Methods of stabilizing thiophene derivatives
    4.
    发明授权
    Methods of stabilizing thiophene derivatives 失效
    稳定噻吩衍生物的方法

    公开(公告)号:US07449588B2

    公开(公告)日:2008-11-11

    申请号:US11744264

    申请日:2007-05-04

    IPC分类号: C07D333/16 C07D495/06

    CPC分类号: C07D495/04

    摘要: Methods of stabilizing thiophene derivatives of the general formula (I) by treatment with basic compounds: wherein R1 and R2 each independently represents a moiety selected from the group consisting of hydrogen, optionally substituted C1-20 alkyl groups which can contain up to 5 heteroatoms selected from the group consisting of oxygen and sulfur, optionally substituted C1-20 oxyalkyl groups which can contain up to 5 heteroatoms selected from the group consisting of oxygen and sulfur, or wherein R1 and R2 together represent a fused cyclic moiety selected from the group consisting of optionally substituted C1-20 dioxyalkylene groups and C1-20 dioxyarylene groups; and stabilized thiophene derivatives that can be prepared by such methods.

    摘要翻译: 通过用碱性化合物处理来稳定通式(I)的噻吩衍生物的方法:其中R 1和R 2各自独立地表示选自氢 ,任选取代的C 1-20烷基,其可以含有至多5个选自氧和硫的杂原子,任选取代的C 1-20烷氧基,其可以 含有多至5个选自氧和硫的杂原子,或其中R 1和R 2一起代表稠合的环状部分,其选自任选取代的 C 1-20二氧亚烷基和C 1-20二取代的亚芳基; 和可以通过这些方法制备的稳定的噻吩衍生物。

    Novel polythiophene dispersions
    5.
    发明申请
    Novel polythiophene dispersions 审中-公开
    新型聚噻吩分散体

    公开(公告)号:US20060071201A1

    公开(公告)日:2006-04-06

    申请号:US11288703

    申请日:2005-11-29

    IPC分类号: H01B1/12

    摘要: A process for the preparation of dispersions or solutions comprising polythiophene+An− ion complexes in anhydrous or low-water-content organic solvents, characterized in that at least one water-miscible organic solvent or a water-miscible solvent mixture is added to an aqueous dispersion or solution comprising optionally substituted polythiophenes, all or some of the water is removed, and the resultant dispersion or solution is, if desired, diluted with organic solvents.

    摘要翻译: 一种在无水或低含水量的有机溶剂中制备包含聚噻吩和/或超级离子配合物的分散体或溶液的方法,其特征在于至少一种与水混合 将有机溶剂或与水混溶的溶剂混合物加入到包含任选取代的聚噻吩的水分散体或溶液中,除去所有或部分水,如果需要,所得分散体或溶液用有机溶剂稀释。

    Transparent plastics molding composition
    6.
    发明授权
    Transparent plastics molding composition 失效
    透明塑料成型组合物

    公开(公告)号:US06737162B2

    公开(公告)日:2004-05-18

    申请号:US10039267

    申请日:2002-01-04

    IPC分类号: B32B2738

    摘要: Transparent moldings comprising a polymeric base material and at least one coating formed thereon is disclosed. The coating includes a primer coat that containing an epoxy and/or acrylic resin is disposed on at least one surface of the base material, a heat-absorbing coating which contains a polythiophene compound and a scratch-resistant coating. In an additional embodiment of the invention, the coating contains no primer and the heat absorbing coating contains a polythiophene compound.

    摘要翻译: 公开了包含聚合物基材和在其上形成的至少一个涂层的透明模制品。 该涂层包括底涂层,其中含有环氧树脂和/或丙烯酸树脂,其设置在基材的至少一个表面上,含有聚噻吩化合物的耐热涂层和耐刮擦涂层。 在本发明的另外的实施方案中,涂层不含底漆,并且吸热涂层含有聚噻吩化合物。

    Process for the preparation of water-soluble &pgr;-conjugated polymers
    7.
    发明授权
    Process for the preparation of water-soluble &pgr;-conjugated polymers 有权
    制备水溶性π-共轭聚合物的方法

