction cooling 失效
    用于快速热处理（RTP）的分段冷板用于传导冷却

    公开(公告)号：US07166187B2

    公开(公告)日：2007-01-23

    申请号：US10879463

    申请日：2004-06-29

    申请人： Ali Shajii ,  David Tao ,  Mathias Koch ,  Douglas Brown ,  Hossein Zarrin

    发明人： Ali Shajii ,  David Tao ,  Mathias Koch ,  Douglas Brown ,  Hossein Zarrin

    IPC分类号： H01L21/00 ,  C23C16/00

    CPC分类号： C23C16/463 ,  C23C16/52 ,  H01L21/67109

    摘要： The present invention is directed to a semiconductor thermal processing system and an apparatus for thermally cooling a semiconductor substrate. According to one aspect of the present invention, a semiconductor thermal processing system and associated apparatus and method are disclosed which provides a segmented cold plate situated within a process chamber, wherein a plurality of segments of the cold plate are operable to radially translate between an engaged position and a disengaged position, wherein a substrate holder may pass between the plurality of segments when the segments are in the disengaged position. According to another aspect, an elevator is operable to linearly translate a substrate residing on a substrate holder between a heating position proximate to a heater assembly and a cooling position proximate to the segmented cold plate. According to another aspect, the cold plate comprises a plurality of holes through which one or more gases may flow, wherein an amount or mixture of the one or more gases is controllable via a controller, and wherein one or more temperature sensors are operable to provide temperature feedback at the substrate. According to another aspect the substrate resides within close proximity to the cold plate, wherein when gas is flowed through the holes, the substrate is cooled in the viscous regime, and the amount and/or mixture of gases flowed through the holes is controlled, based, at least in part, on the one or more measured temperatures.

    摘要翻译： 本发明涉及半导体热处理系统和用于热冷却半导体衬底的装置。 根据本发明的一个方面，公开了一种半导体热处理系统及相关设备和方法，其提供位于处理室内的分段冷板，其中冷板的多个段可操作以在啮合 位置和脱离位置，其中当所述段处于分离位置时，衬底保持器可以在所述多个段之间通过。 根据另一方面，电梯可操作以将位于基板保持器上的基板线性平移在靠近加热器组件的加热位置和靠近分段冷板的冷却位置之间。 根据另一方面，冷板包括一个或多个气体可流过的多个孔，其中一个或多个气体的量或混合物可经由控制器控制，并且其中一个或多个温度传感器可操作以提供 衬底温度反馈。 根据另一方面，衬底位于紧邻冷板的位置，其中当气体流过孔时，衬底在粘性状态下被冷却，并且基于孔流动的气体的量和/或混合物被基于 ，至少部分地基于一个或多个测量的温度。

    Segmented cold plate for rapid thermal processing (RTP) tool for conduction cooling
    8.
    发明申请
    Segmented cold plate for rapid thermal processing (RTP) tool for conduction cooling 失效
    用于快速热处理（RTP）的分段冷板用于传导冷却

    公开(公告)号：US20050026447A1

    公开(公告)日：2005-02-03

    申请号：US10879463

    申请日：2004-06-29

    申请人： Ali Shajii ,  David Tao ,  Mathias Koch ,  Douglas Brown ,  Hossein Zarrin

    发明人： Ali Shajii ,  David Tao ,  Mathias Koch ,  Douglas Brown ,  Hossein Zarrin

    IPC分类号： C23C16/52 ,  H01L21/00 ,  H01L21/302 ,  H01L21/461

    CPC分类号： C23C16/463 ,  C23C16/52 ,  H01L21/67109

    摘要： The present invention is directed to a semiconductor thermal processing system and an apparatus for thermally cooling a semiconductor substrate. According to one aspect of the present invention, a semiconductor thermal processing system and associated apparatus and method are disclosed which provides a segmented cold plate situated within a process chamber, wherein a plurality of segments of the cold plate are operable to radially translate between an engaged position and a disengaged position, wherein a substrate holder may pass between the plurality of segments when the segments are in the disengaged position. According to another aspect, an elevator is operable to linearly translate a substrate residing on a substrate holder between a heating position proximate to a heater assembly and a cooling position proximate to the segmented cold plate. According to another aspect, the cold plate comprises a plurality of holes through which one or more gases may flow, wherein an amount or mixture of the one or more gases is controllable via a controller, and wherein one or more temperature sensors are operable to provide temperature feedback at the substrate. According to another aspect the substrate resides within close proximity to the cold plate, wherein when gas is flowed through the holes, the substrate is cooled in the viscous regime, and the amount and/or mixture of gases flowed through the holes is controlled, based, at least in part, on the one or more measured temperatures.

    摘要翻译： 本发明涉及半导体热处理系统和用于热冷却半导体衬底的装置。 根据本发明的一个方面，公开了一种半导体热处理系统及相关设备和方法，其提供位于处理室内的分段冷板，其中冷板的多个段可操作以在啮合 位置和脱离位置，其中当所述段处于分离位置时，衬底保持器可以在所述多个段之间通过。 根据另一方面，电梯可操作以将位于基板保持器上的基板线性平移在靠近加热器组件的加热位置和靠近分段冷板的冷却位置之间。 根据另一方面，冷板包括一个或多个气体可流过的多个孔，其中一个或多个气体的量或混合物可经由控制器控制，并且其中一个或多个温度传感器可操作以提供 衬底温度反馈。 根据另一方面，衬底位于紧邻冷板的位置，其中当气体流过孔时，衬底在粘性状态下被冷却，并且基于孔流动的气体的量和/或混合物被基于 ，至少部分地基于一个或多个测量的温度。