公开(公告)号：US08491248B2

公开(公告)日：2013-07-23

申请号：US13229497

申请日：2011-09-09

申请人： Chris Gage ,  Shawn Hamilton ,  Sheldon Templeton ,  Keith Wood ,  Damon Genetti

发明人： Chris Gage ,  Shawn Hamilton ,  Sheldon Templeton ,  Keith Wood ,  Damon Genetti

IPC分类号： H01L21/677

CPC分类号： H01L21/67201 ,  H01L21/67196 ,  H01L21/67742 ,  Y10S414/135

摘要： Provided are apparatuses and methods disclosed for wafer processing. Specific embodiments include dual wafer handling systems that transfer wafers from storage cassettes to processing modules and back and aspects thereof. Stacked independent loadlocks that allow venting and pumping operations to work in parallel and may be optimized for particle reduction are provided. Also provided are annular designs for radial top down flow during loadlock vent and pumpdown.

公开(公告)号：US08099192B2

公开(公告)日：2012-01-17

申请号：US11935883

申请日：2007-11-06

申请人： Damon Genetti ,  Heinrich Von Bunau ,  Tarek Radwan ,  Karen Townsend

发明人： Damon Genetti ,  Heinrich Von Bunau ,  Tarek Radwan ,  Karen Townsend

IPC分类号： G05B19/18

CPC分类号： B25J9/1694 ,  G05B2219/37125 ,  Y10S414/115

摘要： A method is provided for teaching a transfer robot used in conjunction with a workpiece processing system including a pedestal assembly, a light sensor having an optical input fixedly coupled to the pedestal assembly, a transfer robot having an end effector, and a processing chamber containing the pedestal assembly and light sensor. The method includes the steps of producing light within the processing chamber, moving the end effector over the optical input such that amount of light reaching the light sensor varies in relation to the position of the end effector, and recording the signal gain as the end effector is moved over the optical input. The method also includes the step of establishing from the recorded signal gain a desired position of the end effector relative to the pedestal assembly.

摘要翻译： 提供了一种用于教导与包括基座组件的工件处理系统一起使用的传送机器人的方法，具有固定地联接到基座组件的光学输入的光传感器，具有末端执行器的传送机器人和包含 基座组件和光传感器。 该方法包括以下步骤：在处理室内产生光，使端部执行器移动到光学输入端上，使得到达光传感器的光量相对于末端执行器的位置变化，并记录信号增益作为末端执行器 在光学输入端移动。 该方法还包括从记录的信号增益建立末端执行器相对于基座组件的期望位置的步骤。

公开(公告)号：US20120003063A1

公开(公告)日：2012-01-05

申请号：US13229497

申请日：2011-09-09

申请人： Chris Gage ,  Shawn Hamilton ,  Sheldon Templeton ,  Keith Wood ,  Damon Genetti

发明人： Chris Gage ,  Shawn Hamilton ,  Sheldon Templeton ,  Keith Wood ,  Damon Genetti

IPC分类号： H01L21/677

CPC分类号： H01L21/67201 ,  H01L21/67196 ,  H01L21/67742 ,  Y10S414/135

摘要： Provided are apparatuses and methods disclosed for wafer processing. Specific embodiments include dual wafer handling systems that transfer wafers from storage cassettes to processing modules and back and aspects thereof. Stacked independent loadlocks that allow venting and pumping operations to work in parallel and may be optimized for particle reduction are provided. Also provided are annular designs for radial top down flow during loadlock vent and pumpdown.

摘要翻译： 提供了用于晶片处理的装置和方法。 具体实施例包括将晶片从存储盒传送到处理模块的双晶片处理系统及其背面及其方面。 提供堆叠的独立负载锁，其允许排气和泵送操作并行工作并且可以针对颗粒减少进行优化。 还提供了在负载锁定排气口和抽空装置期间径向顶部向下流动的环形设计。

公开(公告)号：US06405101B1

公开(公告)日：2002-06-11

申请号：US09434099

申请日：1999-11-05

申请人： William R. Johanson ,  Craig Stevens ,  Steve Kleinke ,  Damon Genetti

发明人： William R. Johanson ,  Craig Stevens ,  Steve Kleinke ,  Damon Genetti

IPC分类号： G06F700

CPC分类号： H01L21/681

摘要： Disclosed is a system and method for detecting the position of a wafer with respect to a calibrated reference position. In one embodiment of the invention, sensors are used to detect the edges of the wafer as the wafer is being passed over the sensors. This wafer detection information is then used to calculate the amount by which the wafer is off-centered such that corrections can be made before the wafer is placed onto a destination location.

