公开(公告)号：US06630089B2

公开(公告)日：2003-10-07

申请号：US09861364

申请日：2001-05-18

申请人： Chao-Yueh Chuang

发明人： Chao-Yueh Chuang

IPC分类号： B29C4514

CPC分类号： B29C45/1671 ,  B29C45/14065 ,  B29C45/14344 ,  B29C2045/14131 ,  B29K2705/00 ,  B29L2031/722

摘要： A process for forming a molded plastic layer on a metal plate includes the steps of forming a plurality of posts that extend through and that are bonded to the metal plate in a first mold, placing the metal plate with the posts in a mold cavity of a second mold such that the posts abut against inner wall of the second mold and such that the metal plate partitions the second mold cavity into upper and lower mold sub-cavities, and introducing a resin into the upper and lower mold sub-cavities to form the molded plastic layer which encloses the metal plate.

公开(公告)号：USD354323S

公开(公告)日：1995-01-10

申请号：US8547

申请日：1993-05-20

申请人： Chao-Yueh Chuang

设计人： Chao-Yueh Chuang