公开(公告)号：US20070200572A1

公开(公告)日：2007-08-30

申请号：US11355726

申请日：2006-02-16

Applicant: Ronald Breton ,  S. Chey ,  Steven Cordes ,  Matthew Farinelli ,  Michael Fregeau ,  Sherif Goma ,  Gene Patrick ,  Mohammed Shaikh

Inventor： Ronald Breton ,  S. Chey ,  Steven Cordes ,  Matthew Farinelli ,  Michael Fregeau ,  Sherif Goma ,  Gene Patrick ,  Mohammed Shaikh

IPC: G01R31/02

CPC classification number: G01R1/07378 ,  G01R31/2863

Abstract: An apparatus for testing integrated circuit devices includes a probe device having a plurality of probes, a first substrate comprising a product substrate having a first surface and an array of electrical contacts disposed on the first surface thereof, and a second substrate disposed between the probes and the first substrate for electrically coupling the probes to corresponding electrical contacts disposed on the first surface of the product substrate.

Abstract translation: 一种用于测试集成电路装置的装置包括具有多个探针的探针装置，第一基板包括具有第一表面的产品基板和设置在其第一表面上的电触点阵列，以及设置在探针和 用于将探针电耦合到布置在产品基板的第一表面上的相应的电触点的第一基板。

公开(公告)号：US06635184B1

公开(公告)日：2003-10-21

申请号：US09553691

申请日：2000-04-21

Applicant: Uri Cohen ,  Gene Patrick Bonnie

Inventor： Uri Cohen ,  Gene Patrick Bonnie

IPC: C23F100

CPC classification number: C04B41/009 ,  C04B41/5353 ,  C04B41/91 ,  C04B2111/00422 ,  G11B5/3103 ,  G11B5/3106 ,  G11B5/313 ,  G11B5/3133 ,  G11B5/3143 ,  G11B5/3163 ,  G11B5/40 ,  G11B19/04 ,  H01L21/00 ,  H01L2924/0002 ,  Y10T29/49046 ,  H01L2924/00

Abstract: A method for pattern-etching thick alumina layers in the manufacture of thin film heads (TFH) by using compatible metallic mask layers and a wet chemical etchant. The deep alumina etching facilitates a studless TFH device where the coil and bonding pads are deposited and patterned simultaneously, and vias are later etched through the alumina overcoat layer to expose the bonding pads. The method also enables the etching of scribe-line grooves of street and alleys across the wafer for sawing and machining of sliders. These grooves eliminate most alumina chipping due to stress and damage introduced by the sawing and machining operations. Similarly, pattern-etching of the alumina undercoat facilitates the formation of precise craters for recessed structures. These can improve planarity and alleviate problems related to adverse topography and elevated features of TFH devices.

Abstract translation: 通过使用相容的金属掩模层和湿化学蚀刻剂制造薄膜头（TFH）时的图案蚀刻厚氧化铝层的方法。 深氧化铝蚀刻有助于无螺纹TFH装置，其中线圈和焊盘被同时沉积和图案，并且通孔随后通过氧化铝外涂层蚀刻以暴露接合焊盘。 该方法还可以蚀刻跨越晶片的街道和小路的划线槽，用于锯切和加工滑块。 这些槽由于锯切和加工操作引起的应力和损坏而消除了大多数氧化铝碎屑。 类似地，氧化铝底涂层的图案蚀刻便于形成用于凹陷结构的精确凹坑。 这些可以改善平面性，并减轻与不利地形相关的问题，并提高TFH设备的特征。

公开(公告)号：US5820770A

公开(公告)日：1998-10-13

申请号：US502442

申请日：1995-07-13

Applicant: Uri Cohen ,  Gene Patrick Bonnie

Inventor： Uri Cohen ,  Gene Patrick Bonnie

IPC: C04B41/53 ,  C04B41/91 ,  G11B5/31 ,  G11B5/39 ,  G11B5/40 ,  G11B19/04 ,  H01L21/00 ,  H01L21/306 ,  H01L21/3213 ,  H01L43/12 ,  H05K3/06 ,  B44C1/22

CPC classification number: C04B41/009 ,  C04B41/5353 ,  C04B41/91 ,  G11B5/3103 ,  G11B5/3106 ,  G11B5/313 ,  G11B5/3133 ,  G11B5/3163 ,  G11B5/40 ,  H01L21/00 ,  C04B2111/00422 ,  G11B19/04 ,  G11B5/3143 ,  H01L2924/0002 ,  Y10T29/49046

Abstract: A method for pattern-etching thick alumina layers in the manufacture of thin film heads (TFH) by using compatible metallic mask layers and a wet chemical etchant. The deep alumina etching facilitates a studless TFH device where the coil and bonding pads are deposited and patterned simultaneously, and vias are later etched through the alumina overcoat layer to expose the bonding pads. The method also enables the etching of scribe-line grooves of street and alleys across the wafer for sawing and machining of sliders. These grooves eliminate most alumina chipping due to stress and damage introduced by the sawing and machining operations. Similarly, pattern-etching of the alumina undercoat facilitates the formation of precise craters for recessed structures. These can improve planarity and alleviate problems related to adverse topography and elevated features of TFH devices.

