公开(公告)号：US20060281228A1

公开(公告)日：2006-12-14

申请号：US11439250

申请日：2006-05-24

Applicant: Chien-Tang Li ,  Chung-Hsien Yang ,  M. Lin

Inventor： Chien-Tang Li ,  Chung-Hsien Yang ,  M. Lin

IPC: H01L21/00 ,  H01L23/02

CPC classification number: H01L23/49575 ,  H01L23/4951 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A lead-frame type semiconductor package is provided, including: a lead frame having a plurality of long leads and short leads, wherein a chip-attaching area is defined on the plurality of long leads, and at least a portion of each of the long leads within the chip-attaching area is formed with a recess; a chip mounted on the chip-attaching area and covering the recesses; a plurality of bonding wires for electrically connecting the chip to the corresponding long leads and short leads around the chip; and an encapsulant for encapsulating the chip, the plurality of bonding wires, a portion of the long leads and a portion of the short leads, wherein the encapsulant is filled into the recesses and gaps between the long leads, so as to solve a problem of incomplete filling in a conventional package.

Abstract translation: 提供一种引线框架型半导体封装，包括：具有多条长引线和短引线的引线框架，其中，在所述多根长引线上限定芯片附着区域，并且每个长引线的至少一部分 芯片安装区域内的引线形成有凹部; 安装在芯片安装区域上并覆盖凹部的芯片; 多个用于将芯片电连接到芯片周围的相应长引线和短引线的接合线; 以及用于封装芯片的密封剂，多个接合线，长引线的一部分和短引线的一部分，其中密封剂填充到长引线之间的凹部和间隙中，以解决问题 不完全填充常规包装。