公开(公告)号：US4759829A

公开(公告)日：1988-07-26

申请号：US108664

申请日：1987-10-15

申请人： Frank J. Fuccello, Sr. ,  Frank Z. Hawrylo ,  Robert E. Harwood

发明人： Frank J. Fuccello, Sr. ,  Frank Z. Hawrylo ,  Robert E. Harwood

IPC分类号： H01L21/48 ,  H01L33/40 ,  H01L33/48 ,  H01L33/62 ,  H01L33/64 ,  C25D5/02

CPC分类号： H01L33/483 ,  H01L21/4871 ,  H01L33/40 ,  H01L33/641 ,  H01L2224/48463 ,  H01L2924/01327 ,  H01L2933/0075 ,  H01L33/62

摘要： A device header with a multilayer coating overlying its entire surface, and a method of making said header, are disclosed. The multilayer coating comprises an electrolytic nickel layer and a gold layer in the device mounting area of the header, whereas the rest of the header is coated with electroless nickel, a first gold layer, electrolytic nickel, and a second gold layer. In the fabrication, the electroless nickel layer is deposited over the entire header followed by the first gold layer. Upon removing these layers from the device mounting area, the first gold layer remaining on the rest of the header acts as a mask for the etching of the mounting area preparatory to deposition of electrolytic nickel and the second gold layer. The header has the advantage of the excellent coverage of electroless nickel over most of its surface, but with the advantage of high purity electrolytic nickel in the device mounting area.

摘要翻译： 公开了一种具有覆盖其整个表面的多层涂层的装置头部以及制造所述头部的方法。 多层涂层在集管的装置安装区域中包括电解镍层和金层，而集管的其余部分涂覆有无电镍，第一金层，电解镍和第二金层。 在制造中，无电镀镍层沉积在整个集管上，随后是第一金层。 在从装置安装区域移除这些层时，残留在集管的其余部分上的第一金层用作用于蚀刻沉积电解镍和第二金层的安装区域的掩模。 该头具有在其大部分表面上具有优异的化学镀镍覆盖的优点，但是在装置安装区域中具有高纯度电解镍的优点。