Probes for a wafer test apparatus
    1.
    发明授权
    Probes for a wafer test apparatus 有权
    晶圆测试仪的探头

    公开(公告)号:US07808260B2

    公开(公告)日:2010-10-05

    申请号:US11885107

    申请日:2006-02-16

    IPC分类号: G01R31/02

    摘要: A probe configured for use in the testing of integrated circuits includes a first end portion terminating in a foot (42), the foot defining a substantially flat surface configured to be connected to a substrate (400), a second end portion terminating in a tip (50), the tip being configured to contact an integrated circuit during testing of the integrated circuit, and a curved body portion (56) extending between the first end portion and the second end portion.

    摘要翻译: 构造成用于集成电路测试的探针包括终止于脚部(42)的第一端部部分,所述脚部限定基本上平坦的表面,所述基本上平坦的表面被配置为连接到基底(400),第二端部终止于尖端 (50),所述尖端构造成在所述集成电路的测试期间与集成电路接触,以及在所述第一端部和所述第二端部之间延伸的弯曲主体部分(56)。

    Probes for a Wafer Test Apparatus
    2.
    发明申请
    Probes for a Wafer Test Apparatus 有权
    硅片测试仪的探头

    公开(公告)号:US20080258746A1

    公开(公告)日:2008-10-23

    申请号:US11885107

    申请日:2006-02-16

    IPC分类号: G01R1/073

    摘要: A probe configured for use in the testing of integrated circuits includes a first end portion terminating in a foot (42), the foot defining a substantially flat surface configured to be connected to a substrate (400), a second end portion terminating in a tip (50), the tip being configured to contact an integrated circuit during testing of the integrated circuit, and a curved body portion (56) extending between the first end portion and the second end portion.

    摘要翻译: 构造成用于集成电路测试的探针包括终止于脚部(42)的第一端部部分,所述脚部限定基本上平坦的表面,所述基本上平坦的表面被配置为连接到基底(400),第二端部终止于尖端 (50),所述尖端构造成在所述集成电路的测试期间与集成电路接触,以及在所述第一端部和所述第二端部之间延伸的弯曲主体部分(56)。