Methods for thick film thermoelectric device fabrication

    公开(公告)号:US10217922B2

    公开(公告)日:2019-02-26

    申请号:US15167562

    申请日:2016-05-27

    申请人: Berken Energy LLC

    发明人: Ronald R. Petkie

    摘要: Solid state thermoelectric energy conversion devices can provide electrical energy from heat flow, creating energy, or inversely, provide cooling through applying energy. Thick film methods are applied to fabricate thermoelectric device structures using microstructures formed through deposition and subsequent thermal processing conditions. An advantageous coincidence of material properties makes possible a wide variety of unique microstructures that are easily applied for the fabrication of device structures in general. As an example, a direct bond process is applied to fabricate thermoelectric semiconductor thick films on substrates by printing and subsequent thermal processing to form unique microstructures which can be densified. Bismuth and antimony telluride are directly bonded to flexible nickel substrates.

    Thermal lensing electrode in thermoelectric generators for improved performance

    公开(公告)号:US11552235B2

    公开(公告)日:2023-01-10

    申请号:US16969524

    申请日:2019-11-16

    申请人: Berken Energy LLC

    摘要: Exemplary thermoelectric devices and methods are disclosed herein. Thermoelectric generator performance is increased by the shaping isothermal fields within the bulk of a thermoelectric pellet, resulting in an increase in power output of a thermoelectric generator module. In one embodiment, a thermoelectric device includes a pellet comprising a semiconductor material, a first metal layer surrounding a first portion of the pellet, and a second metal layer surrounding a second portion of the pellet. The first and second metal layers are configured proximate to one another about a perimeter of the pellet. The pellet is exposed at the perimeter. And the perimeter is configured at a sidewall height about the pellet to provide a non-linear effect on a power output of the thermoelectric device by modifying an isotherm surface curvature within the pellet. The device also includes a metal container thermally and electrically bonded to the pellet.

    Methods for thick films thermoelectric device fabrication
    3.
    发明授权
    Methods for thick films thermoelectric device fabrication 有权
    厚膜热电装置制造方法

    公开(公告)号:US09353445B2

    公开(公告)日:2016-05-31

    申请号:US14599227

    申请日:2015-01-16

    申请人: Berken Energy LLC

    发明人: Ronald R. Petkie

    摘要: Solid state thermoelectric energy conversion devices can provide electrical energy from heat flow, creating energy, or inversely, provide cooling through applying energy. Thick film methods are applied to fabricate thermoelectric device structures using microstructures formed through deposition and subsequent thermal processing conditions. An advantageous coincidence of material properties makes possible a wide variety of unique microstructures that are easily applied for the fabrication of device structures in general. As an example, a direct bond process is applied to fabricate thermoelectric semiconductor thick films on substrates by printing and subsequent thermal processing to form unique microstructures which can be densified. Bismuth and antimony telluride are directly bonded to flexible nickel substrates.

    摘要翻译: 固态热电能量转换装置可以从热流提供电能,产生能量,或相反地通过施加能量提供冷却。 应用厚膜方法来制造使用通过沉积和随后的热处理条件形成的微结构的热电装置结构。 材料性质的有利重合使得可以容易地应用于制造器件结构的各种独特的微结构。 例如,通过印刷和随后的热加工来施加直接粘合工艺以在基底上制造热电半导体厚膜以形成可以致密化的独特的微结构。 铋和碲化锑直接结合到柔性镍基底上。

    METHODS FOR THICK FILMS THERMOELECTRIC DEVICE FABRICATION
    4.
    发明申请
    METHODS FOR THICK FILMS THERMOELECTRIC DEVICE FABRICATION 有权
    厚膜热电装置制造方法

    公开(公告)号:US20150132473A1

    公开(公告)日:2015-05-14

    申请号:US14599227

    申请日:2015-01-16

    申请人: Berken Energy LLC

    发明人: Ronald R. Petkie

    IPC分类号: C23C28/00 C23C30/00

    摘要: Solid state thermoelectric energy conversion devices can provide electrical energy from heat flow, creating energy, or inversely, provide cooling through applying energy. Thick film methods are applied to fabricate thermoelectric device structures using microstructures formed through deposition and subsequent thermal processing conditions. An advantageous coincidence of material properties makes possible a wide variety of unique microstructures that are easily applied for the fabrication of device structures in general. As an example, a direct bond process is applied to fabricate thermoelectric semiconductor thick films on substrates by printing and subsequent thermal processing to form unique microstructures which can be densified. Bismuth and antimony telluride are directly bonded to flexible nickel substrates.

