公开(公告)号：US06811074B2

公开(公告)日：2004-11-02

申请号：US10377204

申请日：2003-02-27

申请人： Guido Suter ,  Christoph Tschudin

发明人： Guido Suter ,  Christoph Tschudin

IPC分类号： B23K3102

CPC分类号： H01L24/78 ,  B23K1/0016 ,  B23K1/012 ,  B23K3/063 ,  B23K2101/40 ,  H01L2224/78301 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2224/48 ,  H01L2224/45099

摘要： For dispensing solder on a substrate, a soldering wire and a forming gas heated to a predetermined temperature are fed to a mixing chamber of a two-component nozzle so that, in the mixing chamber, solder is melted off and carried with the gas stream. The solder blown out of the two-component nozzle settles on the substrate. The two-component nozzle is moved or swivelled relative to the substrate in order to distribute the solder over a predetermined area of the substrate.

摘要翻译： 为了在基板上分配焊料，将加热到预定温度的焊丝和成形气体供给到双组分喷嘴的混合室，使得在混合室中，焊料熔化并携带气流。 从双组分喷嘴吹出的焊料沉积在基板上。 双组分喷嘴相对于基底移动或旋转，以便将焊​​料分布在衬底的预定区域上。