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1.发明授权MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same 有权MEMS结构，在单独基板上制造MEMS部件的方法及其组装公开(公告)号：US07719752B2
公开(公告)日：2010-05-18
申请号：US11863079
申请日：2007-09-27
Applicant: Jeffrey Brian Sampsell , Brian James Gally , Philip Don Floyd
Inventor： Jeffrey Brian Sampsell , Brian James Gally , Philip Don Floyd
CPC classification number: G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
Abstract: Methods of fabricating a microelectromechanical systems (MEMS) device with reduced masking and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. In some embodiments in which the MEMS device serves as an interferometric modulator, the front substrate is also provided with black masks to prevent or mitigate bright areas in the actuated state of the MEMS device. Static interferometric modulators can also be formed by shaping or preformation and lamination. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.
Abstract translation: 公开了制造具有减小的掩蔽的微机电系统（MEMS）装置和由其形成的MEMS装置的方法。 在一个实施例中，通过层叠前基板和载体来制造MEMS装置，每个基板具有在其上预成型的部件。 前面基板上设有形成在其上的固定电极。 包括在其上形成的可移动电极的载体附着到前基板。 一些实施例的载体在将可移动电极转移到前基板之后被释放。 在其他实施例中，载体停留在前基板上，并且用作MEMS装置的背板。 特征通过沉积和图案化，通过压花或通过图案化和蚀刻形成。 在其中MEMS器件用作干涉式调制器的一些实施例中，前基板还设置有黑色掩模以防止或减轻MEMS器件的致动状态下的亮区域。 静态干涉式调制器也可以通过成形或预形成和层压形成。 该方法不仅降低了制造成本，而且提供了更高的产量。 所得到的MEMS器件可以在层压基板之间捕获更小的体积，并且不易受压力变化和水分泄漏的影响。
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2.发明申请METHODS OF FABRICATING MEMS WITH SPACERS BETWEEN PLATES AND DEVICES FORMED BY SAME 有权将板与由其形成的器件之间的间隔物制成MEMS的方法公开(公告)号：US20100182675A1
公开(公告)日：2010-07-22
申请号：US12752982
申请日：2010-04-01
Applicant: Jeffrey Brian Sampsell , Brian James Gally , Philip Don Floyd
Inventor： Jeffrey Brian Sampsell , Brian James Gally , Philip Don Floyd
CPC classification number: G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
Abstract: Methods of fabricating a microelectromechanical systems (MEMS) device with spacers between plates and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. Spacers are provided between the front substrate and the backplate to maintain a gap therebetween. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.
Abstract translation: 公开了在其与由其形成的MEMS器件之间制造具有间隔物的微机电系统（MEMS）器件的方法。 在一个实施例中，通过层叠前基板和载体来制造MEMS装置，每个基板具有在其上预成型的部件。 前面基板上设有形成在其上的固定电极。 包括在其上形成的可移动电极的载体附着到前基板。 一些实施例的载体在将可移动电极转移到前基板之后被释放。 在其他实施例中，载体停留在前基板上，并且用作MEMS装置的背板。 特征通过沉积和图案化，通过压花或通过图案化和蚀刻形成。 间隔件设置在前基板和背板之间以在其间保持间隙。 该方法不仅降低了制造成本，而且提供了更高的产量。 所得到的MEMS器件可以在层压基板之间捕获更小的体积，并且不易受压力变化和水分泄漏的影响。
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公开(公告)号：US07704772B2
公开(公告)日：2010-04-27
申请号：US12271793
申请日：2008-11-14
Applicant: Ming-Hau Tung , Brian James Gally , Manish Kothari , Clarence Chui , John Batey
Inventor： Ming-Hau Tung , Brian James Gally , Manish Kothari , Clarence Chui , John Batey
IPC: H01L21/00
CPC classification number: B81C1/00579 , B81B3/0008 , Y10T428/12542
Abstract: A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.
Abstract translation: 一种制造微机电装置的方法包括在基板上形成至少两个导电层。 在两个导电层之间形成隔离层。 导电层电耦合在一起，然后去除隔离层以在导电层之间形成间隙。 这些层的电耦合可减轻或消除在去除过程中静电积累在器件上的影响。
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公开(公告)号：US20050249966A1
公开(公告)日：2005-11-10
申请号：US10839329
申请日：2004-05-04
Applicant: Ming-Hau Tung , Brian James Gally , Manish Kothari , Clarence Chui , John Batey
Inventor： Ming-Hau Tung , Brian James Gally , Manish Kothari , Clarence Chui , John Batey
CPC classification number: B81C1/00579 , B81B3/0008 , Y10T428/12542
Abstract: A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.
