公开(公告)号：US20240419844A1

公开(公告)日：2024-12-19

申请号：US18821607

申请日：2024-08-30

Applicant: Kapil Sood ,  Arie Aharon ,  Asher M. Altman ,  Venkidesh Krishna Iyer ,  Eli Kupermann ,  Pere Monclus ,  Lokpraveen Bhupathy Mosur ,  Yanai Moyal ,  Nicholas G. Ross

Inventor： Kapil Sood ,  Arie Aharon ,  Asher M. Altman ,  Venkidesh Krishna Iyer ,  Eli Kupermann ,  Pere Monclus ,  Lokpraveen Bhupathy Mosur ,  Yanai Moyal ,  Nicholas G. Ross

IPC: G06F21/72 ,  G06F21/60 ,  G06F21/64

Abstract: Systems, apparatus, articles of manufacture, and methods are disclosed for confidential computing security management for a multi-chiplet, multi-accelerator system-in-package. An example multi-die System-In-Package (SiP) includes a first die including a circuit. Additionally, the example multi-die SiP includes a second die to authenticate the circuit to permit secure communication within the SiP.