Invention Application
- Patent Title: CONFIDENTIAL COMPUTING SECURITY MANAGEMENT FOR A MULTI-CHIPLET, MULTI-ACCELERATOR SYSTEM-IN-PACKAGE
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Application No.: US18821607Application Date: 2024-08-30
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Publication No.: US20240419844A1Publication Date: 2024-12-19
- Inventor: Kapil Sood , Arie Aharon , Asher M. Altman , Venkidesh Krishna Iyer , Eli Kupermann , Pere Monclus , Lokpraveen Bhupathy Mosur , Yanai Moyal , Nicholas G. Ross
- Applicant: Kapil Sood , Arie Aharon , Asher M. Altman , Venkidesh Krishna Iyer , Eli Kupermann , Pere Monclus , Lokpraveen Bhupathy Mosur , Yanai Moyal , Nicholas G. Ross
- Applicant Address: US WA Washougal; US OR Portland; US MA Bedford; US AZ Chandler; IL Maale Adumim; US CA Morgan Hill; US AZ Gilbert; IL Jerusalem; US CA Lake Forest
- Assignee: Kapil Sood,Arie Aharon,Asher M. Altman,Venkidesh Krishna Iyer,Eli Kupermann,Pere Monclus,Lokpraveen Bhupathy Mosur,Yanai Moyal,Nicholas G. Ross
- Current Assignee: Kapil Sood,Arie Aharon,Asher M. Altman,Venkidesh Krishna Iyer,Eli Kupermann,Pere Monclus,Lokpraveen Bhupathy Mosur,Yanai Moyal,Nicholas G. Ross
- Current Assignee Address: US WA Washougal; US OR Portland; US MA Bedford; US AZ Chandler; IL Maale Adumim; US CA Morgan Hill; US AZ Gilbert; IL Jerusalem; US CA Lake Forest
- Main IPC: G06F21/72
- IPC: G06F21/72 ; G06F21/60 ; G06F21/64
Abstract:
Systems, apparatus, articles of manufacture, and methods are disclosed for confidential computing security management for a multi-chiplet, multi-accelerator system-in-package. An example multi-die System-In-Package (SiP) includes a first die including a circuit. Additionally, the example multi-die SiP includes a second die to authenticate the circuit to permit secure communication within the SiP.
Information query