Abstract translation: 通过使用相容的金属掩模层和湿化学蚀刻剂制造薄膜头（TFH）时的图案蚀刻厚氧化铝层的方法。 深氧化铝蚀刻有助于无螺纹TFH装置，其中线圈和焊盘被同时沉积和图案，并且通孔随后通过氧化铝外涂层蚀刻以暴露接合焊盘。 该方法还可以蚀刻跨越晶片的街道和小路的划线槽，用于锯切和加工滑块。 这些槽由于锯切和加工操作引起的应力和损坏而消除了大多数氧化铝碎屑。 类似地，氧化铝底涂层的图案蚀刻便于形成用于凹陷结构的精确凹坑。 这些可以改善平面性，并减轻与不利地形相关的问题和TFH设备的高架特征。

公开(公告)号：US5657192A

公开(公告)日：1997-08-12

申请号：US466514

申请日：1995-06-05

Applicant: Uri Cohen ,  Gene Patrick Bonnie

Inventor： Uri Cohen ,  Gene Patrick Bonnie

IPC: C23F1/44 ,  C04B41/53 ,  C04B41/91 ,  C23F4/00 ,  G11B5/31 ,  G11B5/40 ,  G11B19/04 ,  H01L43/08 ,  H01L43/12 ,  B44C1/22 ,  C23F1/00

CPC classification number: C04B41/5353 ,  C04B41/91 ,  G11B5/3103 ,  G11B5/3106 ,  G11B5/313 ,  G11B5/3133 ,  G11B5/3163 ,  G11B5/40 ,  G11B19/04 ,  G11B5/3143 ,  Y10T29/49032 ,  Y10T29/49044 ,  Y10T29/49046 ,  Y10T29/49064

Abstract: A method for pattern-etching thick alumina layers in the manufacture of thin film heads (TFH) by using compatible metallic mask layers and an alumina etchant. The deep alumina etching facilitates the formation of precise craters for recessed structures. These can improve planarity and alleviate problems related to adverse topography and elevated features of TFH devices.

Abstract translation: 通过使用相容的金属掩模层和氧化铝蚀刻剂在薄膜头（TFH）的制造中图案蚀刻厚氧化铝层的方法。 深氧化铝蚀刻有助于形成用于凹陷结构的精确凹坑。 这些可以改善平面性，并减轻与不利地形相关的问题，并提高TFH设备的特征。

公开(公告)号：US4082220A

公开(公告)日：1978-04-04

申请号：US701258

申请日：1976-06-30

Applicant: Richard C. M. Cheng ,  Gene Patrick Dennis ,  Robert M. Stewart

Inventor： Richard C. M. Cheng ,  Gene Patrick Dennis ,  Robert M. Stewart

IPC: A63H18/02 ,  A63H19/30

CPC classification number: A63H18/02

Abstract: A sectional track construction wherein each section constitutes a generally flat body having at least one longitudinally extending conductor exposed upwardly and provided with end portions each extending beyond the adjacent lateral body portion on one side of the conductor, and an oblique cam at each end of the section for engagement with a like cam of a like section to urge the exposed conductor end portions into side-by-side facing engagement with conductor end portions of a like track section.

公开(公告)号：US06172852B2

公开(公告)日：2001-01-09

申请号：US09170030

申请日：1998-10-13

Applicant: Zine-Eddine Boutaghou ,  Gene Patrick Bonnie

Inventor： Zine-Eddine Boutaghou ,  Gene Patrick Bonnie

IPC: G11B548

CPC classification number: G11B5/5582 ,  G11B5/4833 ,  G11B5/484

Abstract: An actuator assembly for suspending and positioning at least one read/write head over at least one substantially flat surface of magnetic media is disclosed. The actuator assembly is comprised of at least one HSA and at least one actuator arm. Each actuator arm has an actuator arm distal end mating surface for coupling to at least one HSA and actuator arm upper and lower bearing mating surfaces for coupling to other actuator arms. Each HSA has an HSA proximal end mating surface for coupling to an actuator arm and an HSA distal end mating surface for coupling to a read/write head. At least one of the actuator arm distal end mating surfaces, HSA proximal end mating surfaces, actuator arm upper bearing mating surfaces, and actuator arm lower bearing mating surfaces is roughened to increase frictional coupling such that component alignment is not disturbed if the disk drive system is subjected to a mechanical shock. In addition, adhesive may be employed between the mating surfaces to increase coupling strength.

