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公开(公告)号：US09656414B2
公开(公告)日：2017-05-23
申请号：US14187673
申请日：2014-02-24
Applicant: John T. Fourkas , Christopher N. LaFratta
Inventor： John T. Fourkas , Christopher N. LaFratta
CPC classification number: B29C39/36 , B29C33/3857 , B29C33/405 , B29C39/006 , B29L2031/756 , Y10T137/2224 , Y10T137/8593 , Y10T137/85938
Abstract: The present invention relates to microfluidic devices that comprise a 3-D microfluidic network of microchannels of arbitrary complexity and to a method for fabricating such devices. In particular, the invention relates to a method of forming microfluidic devices having 3-D microfluidic networks that contain open or closed loop microchannels using a single-step molding process without the need for layer-by-layer fabrication, and to the resultant microfluidic devices. The networks of such microfluidic devices may comprise one or more microchannel circuits which may be discrete or interconnected.
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公开(公告)号：US20080041475A1
公开(公告)日：2008-02-21
申请号：US11838355
申请日：2007-08-14
Applicant: John T. Fourkas , Christopher N. LaFratta
Inventor： John T. Fourkas , Christopher N. LaFratta
CPC classification number: B29C39/36 , B29C33/3857 , B29C33/405 , B29C39/006 , B29L2031/756 , Y10T137/2224 , Y10T137/8593 , Y10T137/85938
Abstract: The present invention relates to microfluidic devices that comprise a 3-D microfluidic network of microchannels of arbitrary complexity and to a method for fabricating such devices. In particular, the invention relates to a method of forming microfluidic devices having 3-D microfluidic networks that contain open or closed loop microchannels using a single-step molding process without the need for layer-by-layer fabrication, and to the resultant microfluidic devices. The networks of such microfluidic devices may comprise one or more microchannel circuits which may be discrete or interconnected.
Abstract translation: 本发明涉及包含具有任意复杂性的微通道的3-D微流体网络的微流体装置以及制造这种装置的方法。 特别地，本发明涉及一种形成具有3-D微流体网络的微流体装置的方法，所述微流体网络包含使用单步模制工艺而不需要逐层制造的开环或闭环微通道，以及所产生的微流体装置 。 这种微流体装置的网络可以包括一个或多个可以是离散的或互连的微通道电路。
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公开(公告)号：US08656949B2
公开(公告)日：2014-02-25
申请号：US11838355
申请日：2007-08-14
Applicant: John T. Fourkas , Christopher N. LaFratta
Inventor： John T. Fourkas , Christopher N. LaFratta
CPC classification number: B29C39/36 , B29C33/3857 , B29C33/405 , B29C39/006 , B29L2031/756 , Y10T137/2224 , Y10T137/8593 , Y10T137/85938
Abstract: The present invention relates to microfluidic devices that comprise a 3-D microfluidic network of microchannels of arbitrary complexity and to a method for fabricating such devices. In particular, the invention relates to a method of forming microfluidic devices having 3-D microfluidic networks that contain open or closed loop microchannels using a single-step molding process without the need for layer-by-layer fabrication, and to the resultant microfluidic devices. The networks of such microfluidic devices may comprise one or more microchannel circuits which may be discrete or interconnected.
Abstract translation: 本发明涉及包含具有任意复杂性的微通道的3-D微流体网络的微流体装置以及制造这种装置的方法。 特别地，本发明涉及一种形成具有3-D微流体网络的微流体装置的方法，所述微流体网络包含使用单步模制工艺而不需要逐层制造的开环或闭环微通道，以及所产生的微流体装置 。 这种微流体装置的网络可以包括一个或多个可以是离散的或互连的微通道电路。
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4.发明授权Method of fabricating a fibrous structure for use in electrochemical applications 失效制造用于电化学应用的纤维结构的方法公开(公告)号：US07052741B2
公开(公告)日：2006-05-30
申请号：US10847765
申请日：2004-05-18
Applicant: Maria G. Medeiros , Eric G. Dow , Russell R. Bessette , Craig M. Deschenes , Christopher N. Lafratta , Armand F. Lewis , Yong K. Kim
Inventor： Maria G. Medeiros , Eric G. Dow , Russell R. Bessette , Craig M. Deschenes , Christopher N. Lafratta , Armand F. Lewis , Yong K. Kim
CPC classification number: H01M4/8605 , B01J23/44 , B01J23/468 , B01J35/06 , B05D1/007 , B05D1/16
Abstract: A method is provided for the fabrication of a fibrous structure. Fibers are deposited in a hopper connected to an electrode. A mesh covers the hopper opening and the hopper is inverted and suspended over an adhesive coated substrate. An electric field is generated between the hopper and the substrate while the hopper is simultaneously shaken. As a result, fibers fall through the mesh, aligned along the electric field lines, travel through the electric field, and are coupled on one end thereof to the adhesive.
Abstract translation: 提供了一种用于制造纤维结构的方法。 纤维沉积在与电极连接的料斗中。 网格覆盖料斗开口，料斗倒置并悬挂在粘合剂涂覆的基材上。 在料斗同时摇动时，在料斗和基材之间产生电场。 结果，纤维落在通过电场线排列的网格中，穿过电场，并且在其一端耦合到粘合剂。
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