Method for forming a multi-layered structure of a semiconductor device and methods for forming a capacitor and a gate insulation layer using the multi-layered structure
    3.
    发明授权
    Method for forming a multi-layered structure of a semiconductor device and methods for forming a capacitor and a gate insulation layer using the multi-layered structure 失效
    用于形成半导体器件的多层结构的方法以及使用该多层结构形成电容器和栅极绝缘层的方法

    公开(公告)号:US06989338B2

    公开(公告)日:2006-01-24

    申请号:US10737394

    申请日:2003-12-15

    IPC分类号: H01L21/26

    摘要: Disclosed is a method for forming a multi-layered structure having at least two films on a semiconductor substrate. The substrate is disposed on a thermally conductible stage for supporting the substrate. After the distance between the stage and the substrate is adjusted to a first interval so that the substrate has a first temperature by heat transferred from the stage, a first thin film is formed on the substrate at the first temperature. The distance is then adjusted from the first interval to a second interval so that the substrate reaches a second temperature, and then a second thin film is formed on the first thin film at the second temperature, thereby forming the multi-layered structure on the substrate. The multi-layered structure can be employed for a gate insulation film or the dielectric film of a capacitor.

    摘要翻译: 公开了一种在半导体衬底上形成至少具有两个膜的多层结构的方法。 基板设置在用于支撑基板的导热性台上。 在阶段和衬底之间的距离被调整到第一间隔,使得衬底具有通过从载物台传递的热量的第一温度,在第一温度下在衬底上形成第一薄膜。 然后将距离从第一间隔调整到第二间隔,使得衬底达到第二温度,然后在第二温度下在第一薄膜上形成第二薄膜,从而在衬底上形成多层结构 。 多层结构可以用于栅极绝缘膜或电容器的电介质膜。