公开(公告)号：US07371023B2

公开(公告)日：2008-05-13

申请号：US11151870

申请日：2005-06-13

申请人： Yu-Ying Chan ,  Ching-Lung Wang ,  Wen-Cheng Hsu ,  Tseng-Kui Tseng ,  Chen Kun Teng ,  Ho-Li Hsieh

发明人： Yu-Ying Chan ,  Ching-Lung Wang ,  Wen-Cheng Hsu ,  Tseng-Kui Tseng ,  Chen Kun Teng ,  Ho-Li Hsieh

IPC分类号： G03D5/00

CPC分类号： B08B3/14 ,  G03F7/3092

摘要： An apparatus (100) for processing substrates includes: a substrate cleaning device (20), which cleans the substrates with treating liquid; a developing device (40); and a treating liquid recovery system (30), which is connected with the cleaning device and the developing device. The treating liquid recovery system can convey the treating liquid from the cleaning device to the developing device. Thus the treating liquid that has been used in the cleaning device can be reused in the developing device. Therefore the apparatus can economize on treating liquid and reduce costs.

摘要翻译： 一种用于处理衬底的设备（100），包括：用处理液清洗衬底的衬底清洗装置（20）; 显影装置（40）; 以及与清洁装置和显影装置连接的处理液回收系统（30）。 处理液回收系统可将处理液从清洗装置输送到显影装置。 因此，已经在清洁装置中使用的处理液体可以重新用于显影装置。 因此，该设备可以节省处理液体并降低成本。

公开(公告)号：US20050233076A1

公开(公告)日：2005-10-20

申请号：US11111100

申请日：2005-04-20

申请人： Shao-Ming Hsu ,  Ching-Lung Wang ,  Wen-Cheng Hsu ,  Yu-Ying Chan ,  Tseng-Kuei Tseng ,  Ho-Li Hsieh ,  Chen-Kun Teng

发明人： Shao-Ming Hsu ,  Ching-Lung Wang ,  Wen-Cheng Hsu ,  Yu-Ying Chan ,  Tseng-Kuei Tseng ,  Ho-Li Hsieh ,  Chen-Kun Teng

IPC分类号： C23C14/00 ,  C23C14/32

CPC分类号： H01L21/68735 ,  H01L21/67034 ,  H01L21/6875 ,  H01L21/68757

摘要： An apparatus (20) for supporting a substrate (S2) includes a number of slats (28), a number of connecting blocks (24) separately positioned on the slats, and a number of soft sleeves (22) connected with the connecting blocks, respectively. Because top surfaces of the soft sleeves are shaped as annular, the force applied between the substrate and the soft sleeves is distributed, and is reduced at each contact point. The surface of the substrate is hardly if at all deformed by the soft sleeves, thereby reducing the risk of or even altogether preventing the formation of undulations. The quality of the pattern to be processed is improved.

摘要翻译： 用于支撑基板（S 2）的装置（20）包括多个板条（28），分开定位在板条上的多个连接块（24）和与连接块连接的多个软套筒（22） ， 分别。 由于软套筒的顶面形状为环形，所以施加在基体和软套之间的力分布，并在每个接触点处被减小。 如果通过软套筒变形，基材的表面几乎不变，从而降低或甚至完全防止起伏形成的风险。 要处理的图案的质量得到改善。