Abstract translation: 一种制造微机电装置的方法包括在基板上形成至少两个导电层。 在两个导电层之间形成隔离层。 导电层电耦合在一起，然后去除隔离层以在导电层之间形成间隙。 这些层的电耦合可减轻或消除在去除过程中静电积累在器件上的影响。
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公开(公告)号：US08872085B2
公开(公告)日：2014-10-28
申请号：US12444138
申请日：2007-09-26
Applicant: Russell Wayne Gruhlke , Brian James Gally , Marek Mienko , Ion Bita , Gang Xu
Inventor： Russell Wayne Gruhlke , Brian James Gally , Marek Mienko , Ion Bita , Gang Xu
CPC classification number: G02B6/0051 , G02B6/0053 , G02B26/001
Abstract: In various embodiments described herein, a display device includes a front illumination device that comprises a light guide disposed forward of an array of display elements, such as an array of interferometric modulators, to distribute light across the array of display elements. The light guide panel may include a turning layer to deliver uniform illumination from a light source to the array of display elements. For many portable display applications, the light guide panel comprises the substrate used in fabricating the display elements. The light guide panel may include additional films as well. The light guide panel, for example, may include a diffuser and/or an optical isolation layer to further enhance the optical imaging characteristics of the display.
Abstract translation: 在本文描述的各种实施例中，显示装置包括前照明装置，其包括布置在诸如干涉式调制器阵列之类的显示元件阵列之前的光导，以将光分布在显示元件阵列上。 导光板可以包括转向层，以将来自光源的均匀照明传送到显示元件阵列。 对于许多便携式显示器应用，导光板包括用于制造显示元件的基板。 导光板也可以包括另外的膜。 例如，导光板可以包括扩散器和/或光隔离层，以进一步增强显示器的光学成像特性。
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Patent Agency Ranking
公开(公告)号：US20130100518A1
公开(公告)日：2013-04-25
申请号：US13403640
申请日：2012-02-23
Applicant: Chandra Shekar Reddy Tupelly , Yi Tao , Kostadin Dimitrov Djordjev , Lior Kogut , Brian William Arbuckle , Brian James Gally , Ming-Hau Tung
Inventor： Chandra Shekar Reddy Tupelly , Yi Tao , Kostadin Dimitrov Djordjev , Lior Kogut , Brian William Arbuckle , Brian James Gally , Ming-Hau Tung
CPC classification number: B81B3/0067 , B81B2201/042 , G02B26/001
Abstract: This disclosure provides systems, methods and apparatus for an electromechanical systems device. In one aspect, an electromechanical systems device may include a substrate and a movable layer positioned apart from the substrate. The movable layer and the substrate may define a cavity. The movable layer may be movable to increase the size of the cavity or to decrease the size of the cavity. The movable layer also may include a first anchor point attaching the movable layer to the substrate and a first feature associated with the first anchor point. The first feature may include a protrusion of the movable layer into or out from the cavity.
Abstract translation: 本公开提供了一种用于机电系统装置的系统，方法和装置。 在一个方面，机电系统装置可以包括基板和与基板分开定位的可移动层。 可移动层和基底可以限定空腔。 可移动层可以是可移动的以增加空腔的尺寸或减小空腔的尺寸。 可移动层还可以包括将可移动层附接到基底的第一锚定点和与第一锚点相关联的第一特征。 第一特征可以包括可移动层进入或离开腔的突起。
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7.发明授权Methods of fabricating MEMS with spacers between plates and devices formed by same 有权制造具有由板形成的间隔物的MEMS与由其形成的器件的方法公开(公告)号：US08284475B2
公开(公告)日：2012-10-09
申请号：US12752982
申请日：2010-04-01
Applicant: Jeffrey Brian Sampsell , Brian James Gally , Philip Don Floyd
Inventor： Jeffrey Brian Sampsell , Brian James Gally , Philip Don Floyd
CPC classification number: G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
Abstract: Methods of fabricating a microelectromechanical systems (MEMS) device with spacers between plates and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. Spacers are provided between the front substrate and the backplate to maintain a gap therebetween. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.