    公开(公告)号:US06635729B1

    公开(公告)日:2003-10-21

    申请号:US09767474

    申请日:2001-01-23

    IPC分类号: C08F12806

    摘要: The invention relates to a process for preparing water-soluble &pgr;-conjugated polymers by polymerizing, in aqueous solution using an oxidant, monomeric thiophene derivatives of formula (I) wherein X and Y are identical or different and are O, S, or N—R′, Z is —(CH2)m—CR2R3—(CH2)n—, R1 is aryl, C1-C18-alkyl, or hydrogen, R2 is hydrogen or —CH2)s—O—(CH2)p—SO3−M+, R3 is —(CH2)s—O—(CH2)p—SO3−M+, M+ is a cation, m and n are identical or different and are an integer from 0 to 3, s is an integer from 0 to 10, and p is an integer from 1 to 1.

    摘要翻译: 本发明涉及通过在水溶液中使用氧化剂,其中X和Y相同或不同且为O,S或N-R的式(I)的单体噻吩衍生物进行聚合来制备水溶性π-共轭聚合物的方法 ',Z是 - (CH 2)m-CR 2 R 3 - (CH 2)n - ,R 1是芳基,C 1 -C 18烷基或氢,R 2是氢或-CH 2 )sO-(CH 2)p -SO 3 - ,M +,R 3是 - (CH 2)s O-(CH 2)p -SO 3 M +,M +是阳离子, m和n相同或不同,为0〜3的整数,s为0〜10的整数,p为1〜1的整数。

    Process for the preparation of dialkylthiophenes and alkylenedioxythiophenes
    8.
    发明授权
    Process for the preparation of dialkylthiophenes and alkylenedioxythiophenes 有权
    制备二烷基噻吩和亚烷基二氧噻吩的方法

    公开(公告)号:US06369239B2

    公开(公告)日:2002-04-09

    申请号:US09813875

    申请日:2001-03-21

    IPC分类号: C07D49504

    摘要: A process for the preparation of dialkoxythiophenes and alkylene-dioxythiophenes in high purity and very good yields by decarboxylation of dialkoxythiophene-dicarboxylic acids or alkylenedioxythiophenedicarboxylic acids, respectively, in solvents that have a higher boiling point than the product and contain no nitrogen bases.

    摘要翻译: 在沸点高于不含氮基的溶剂中分别通过二烷氧基噻吩 - 二羧酸或亚烷基二氧噻吩二羧酸脱羧来制备高纯度的二烷氧基噻吩和亚烷基二氧噻吩的方法。

    Process for producing rigid and flexible circuits
    10.
    发明授权
    Process for producing rigid and flexible circuits 失效
    生产刚性和柔性电路的工艺

    公开(公告)号:US5935405A

    公开(公告)日:1999-08-10

    申请号:US926111

    申请日:1997-09-09

    摘要: Rigid or flexible circuits of electrically conductor tracks can be produced on flexible or rigid, non-conductive support materials bya) coating the surfaces of the support materials including existing drill holes with a primer and a conductive polymer, preferably poly-3,4-ethylendioxythiophene, which may contain binders,b) applying an electroplating resist in the form of the negative image of the conductor tracks,c) metallizing by electroplating the surface kept free by the electroplating resist, including existing drill holes, in the form of the positive image of the conductor tracks,d) removing the electroplating resist ande) removing the conductive polymer, which had been below the electroplating resist, or converting it to a non-conductive form, wherein the conductor tracks are electrically interconnected during the metallizing step by the layer of conductive polymer, thereby avoiding the need to individually contact each conductor track.

    摘要翻译: 电导体轨道的刚性或柔性电路可以通过以下方式在柔性或刚性的非导电支撑材料上制造:a)用底漆和导电聚合物涂覆包括现有钻孔的载体材料的表面,优选聚3,4- 乙烯二氧噻吩,其可以包含粘合剂,b)以导体轨迹的负像形式施加电镀抗蚀剂,c)通过电镀由电镀抗蚀剂保持的表面(包括现有的钻孔)以阳性形式进行金属化 导体轨迹的图像,d)去除电镀抗蚀剂,以及e)去除已经在电镀抗蚀剂下面的导电聚合物,或将其转换成非导电形式,其中导体轨道在金属化步骤期间电互连, 导电聚合物层,从而避免需要单独接触每个导体轨道。