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    SPUTTERING SYSTEM
    2.
    发明申请
    SPUTTERING SYSTEM 审中-公开
    喷射系统

    公开(公告)号：US20110233049A1

    公开(公告)日：2011-09-29

    申请号：US12674182

    申请日：2008-08-21

    Applicant: Georg Henninger ,  Berno Hunsche ,  Konrad Sell ,  Manfred Ruske ,  Thomas Diederich

    Inventor： Georg Henninger ,  Berno Hunsche ,  Konrad Sell ,  Manfred Ruske ,  Thomas Diederich

    IPC: C23C14/35

    CPC classification number: H01J37/3408 ,  H01J37/32678

    Abstract: The invention relates to a device (10) for sputtering at least one selected materialonto a substrate (5) and bringing about a reaction of this material, comprising a vacuum chamber (11), in which a substrate holder (12) is arranged, at least one magnetron sputtering mechanism (15), which is arranged in a workstation close to the substrate holder (12) and which has a target of the selected material which is suitable for producing a first plasma for sputtering at least one material onto the substrate (5), as well as a secondary plasma mechanism (16) for producing a secondary plasma, which is arranged in the workstation close to the magnetron sputtering mechanism (15) and close to the substrate holder (12), the sputtering mechanism (15) and the secondary plasma mechanism (16) forming a sputtering zone and an activation zone. At least two electromagnets (1, 3) and/or radiallymagnetized toric magnets as well as at least one magnetic multipole (2), which is formed from a plurality of permanent magnets, are arranged to produce magnetic fields to include the secondary plasma. The invention also relates to a method for coating a substrate, in which firstly material is deposited on a substrate by means of a sputtering process and the deposited material then reacts in a plasma, which contains the necessary reactive species, to form a compound, wherein the plasma density and the degree of ionization of the plasma are increased with the aid of magnetic fields, which are produced by at least two electromagnets (1, 3) and/or radially magnetized toric magnets as well as at least one magnetic multipole (2), which is formed from a plurality of permanent magnets.

    Abstract translation: 本发明涉及一种用于溅射至少一种选定材料的衬底（5）的装置（10），并引起该材料的反应，该材料包括其中布置有衬底保持器（12）的真空室（11） 至少一个磁控溅射机构（15），其设置在靠近所述衬底保持器（12）的工作站中并且具有适于产生用于将至少一种材料溅射到所述衬底上的第一等离子体的所选材料的靶 溅射机构（15），以及用于生产二次等离子体的次级等离子体机构（16），其布置在靠近磁控溅射机构（15）并靠近基板保持器（12）的工作站中， 和次级等离子体机构（16）形成溅射区和激活区。 布置有至少两个电磁体（1,3）和/或径向磁化的复曲面磁体以及由多个永磁体形成的至少一个磁多极（2），以产生包括二次等离子体的磁场。 本发明还涉及一种用于涂覆基材的方法，其中首先通过溅射方法将材料沉积在基底上，然后沉积的材料在含有必需的反应性物质的等离子体中反应以形成化合物，其中 借助于由至少两个电磁体（1,3）和/或径向磁化复曲面磁体以及至少一个磁多极（2）产生的磁场，等离子体的等离子体密度和离子化程度增加 ），其由多个永磁体形成。

    LED MODULE
    6.
    发明申请
    LED MODULE 有权
    LED模块

    公开(公告)号：US20110073898A1

    公开(公告)日：2011-03-31

    申请号：US12994867

    申请日：2009-05-29

    Applicant: Hendrik Adrianus Van Sprang ,  Hendrik Johannes Boudewijn Jagt ,  Berno Hunsche ,  Thomas Diederich

    Inventor： Hendrik Adrianus Van Sprang ,  Hendrik Johannes Boudewijn Jagt ,  Berno Hunsche ,  Thomas Diederich

    IPC: H01L33/50

    CPC classification number: H01L33/50 ,  H01L33/44 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05B33/22 ,  H01L2924/00014

    Abstract: The present invention relates to a LED module which converts pump light from a LED chip (120) to light at another wavelength, which is emitted from the module. The conversion takes place in a portion of a luminescent material (124). The color purity of the LED module is enhanced by reducing any leakage of pump light using a reflector in combination with an absorber. In one embodiment, the absorber is integrated as one or several thin absorbing layers between the layers of a multi-layer reflection filter (126); this may yield an even higher reduction of pump light leakage from the module.

    Abstract translation: 本发明涉及将来自LED芯片（120）的泵浦光转换成从模块发射的另一波长的光的LED模块。 转换发生在发光材料（124）的一部分中。 通过使用与吸收器组合的反射器减少泵浦光的任何泄漏来增强LED模块的色纯度。 在一个实施例中，吸收器被集成为多层反射过滤器（126）的层之间的一个或几个薄吸收层; 这可能导致来自模块的泵浦光泄漏更大的降低。

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