Abstract translation: 公开了在其与由其形成的MEMS器件之间制造具有间隔物的微机电系统（MEMS）器件的方法。 在一个实施例中，通过层叠前基板和载体来制造MEMS装置，每个基板具有在其上预成型的部件。 前面基板上设有形成在其上的固定电极。 包括在其上形成的可移动电极的载体附着到前基板。 一些实施例的载体在将可移动电极转移到前基板之后被释放。 在其他实施例中，载体停留在前基板上，并且用作MEMS装置的背板。 特征通过沉积和图案化，通过压花或通过图案化和蚀刻形成。 间隔件设置在前基板和背板之间以在其间保持间隙。 该方法不仅降低了制造成本，而且提供了更高的产量。 所得到的MEMS器件可以在层压基板之间捕获更小的体积，并且不易受压力变化和水分泄漏的影响。
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公开(公告)号：US07164520B2
公开(公告)日：2007-01-16
申请号：US10844819
申请日：2004-05-12
Applicant: Lauren Fay Palmateer , Brian James Gally , William J. Cummings , Manish Kothari , Clarence Chui
Inventor： Lauren Fay Palmateer , Brian James Gally , William J. Cummings , Manish Kothari , Clarence Chui
IPC: G02F1/03
CPC classification number: G02B26/001
Abstract: A package is made of a transparent substrate having an interferometric modulator and a back plate. A non-hermetic seal joins the back plate to the substrate to form a package, and a desiccant resides inside the package. A method of packaging an interferometric modulator includes providing a transparent substrate and manufacturing an interferometric modulator array on a backside of the substrate. A back plate is provided and a desiccant is applied to the back plate. The back plate is sealed to the backside of the substrate with a back seal in ambient conditions, thereby forming a package
Abstract translation: 封装由具有干涉式调制器和背板的透明基板制成。 非气密密封件将背板连接到基板以形成包装，并且干燥剂驻留在包装内。 封装干涉式调制器的方法包括提供透明衬底并在衬底的背面制造干涉式调制器阵列。 设置背板，并将干燥剂施加到背板上。 背板在环境条件下用背密封件密封到基板的背面，从而形成封装
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9.发明授权Methods of fabricating MEMS with spacers between plates and devices formed by same 有权制造具有由板形成的间隔物的MEMS与由其形成的器件的方法公开(公告)号：US08830557B2
公开(公告)日：2014-09-09
申请号：US13608949
申请日：2012-09-10
Applicant: Jeffrey Brian Sampsell , Brian James Gally , Philip Don Floyd
Inventor： Jeffrey Brian Sampsell , Brian James Gally , Philip Don Floyd
CPC classification number: G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
Abstract: Methods of fabricating an electromechanical systems (EMS) device with spacers between plates and EMS devices formed by the same are disclosed. In one embodiment, a EMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier may be released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the EMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. Spacers are provided between the front substrate and the backplate to maintain a gap therebetween. The resulting EMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.
Abstract translation: 公开了制造具有由板形成的间隔物的机电系统（EMS）装置和由其形成的EMS装置的方法。 在一个实施例中，通过层叠前基板和载体来制造EMS装置，每个基板具有预先形成在其上的部件。 前面基板上设有形成在其上的固定电极。 包括在其上形成的可移动电极的载体附着到前基板。 在将可动电极转移到前基板之后，可以释放载体。 在其他实施例中，载体停留在前基板上，并且用作EMS装置的背板。 特征通过沉积和图案化，通过压花或通过图案化和蚀刻形成。 间隔件设置在前基板和背板之间以在其间保持间隙。 所得到的EMS装置可以在层压基板之间捕获较小的体积，并且不易受压力变化和湿气泄漏的影响。
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10.发明申请METHODS OF FABRICATING MEMS WITH SPACERS BETWEEN PLATES AND DEVICES FORMED BY SAME 有权将板与由其形成的器件之间的间隔物制成MEMS的方法公开(公告)号：US20130003160A1
公开(公告)日：2013-01-03
申请号：US13608949
申请日：2012-09-10
Applicant: Jeffrey Brian Sampsell , Brian James Gally , Philip Don Floyd
Inventor： Jeffrey Brian Sampsell , Brian James Gally , Philip Don Floyd
CPC classification number: G02B26/0841 , B81B3/007 , B81B2201/042 , B81B2207/07 , B81B2207/092 , G02B5/284 , G02B26/001 , H01L31/04 , Y10T29/49126
Abstract: Methods of fabricating an electromechanical systems (EMS) device with spacers between plates and EMS devices formed by the same are disclosed. In one embodiment, a EMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier may be released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the EMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. Spacers are provided between the front substrate and the backplate to maintain a gap therebetween. The resulting EMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.
Abstract translation: 公开了制造具有由板形成的间隔物的机电系统（EMS）装置和由其形成的EMS装置的方法。 在一个实施例中，通过层叠前基板和载体来制造EMS装置，每个基板具有预先形成在其上的部件。 前面基板上设有形成在其上的固定电极。 包括在其上形成的可移动电极的载体附着到前基板。 在将可动电极转移到前基板之后，可以释放载体。 在其他实施例中，载体停留在前基板上，并且用作EMS装置的背板。 特征通过沉积和图案化，通过压花或通过图案化和蚀刻形成。 间隔件设置在前基板和背板之间以在其间保持间隙。 所得到的EMS装置可以在层压基板之间捕获较小的体积，并且不易受压力变化和湿气泄漏的影响。
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