    摘要翻译: 固态热电能量转换装置可以从热流提供电能,产生能量,或相反地通过施加能量提供冷却。 应用厚膜方法来制造使用通过沉积和随后的热处理条件形成的微结构的热电装置结构。 材料性质的有利重合使得可以容易地应用于制造器件结构的各种独特的微结构。 例如,通过印刷和随后的热加工来施加直接粘合工艺以在基底上制造热电半导体厚膜以形成可以致密化的独特的微结构。 铋和碲化锑直接结合到柔性镍基底上。

    Thermal lensing electrode in thermoelectric generators for improved performance

    公开(公告)号:US11476401B2

    公开(公告)日:2022-10-18

    申请号:US16992980

    申请日:2020-08-13

    申请人: Berken Energy LLC

    摘要: Exemplary thermoelectric devices and methods are disclosed herein. Thermoelectric generator performance is increased by the shaping isothermal fields within the bulk of a thermoelectric pellet, resulting in an increase in power output of a thermoelectric generator module. In one embodiment, a thermoelectric device includes a pellet comprising a semiconductor material, a first metal layer surrounding a first portion of the pellet, and a second metal layer surrounding a second portion of the pellet. The first and second metal layers are configured proximate to one another about a perimeter of the pellet. The pellet is exposed at the perimeter. And the perimeter is configured at a sidewall height about the pellet to provide a non-linear effect on a power output of the thermoelectric device by modifying an isotherm surface curvature within the pellet. The device also includes a metal container thermally and electrically bonded to the pellet.

    THERMAL LENSING ELECTRODE IN THERMOELECTRIC GENERATORS FOR IMPROVED PERFORMANCE

    公开(公告)号:US20210005803A1

    公开(公告)日:2021-01-07

    申请号:US16992980

    申请日:2020-08-13

    申请人: Berken Energy LLC

    IPC分类号: H01L35/32 H01L35/34 H01L35/08

    摘要: Exemplary thermoelectric devices and methods are disclosed herein. Thermoelectric generator performance is increased by the shaping isothermal fields within the bulk of a thermoelectric pellet, resulting in an increase in power output of a thermoelectric generator module. In one embodiment, a thermoelectric device includes a pellet comprising a semiconductor material, a first metal layer surrounding a first portion of the pellet, and a second metal layer surrounding a second portion of the pellet. The first and second metal layers are configured proximate to one another about a perimeter of the pellet. The pellet is exposed at the perimeter. And the perimeter is configured at a sidewall height about the pellet to provide a non-linear effect on a power output of the thermoelectric device by modifying an isotherm surface curvature within the pellet. The device also includes a metal container thermally and electrically bonded to the pellet.

    METHODS FOR THICK FILM THERMOELECTRIC DEVICE FABRICATION
    7.
    发明申请
    METHODS FOR THICK FILM THERMOELECTRIC DEVICE FABRICATION 审中-公开
    厚膜热电装置制造方法

    公开(公告)号:US20160276567A1

    公开(公告)日:2016-09-22

    申请号:US15167562

    申请日:2016-05-27

    申请人: Berken Energy LLC

    发明人: Ronald R. Petkie

    摘要: Solid state thermoelectric energy conversion devices can provide electrical energy from heat flow, creating energy, or inversely, provide cooling through applying energy. Thick film methods are applied to fabricate thermoelectric device structures using microstructures formed through deposition and subsequent thermal processing conditions. An advantageous coincidence of material properties makes possible a wide variety of unique microstructures that are easily applied for the fabrication of device structures in general. As an example, a direct bond process is applied to fabricate thermoelectric semiconductor thick films on substrates by printing and subsequent thermal processing to form unique microstructures which can be densified. Bismuth and antimony telluride are directly bonded to flexible nickel substrates.

    摘要翻译: 固态热电能量转换装置可以从热流提供电能,产生能量,或相反地通过施加能量提供冷却。 应用厚膜方法来制造使用通过沉积和随后的热处理条件形成的微结构的热电装置结构。 材料性质的有利重合使得可以容易地应用于制造器件结构的各种独特的微结构。 例如,通过印刷和随后的热加工来施加直接粘合工艺以在基底上制造热电半导体厚膜以形成可以致密化的独特的微结构。 铋和碲化锑直接结合到柔性镍基底上。