Invention Grant
US08284475B2 Methods of fabricating MEMS with spacers between plates and devices formed by same
有权
制造具有由板形成的间隔物的MEMS与由其形成的器件的方法
- Patent Title: Methods of fabricating MEMS with spacers between plates and devices formed by same
- Patent Title (中): 制造具有由板形成的间隔物的MEMS与由其形成的器件的方法
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Application No.: US12752982Application Date: 2010-04-01
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Publication No.: US08284475B2Publication Date: 2012-10-09
- Inventor: Jeffrey Brian Sampsell , Brian James Gally , Philip Don Floyd
- Applicant: Jeffrey Brian Sampsell , Brian James Gally , Philip Don Floyd
- Applicant Address: US CA San Diego
- Assignee: Qualcomm Mems Technologies, Inc.
- Current Assignee: Qualcomm Mems Technologies, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Knobbe Martens Olson & Bear LLP
- Main IPC: G02B26/00
- IPC: G02B26/00 ; G02B26/08

Abstract:
Methods of fabricating a microelectromechanical systems (MEMS) device with spacers between plates and MEMS devices formed by the same are disclosed. In one embodiment, a MEMS device is fabricated by laminating a front substrate and a carrier, each of which has components preformed thereon. The front substrate is provided with stationary electrodes formed thereover. A carrier including movable electrodes formed thereover is attached to the front substrate. The carrier of some embodiments is released after transferring the movable electrodes to the front substrate. In other embodiments, the carrier stays over the front substrate, and serves as a backplate for the MEMS device. Features are formed by deposition and patterning, by embossing, or by patterning and etching. Spacers are provided between the front substrate and the backplate to maintain a gap therebetween. The methods not only reduce the manufacturing costs, but also provide a higher yield. The resulting MEMS devices can trap smaller volumes between laminated substrates and are less susceptible to pressure variations and moisture leakage.
Public/Granted literature
- US20100182675A1 METHODS OF FABRICATING MEMS WITH SPACERS BETWEEN PLATES AND DEVICES FORMED BY SAME Public/Granted day:2010-07-22
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