Cross-over relief valve assembly for use in bi-directional circuit
    1.
    发明授权
    Cross-over relief valve assembly for use in bi-directional circuit 失效
    用于双向电路的交叉溢流阀组件

    公开(公告)号:US07234487B2

    公开(公告)日:2007-06-26

    申请号:US11091187

    申请日:2005-03-28

    IPC分类号: F16K17/18

    摘要: A relief valve assembly (27) for use with first (15) and second (21) conduits, one communicating high pressure. The assembly comprises a housing (29,33) defining first (45) and second (47) ports, and a poppet seat (49). A poppet member (43) and the housing define a spring chamber (55), and a spring (39) is disposed to bias the poppet member toward the seat. The poppet member defines a shuttle cavity (51), a shuttle passage (53) communicating from the cavity to the spring chamber, and the poppet defining a seat (57), and a fluid passage (61P) communicating with the first port, and a seat (59), and a second fluid passage (63) communicating with the second port. A shuttle valve assembly (71,73,75) is provided, whereby the fluid pressure in whichever of the ports is at lower pressure is communicated to the spring chamber and adds to the force of the biasing spring.

    摘要翻译: 一种用于与第一(15)和第二(21)导管一起使用的安全阀组件(27),一个连通高压。 组件包括限定第一(45)和第二(47)端口的壳体(29,33)和提升阀座(49)。 提升构件(43)和壳体限定弹簧室(55),并且弹簧(39)被设置成朝向座椅偏置提升阀构件。 提升构件限定梭腔(51),从空腔连通到弹簧室的梭通道(53)和限定座(57)的提升阀以及与第一端口连通的流体通道(61P) 和座(59),以及与第二端口连通的第二流体通道(63)。 提供了梭阀组件(71,73,75),由此无论哪个端口处于较低压力的流体压力都连通到弹簧室,并增加了偏置弹簧的力。

    Solenoid assembly with over-molded electronics
    3.
    发明授权
    Solenoid assembly with over-molded electronics 有权
    具有过模制电子元件的电磁阀组件

    公开(公告)号:US07701314B2

    公开(公告)日:2010-04-20

    申请号:US11525702

    申请日:2006-09-22

    IPC分类号: H01F7/00

    摘要: A solenoid assembly (23) includes a coil assembly (65) having at least one coil winding (73) and an electronic circuit assembly (67), which is in electrical communication with the coil assembly (65). The electronic circuit assembly (67) has a printed circuit board (79) and at least one electronic component (81), which is surface mounted on the printed circuit board (79). A coating material (85) coats all of the plurality of external surfaces of the surface-mounted electronic component (81). A casing (87) over-molds an outer longitudinal surface (77) of the coil assembly (65) and all of a plurality of external surfaces of the electronic circuit assembly (67).

    摘要翻译: 螺线管组件(23)包括具有至少一个线圈绕组(73)和与线圈组件(65)电连通的电子电路组件(67)的线圈组件(65)。 电子电路组件(67)具有印刷电路板(79)和表面安装在印刷电路板(79)上的至少一个电子部件(81)。 涂覆材料(85)涂覆表面安装的电子部件(81)的所有多个外表面。 外壳(87)覆盖线圈组件(65)的外纵向表面(77)和电子电路组件(67)的所有多个外表面。

    Solenoid assembly with over-molded electronics
    4.
    发明申请
    Solenoid assembly with over-molded electronics 有权
    具有过模制电子元件的电磁阀组件

    公开(公告)号:US20080074219A1

    公开(公告)日:2008-03-27

    申请号:US11525702

    申请日:2006-09-22

    IPC分类号: H01F7/00

    摘要: A solenoid assembly (23) includes a coil assembly (65) having at least one coil winding (73) and an electronic circuit assembly (67), which is in electrical communication with the coil assembly (65). The electronic circuit assembly (67) has a printed circuit board (79) and at least one electronic component (81), which is surface mounted on the printed circuit board (79). A coating material (85) coats all of the plurality of external surfaces of the surface-mounted electronic component (81). A casing (87) over-molds an outer longitudinal surface (77) of the coil assembly (65) and all of a plurality of external surfaces of the electronic circuit assembly (67).

    摘要翻译: 螺线管组件(23)包括具有至少一个线圈绕组(73)和与线圈组件(65)电连通的电子电路组件(67)的线圈组件(65)。 电子电路组件(67)具有印刷电路板(79)和表面安装在印刷电路板(79)上的至少一个电子部件(81)。 涂覆材料(85)涂覆表面安装的电子部件(81)的所有多个外表面。 外壳(87)覆盖线圈组件(65)的外纵向表面(77)和电子电路组件(67)的所有多个外表面。