Abstract:
The present invention discloses a pulse width modulation driving IC. The pulse width modulation driving IC includes a first pin, for receiving a first signal, a second pin, for receiving a second signal, a comparing unit, for comparing the first signal with a reference voltage, to generate a comparison result indicating a operating mode of the pulse width modulation driving IC, and an output unit, for outputting a pulse width modulation output signal according to the first signal, the second signal and the comparison result.
Abstract:
A driving method for a motor includes sensing variation of magnetic pole of a rotator of the motor, to generate a magnetic pole sensing signal, determining dead zone of the motor according to the magnetic pole sensing signal, to generate a determination result, and adjusting voltage outputted to a coil of the rotator according to the determination result.
Abstract:
A method including operating an ion implanted to implanting ions in a semiconductor wafer at a first ion dose level; performing a first thermal wave measurement to obtain the first thermal wave value; placing the semiconductor wafer in a rapid thermal annealing furnace and operating the furnace to rapidly heat the semiconductor wafer at a first rate for a first time period and so that the wafer is heated with intent of achieving a wafer temperature of 500° C.; performing a second thermal wave measurement to obtain a second thermal wave value; comparing the difference between the first thermal wave value and the second thermal wave value to a target range of 376.5-382.5 and rejecting the wafer as being outside of an acceptable specification if the difference is outside of the target range.
Abstract:
A rapid thermal anneal (RTA) chamber having one or multiple openings in a chamber wall and a reflective index monitor in the opening or openings, respectively. The reflective index monitor or monitors each measures the infrared reflective index of the reflector plate of the rapid thermal anneal chamber, and sends a corresponding signal to a process controller, an alarm, or both a process controller and an alarm. In the event that the measured reflective index of the reflector plate deviates from the reflective index of a control, the process controller terminates heating operation of the chamber to prevent damage to the semiconductor wafer in the chamber. The alarm may be activated to alert personnel to the need for immediate replacement of the contaminated reflector plate.
Abstract:
A treadmill including: a base seat, a first bracket and a second bracket being respectively pivotally mounted on each of two lateral sides of a front section of the base seat, a damper being disposed between a middle section of each second bracket and a rear end of the base seat; and two tread boards, top ends of the first brackets being respectively pivotally connected under front ends of the tread boards, top ends of the second brackets being respectively pivotally connected under middle sections of the tread boards. When treading the tread boards of the treadmill, a forward travel is achieved. Therefore, a user can use the treadmill just like the user naturally steps forward.
Abstract:
A method for preventing oxide layer peeling in a high temperature annealing process including providing a plurality of spaced apart stacked semiconductor wafers for carrying out a high temperature annealing process including ambient nitrogen gas the plurality of spaced apart stacked semiconductor wafers stacked such that a process surface including an oxide layer of at least one semiconductor wafer is adjacent to a backside surface of another semiconductor wafer said backside surface having a layer of silicon nitride formed thereon prior to carrying out the high temperature annealing process; and, carrying out the high temperature annealing process.
Abstract:
A driving method for a motor includes sensing variation of magnetic pole of a rotator of the motor, to generate a magnetic pole sensing signal, determining dead zone of the motor according to the magnetic pole sensing signal, to generate a determination result, and adjusting voltage outputted to a coil of the rotator according to the determination result.
Abstract:
A novel method for determining whether substrates are correctly positioned on a substrate support in a semiconductor substrate processing or measuring tool for optimum processing or measuring of the substrates. The method includes providing a control substrate; providing alignment marks on the substrate; determining a homing position for the alignment marks on the control substrate wherein the position of the control substrate corresponds to a homing position for optimum processing or measuring of actual substrates; periodically testing the position of the control substrate on the substrate support as facilitated by the substrate transfer and/or substrate positioning equipment of the tool; and determining whether the position of the alignment marks on the control substrate, with respect to the substrate support, stray outside an accepted deviation range.
Abstract:
A novel method for determining whether substrates are correctly positioned on a substrate support in a semiconductor substrate processing or measuring tool for optimum processing or measuring of the substrates. The method includes providing a control substrate; providing alignment marks on the substrate; determining a homing position for the alignment marks on the control substrate wherein the position of the control substrate corresponds to a homing position for optimum processing or measuring of actual substrates; periodically testing the position of the control substrate on the substrate support as facilitated by the substrate transfer and/or substrate positioning equipment of the tool; and determining whether the position of the alignment marks on the control substrate, with respect to the substrate support, stray outside an accepted deviation range.
Abstract:
A discharge-servo curve control method and device for an electrical discharge machine enables multiple discharge-servo curves to be chosen during a machining process in real-time. The control device includes a storage unit, a setting unit, a reading unit, a program unit and an instruction-judging unit capable of swapping control during execution of the program whenever a discharge-servo curve instruction is encountered.