公开(公告)号：US07148080B2

公开(公告)日：2006-12-12

申请号：US10382591

申请日：2003-03-07

申请人： Pyoung Wan Kim ,  Sang Hyeop Lee ,  Chang Cheol Lee ,  Gun Ah Lee

发明人： Pyoung Wan Kim ,  Sang Hyeop Lee ,  Chang Cheol Lee ,  Gun Ah Lee

IPC分类号： H01L21/44

CPC分类号： H01L23/4951 ,  H01L23/49537 ,  H01L23/49558 ,  H01L23/49575 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/20753 ,  H01L2224/05599

摘要： A method for joining lead frames in a chip stack package or a package stack, a chip stack package, and a method of forming a chip stack package. A joining mediator is formed on joining portions of at least one lead frame. The joining mediator has an anti-oxidation property and an inter-metallic diffusion property, and may be formed of gold wires, gold bumps, gold bars, solder bumps, solder, or solder bars. By clamping or compressing the lead frames under heat and pressure, the joining mediator forms an inter-metallic joint layer that reliably interconnects the lead frames at the joining portions.

摘要翻译： 一种用于连接芯片堆叠封装或封装堆叠中的引线框架的方法，芯片堆叠封装以及形成芯片堆叠封装的方法。 连接介体形成在至少一个引线框架的接合部分上。 接合介体具有抗氧化性和金属间扩散性，并且可以由金线，金凸块，金条，焊料凸块，焊料或焊料条形成。 通过在加热和压力下夹紧或压缩引线框架，接合介体形成金属间接合层，可在连接部位可靠地将引线框架互连。