Abstract translation: 公开了用于将至少一个读/写头悬挂并定位在磁介质的至少一个基本上平坦的表面上的致动器组件。 致动器组件包括至少一个HSA和至少一个致动器臂。 每个致动器臂具有致动臂远端配合表面，用于联接到至少一个HSA和致动器臂上和下轴承配合表面，用于联接到其他致动器臂。 每个HSA具有用于联接到致动器臂的HSA近端配合表面和用于耦合到读/写头的HSA远端配合表面。 致动臂远端配合表面，HSA近端配合表面，致动器臂上轴承配合表面和致动器臂下轴承配合表面中的至少一个被粗糙化以增加摩擦联接，使得如果盘驱动系统 受到机械冲击。 此外，可以在配合表面之间使用粘合剂以增加耦合强度。

公开(公告)号：US6059984A

公开(公告)日：2000-05-09

申请号：US598933

申请日：1996-02-09

Applicant: Uri Cohen ,  Gene Patrick Bonnie

Inventor： Uri Cohen ,  Gene Patrick Bonnie

IPC: C04B41/53 ,  C04B41/91 ,  G11B5/31 ,  G11B5/39 ,  G11B5/40 ,  G11B19/04 ,  H01L21/00 ,  H01L21/306 ,  H01L21/3213 ,  H01L43/12 ,  H05K3/06 ,  B44C1/22

CPC classification number: C04B41/009 ,  C04B41/5353 ,  C04B41/91 ,  G11B5/3103 ,  G11B5/3106 ,  G11B5/313 ,  G11B5/3133 ,  G11B5/3163 ,  G11B5/40 ,  H01L21/00 ,  C04B2111/00422 ,  G11B19/04 ,  G11B5/3143 ,  H01L2924/0002 ,  Y10T29/49046

Abstract: A method for pattern-etching thick alumina layers in the manufacture of thin film heads (TFH) by using compatible metallic mask layers and a wet chemical etchant. The deep alumina etching facilitates a studless TFH device where the coil and bonding pads are deposited and patterned simultaneously, and vias are later etched through the alumina overcoat layer to expose the bonding pads. The method also enables the etching of scribe-line grooves of street and alleys across the wafer for sawing and machining of sliders. These grooves eliminate most alumina chipping due to stress and damage introduced by the sawing and machining operations. Similarly, pattern-etching of the alumina undercoat facilitates the formation of precise craters for recessed structures. These can improve planarity and alleviate problems related to adverse topography and elevated features of TFH devices.

Abstract translation: 通过使用相容的金属掩模层和湿化学蚀刻剂制造薄膜头（TFH）时的图案蚀刻厚氧化铝层的方法。 深氧化铝蚀刻有助于无螺纹TFH装置，其中线圈和焊盘被同时沉积和图案，并且通孔随后通过氧化铝外涂层蚀刻以暴露接合焊盘。 该方法还可以蚀刻跨越晶片的街道和小路的划线槽，用于锯切和加工滑块。 这些槽由于锯切和加工操作引起的应力和损坏而消除了大多数氧化铝碎屑。 类似地，氧化铝底涂层的图案蚀刻便于形成用于凹陷结构的精确凹坑。 这些可以改善平面性，并减轻与不利地形相关的问题，并提高TFH设备的特征。

公开(公告)号：US5659451A

公开(公告)日：1997-08-19

申请号：US510049

申请日：1995-07-31

Applicant: Uri Cohen ,  Gene Patrick Bonnie

Inventor： Uri Cohen ,  Gene Patrick Bonnie

IPC: C23F1/44 ,  C04B41/53 ,  C04B41/91 ,  C23F4/00 ,  G11B5/31 ,  G11B5/40 ,  G11B19/04 ,  H01L43/08 ,  H01L43/12 ,  G11B5/147 ,  G11B5/42

CPC classification number: C04B41/5353 ,  C04B41/91 ,  G11B5/3103 ,  G11B5/3106 ,  G11B5/313 ,  G11B5/3133 ,  G11B5/3163 ,  G11B5/40 ,  G11B19/04 ,  G11B5/3143 ,  Y10T29/49032 ,  Y10T29/49044 ,  Y10T29/49046 ,  Y10T29/49064

