摘要:
Disclosed is an image sensor that includes a pixel array including a plurality of unit pixels in a matrix having rows and columns, a binning sampling unit configured to (i) amplify with different gains signals from unit pixels selected from the unit pixels in each of the columns, and (ii) output a binning sampling signal according to an average of the amplified signals, and an analog-to-digital converter configured to convert the binning sampling signal to a digital signal.
摘要:
Disclosed is an image sensor that includes a pixel array including a plurality of unit pixels in a matrix having rows and columns, a binning sampling unit configured to (i) amplify with different gains signals from unit pixels selected from the unit pixels in each of the columns, and (ii) output a binning sampling signal according to an average of the amplified signals, and an analog-to-digital converter configured to convert the binning sampling signal to a digital signal.
摘要:
An image sensor is provided. The image sensor comprises a readout circuitry, a first image sensing device, an interconnection, and a second image sensing device. The readout circuitry is disposed in a first substrate. The first image sensing device is disposed at one side of the readout circuitry of the first substrate. The interconnection is disposed over the first substrate and electrically connected to the readout circuitry. The second image sensing device is disposed over the interconnection.
摘要:
A method for manufacturing a CMOS image sensor that independently forms a poly routing line connected to a gate poly of a reset transistor is provided. In an embodiment, a semiconductor substrate is prepared defining a device isolation region and an active region. Subsequently, a plurality of gate polys are formed on a predetermined portion of the active region. A photodiode is formed in a portion of the semiconductor substrate located at one side of one of the plurality of gate polys. After an oxide layer is deposited on the semiconductor substrate including the gate polys, the oxide layer is selectively removed to form oxide layer patterns for exposing a portion of the plurality of gate polys. After a polysilicon layer is deposited on the oxide layer pattern, the polysilicon layer is selectively removed to form a routing line connected to the portion of the plurality of gate polys.
摘要:
A method for fabricating a CMOS image sensor may include forming an isolation layer defining an active area on a semiconductor substrate, forming first and second gate electrodes in the transistor area of the semiconductor substrate, forming a photodiode area in the semiconductor substrate at a first side of the first gate electrode, forming an oxide layer over the photodiode area, the oxide layer having a thickness greater than that of the dielectric layer, forming a source/drain extension area in the semiconductor substrate at a second side of the second gate electrode and between the first and second gate electrodes, forming source/drain regions in the transistor area of the semiconductor substrate by ion implantation through the dielectric layer, and forming a complementary ion implantation region in the photodiode area through the oxide layer.
摘要:
Embodiments relate to an image sensor and a method of manufacturing an image sensor. According to embodiments, an image sensor may include a first substrate, a photodiode, and an ion implantation isolation layer. According to embodiments, circuitry including a metal interconnection may be disposed over the first substrate. A photodiode may be provided in a crystalline semiconductor layer bonded to the first substrate, and electrically connected to the metal interconnection. The ion implantation isolation layer may be provided in the photodiode.
摘要:
A CMOS image sensor includes a semiconductor substrate with a first conductive type including a photodiode region and a transistor region, a gate electrode formed on the transistor region of the substrate, a first impurity region with a second conductive type formed in a portion of the semiconductor substrate between the photodiode region and the gate electrode, and a second impurity region with the second conductive type formed in the photodiode region of the semiconductor substrate.
摘要:
A method for fabricating a CMOS image sensor may include forming an isolation layer defining an active area on a semiconductor substrate, forming first and second gate electrodes in the transistor area of the semiconductor substrate, forming a photodiode area in the semiconductor substrate at a first side of the first gate electrode, forming an oxide layer over the photodiode area, the oxide layer having a thickness greater than that of the dielectric layer, forming a source/drain extension area in the semiconductor substrate at a second side of the second gate electrode and between the first and second gate electrodes, forming source/drain regions in the transistor area of the semiconductor substrate by ion implantation through the dielectric layer, and forming a complementary ion implantation region in the photodiode area through the oxide layer.
摘要:
A method of manufacturing a complementary metal oxide semiconductor (CMOS) image sensor is provided. The method can include the steps of: providing a semiconductor substrate having an active region and an isolation region defined thereon; forming a photodiode at a photodiode area of the active region; forming first and second gate polys on a transistor region of the active region; forming a floating diffusion region on the semiconductor substrate between the first and second gate polys for receiving electrons transferred from the photodiode; and forming a floating diffusion node region at a part of the floating diffusion region for forming a metal contact. The floating diffusion region can be formed independently of the floating diffusion node region, so that a junction leakage current generated from the floating diffusion node region can be controlled.
摘要:
Disclosed is an image sensor. The disclosed image sensor includes a pixel array including a plurality of unit pixels arranged in a matrix form having rows and columns, a binning sampling unit configured to output a binning sampling signal according to an average of signals from two or more unit pixels selected from among the unit pixels of each of the columns, and an analog-to-digital converter configured to convert the binning sampling signal to a digital signal. The selected unit pixels have different exposure times.