摘要翻译： 公开了一种用于检测晶片相对于校准基准位置的位置的系统和方法。 在本发明的一个实施例中，当晶片通过传感器时，传感器用于检测晶片的边缘。 然后，该晶片检测信息用于计算晶片偏心的量，使得可以在将晶片放置在目的位置之前进行校正。

公开(公告)号：US20120014773A1

公开(公告)日：2012-01-19

申请号：US13243906

申请日：2011-09-23

申请人： Chris Gage ,  Damon Genetti

发明人： Chris Gage ,  Damon Genetti

IPC分类号： B25J9/00

CPC分类号： H01L21/68 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67742

摘要： Methods correcting wafer position error are provided. The methods involve measuring wafer position error on a robot, e.g. a dual side-by-side end effector robot, during transfer to an intermediate station. This measurement data is then used by a second robot to perform wafer pick moves from the intermediate station with corrections to center the wafer. Wafer position correction may be performed at only one location during the transfer process. Also provided are systems and apparatuses for transferring wafers using an intermediate station.

摘要翻译： 提供校正晶片位置误差的方法。 该方法涉及测量机器人上的晶片位置误差，例如。 双向并排端部执行器机器人，在传送到中间站时。 该测量数据然后被第二机器人用于执行从中间站的晶片拾取移动，其具有校正以使晶片居中。 晶片位置校正可以在传送过程中仅在一个位置进行。 还提供了使用中间站传送晶片的系统和装置。

公开(公告)号：US20090142167A1

公开(公告)日：2009-06-04

申请号：US11998528

申请日：2007-11-30

申请人： Chris Gage ,  Shawn Hamilton ,  Sheldon Templeton ,  Keith Wood ,  Damon Genetti

发明人： Chris Gage ,  Shawn Hamilton ,  Sheldon Templeton ,  Keith Wood ,  Damon Genetti

IPC分类号： H01L21/677 ,  B65G53/34

CPC分类号： H01L21/67201 ,  H01L21/67196 ,  H01L21/67742 ,  Y10S414/135

摘要： Provided are apparatuses and methods disclosed for wafer processing. Specific embodiments include dual wafer handling systems that transfer wafers from storage cassettes to processing modules and back and aspects thereof. Stacked independent loadlocks that allow venting and pumping operations to work in parallel and may be optimized for particle reduction are provided. Also provided are annular designs for radial top down flow during loadlock vent and pumpdown.

摘要翻译： 提供了用于晶片处理的装置和方法。 具体实施例包括将晶片从存储盒传送到处理模块的双晶片处理系统及其背面及其方面。 提供堆叠的独立负载锁，其允许排气和泵送操作并行工作并且可以针对颗粒减少进行优化。 还提供了在负载锁定排气口和抽空装置期间径向顶部向下流动的环形设计。

公开(公告)号：US09002514B2

公开(公告)日：2015-04-07

申请号：US11998857

申请日：2007-11-30

申请人： Damon Genetti ,  Shawn Hamilton ,  Rich Blank ,  Sheldon Templeton

发明人： Damon Genetti ,  Shawn Hamilton ,  Rich Blank ,  Sheldon Templeton

IPC分类号： H01L21/67 ,  H01L21/68 ,  H01L21/677 ,  H01L21/673

CPC分类号： H01L21/67196 ,  H01L21/67207 ,  H01L21/67259 ,  H01L21/67703 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67754 ,  Y10S901/06 ,  Y10S901/09 ,  Y10S901/14

摘要： Methods and systems for positioning wafers using a dual side-by-side end effector robot are provided. The methods involve performing place moves using dual side-by-side end effector robots with active wafer position correction. According to various embodiments, the methods may be used for placement into a process module, loadlock or other destination by a dual wafer transfer robot. The methods provide nearly double the throughput of a single wafer transfer schemes by transferring two wafers with the same number of moves.