Abstract: A method for pattern-etching thick alumina layers in the manufacture of thin film heads (TFH) by using compatible metallic mask layers and a dilute (1:2) HF in water etchant. The deep alumina etching facilitates a studless TFH device where the coil and bonding pads are deposited and patterned simultaneously, and vias are later etched through the alumina overcoat layer to expose the bonding pads. The method also enables the etching of scribe-line grooves of street and alleys across the wafer for sawing and machining of sliders. These grooves eliminate most alumina chipping due to stress and damage introduced by the sawing and machining operations. Similarly, pattern-etching of the alumina undercoat facilitates the formation of precise craters for recessed structures. These can improve planarity and alleviate problems related to adverse topography and elevated features of TFH devices.

Abstract translation: 通过在水蚀刻剂中使用相容的金属掩模层和稀（1：2）HF，制造薄膜头（TFH）时的图案蚀刻厚氧化铝层的方法。 深氧化铝蚀刻有助于无螺纹TFH装置，其中线圈和焊盘被同时沉积和图案，并且通孔随后通过氧化铝外涂层蚀刻以暴露接合焊盘。 该方法还可以蚀刻跨越晶片的街道和小路的划线槽，用于锯切和加工滑块。 这些槽由于锯切和加工操作引起的应力和损坏而消除了大多数氧化铝碎屑。 类似地，氧化铝底涂层的图案蚀刻便于形成用于凹陷结构的精确凹坑。 这些可以改善平面性，并减轻与不利地形相关的问题，并提高TFH设备的特征。

公开(公告)号：US20050112936A1

公开(公告)日：2005-05-26

申请号：US10707169

申请日：2003-11-25

Applicant: John Blondin ,  Gene Patrick

Inventor： John Blondin ,  Gene Patrick

IPC: H01R31/08

CPC classification number: H01R31/08

Abstract: A semi-conductor module burn-in test apparatus having a plurality burn-in boards each of which is provided a plurality of module test sockets thereon and each test socket is coupled to an adjacent test socket by with a high current, open/short split power connector that can readily connected to or disconnected from said adjacent test socket by coupling together the power inputs of the adjacent sockets or uncoupling the previously coupled power inputs of adjacent sockets and thereby selectively altering the current carrying levels available to said adjacent test sockets.

Abstract translation: 一种具有多个老化板的半导体模块老化测试装置，每个老化板在其上设置有多个模块测试插座，每个测试插座通过高电流，开/短分离耦合到相邻的测试插座 电源连接器，其可以容易地连接到所述相邻测试插座或从所述相邻测试插座断开，将相邻插座的电源输入耦合在一起，或者将相邻插座的先前耦合的功率输入端分开，从而选择性地改变所述相邻测试插座可用的电流负载水平。

公开(公告)号：US5835315A

公开(公告)日：1998-11-10

申请号：US466323

申请日：1995-06-05

Applicant: Uri Cohen ,  Gene Patrick Bonnie

Inventor： Uri Cohen ,  Gene Patrick Bonnie

IPC: C23F1/44 ,  C04B41/53 ,  C04B41/91 ,  C23F4/00 ,  G11B5/31 ,  G11B5/40 ,  G11B19/04 ,  H01L43/08 ,  H01L43/12 ,  G11B5/147 ,  B44C1/22

CPC classification number: C04B41/5353 ,  C04B41/91 ,  G11B5/3103 ,  G11B5/3106 ,  G11B5/313 ,  G11B5/3133 ,  G11B5/3163 ,  G11B5/40 ,  G11B19/04 ,  G11B5/3143 ,  Y10T29/49032 ,  Y10T29/49044 ,  Y10T29/49046 ,  Y10T29/49064

Abstract: A method for pattern-etching thick alumina layers in the manufacture of thin film heads (TFH) by using compatible metallic mask layers and an alumina etchant. The deep alumina etching enables the formation of scribe-line grooves of street and alleys across the wafer for sawing and machining of sliders. These grooves eliminate most alumina chipping due to stress and damage introduced by the sawing and machining operations.

Abstract translation: 通过使用相容的金属掩模层和氧化铝蚀刻剂在薄膜头（TFH）的制造中图案蚀刻厚氧化铝层的方法。 深氧化铝蚀刻使得能够在晶片上形成用于锯切和加工滑块的街道和小路的划线槽。 这些槽由于锯切和加工操作引起的应力和损坏而消除了大多数氧化铝碎屑。