公开(公告)号：US08033769B2

公开(公告)日：2011-10-11

申请号：US11998528

申请日：2007-11-30

申请人： Chris Gage ,  Shawn Hamilton ,  Sheldon Templeton ,  Keith Wood ,  Damon Genetti

发明人： Chris Gage ,  Shawn Hamilton ,  Sheldon Templeton ,  Keith Wood ,  Damon Genetti

IPC分类号： H01L21/677

CPC分类号： H01L21/67201 ,  H01L21/67196 ,  H01L21/67742 ,  Y10S414/135

摘要： Provided are apparatuses and methods disclosed for wafer processing. Specific embodiments include dual wafer handling systems that transfer wafers from storage cassettes to processing modules and back and aspects thereof. Stacked independent loadlocks that allow venting and pumping operations to work in parallel and may be optimized for particle reduction are provided. Also provided are annular designs for radial top down flow during loadlock vent and pumpdown.

摘要翻译： 提供了用于晶片处理的装置和方法。 具体实施例包括将晶片从存储盒传送到处理模块的双晶片处理系统及其背面及其方面。 提供堆叠的独立负载锁，其允许排气和泵送操作并行工作并且可以针对颗粒减少进行优化。 还提供了在负载锁定排气口和抽空装置期间径向顶部向下流动的环形设计。

公开(公告)号：US20090142163A1

公开(公告)日：2009-06-04

申请号：US11998857

申请日：2007-11-30

申请人： Damon Genetti ,  Shawn Hamilton ,  Rich Blank ,  Sheldon Templeton

发明人： Damon Genetti ,  Shawn Hamilton ,  Rich Blank ,  Sheldon Templeton

IPC分类号： H01L21/67

CPC分类号： H01L21/67196 ,  H01L21/67207 ,  H01L21/67259 ,  H01L21/67703 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67754 ,  Y10S901/06 ,  Y10S901/09 ,  Y10S901/14

摘要： Methods and systems for positioning wafers using a dual side-by-side end effector robot are provided. The methods involve performing place moves using dual side-by-side end effector robots with active wafer position correction. According to various embodiments, the methods may be used for placement into a process module, loadlock or other destination by a dual wafer transfer robot. The methods provide nearly double the throughput of a single wafer transfer schemes by transferring two wafers with the same number of moves.

摘要翻译： 提供了使用双重并排端部执行器机器人定位晶片的方法和系统。 该方法涉及使用具有活动晶片位置校正的双并排端部执行器机器人进行位置移动。 根据各种实施例，该方法可以用于通过双晶片传送机器人放置到处理模块，负载锁定或其它目的地中。 通过转移具有相同数量移动的两个晶片，这些方法提供了单个晶片传送方案的吞吐量的近两倍。

公开(公告)号：US08489237B2

公开(公告)日：2013-07-16

申请号：US13243906

申请日：2011-09-23

申请人： Chris Gage ,  Damon Genetti

发明人： Chris Gage ,  Damon Genetti

IPC分类号： G05B19/418

CPC分类号： H01L21/68 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67742

摘要： Methods correcting wafer position error are provided. The methods involve measuring wafer position error on a robot during transfer to an intermediate station. This measurement data is then used by a second robot to perform wafer pick moves from the intermediate station with corrections to center the wafer. Wafer position correction may be performed at only one location during the transfer process. Also provided are systems and apparatuses for transferring wafers using an intermediate station.

摘要翻译： 提供校正晶片位置误差的方法。 该方法涉及在转移到中间站期间测量机器人上的晶片位置误差。 该测量数据然后被第二机器人用于执行从中间站的晶片拾取移动，其具有校正以使晶片居中。 晶片位置校正可以在传送过程中仅在一个位置进行。 还提供了使用中间站传送晶片的系统和装置。