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公开(公告)号：US20230174739A1
公开(公告)日：2023-06-08
申请号：US17923943
申请日：2020-06-25
申请人： ACT CO., LTD.
发明人： Akihisa OKUMURA , Hideki SHIBATA
CPC分类号： C08J11/28 , C01B32/05 , B09B3/50 , B09B3/40 , B09B3/70 , C08J2323/12 , B09B2101/75
摘要： An organic waste recycling apparatus comprises: a catalyst for making the carbonization of an organic waste targeted for waste disposal; a UV irradiation member for irradiating UV at a wavelength capable of breaking a bond in a molecule constituting the organic waste; a processed object housing member whereof the interior space houses the catalyst; a heating member provided in the interior space; and a stirring member provided in the interior space. The organic waste is one that has undergone crushing into small pieces. The processed object housing member is such that the catalyst and the organic waste that has been UV-irradiated by the UV irradiation member and introduced into the interior space are in contact with one another and stirrable in this state by the stirring member.
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公开(公告)号：US20230113829A1
公开(公告)日：2023-04-13
申请号：US17959584
申请日：2022-10-04
发明人： HIROKO ISODA , SHINJI KONDO , FARHANA FERDOUSI , MASAHITO ISHIKAWA , YOUKO WATANABE , KEN YAMAUCHI , MIKI YOKOZAWA
IPC分类号： A61K36/63 , A61K31/7048 , A61K8/9789 , A61Q19/00 , A61P7/06 , C12N5/0789 , A23L33/105
摘要： The invention provides an HIF-1 activator for treatment, prevention, alleviation, improvement or recovery from diseases or symptoms associated with reduced HIF-1 activity, as well as a pharmaceutical composition, cosmetic and food composition comprising the activator. Provided is an HIF-1 activator comprising olive leaf extract. Also provided is an HIF-1 activator which is for maintaining the undifferentiated state of stem cells via HIF-1 activation and/or improving dysdifferentiation of stem cells.
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公开(公告)号：US20220231495A1
公开(公告)日：2022-07-21
申请号：US17623118
申请日：2020-06-25
申请人： SAMWON ACT CO., LTD.
发明人： Kyung Wook LEE , Kyung Yul LEE , Hong Suk HAN , Jae Sung CHOI
摘要： The present invention has the following configuration. The present invention relates to a wirable bracket attached to a wall body, the bracket being characterized by comprising: a rib which is bound to an upper portion of the bracket by inserting a metal panel; and a wiring part inserted into a hollow space section formed in the rib.
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公开(公告)号：US20210102381A1
公开(公告)日：2021-04-08
申请号：US16971134
申请日：2019-02-21
申请人： SAMWON ACT CO., LTD.
发明人： Kyung Wook Lee , Kyung Yul Lee , Hong Suk Han
摘要： The present disclosure relates to interior material attachment structure with wall attachment part bolt grooves, including: binding protrusions formed at the outermost part of the interior material attachment structure in order to attach the metal interior material; and connection part grooves formed adjacent to the binding protrusions in order to connect the plurality of interior material attachment structures to each other.
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公开(公告)号：US20220356715A1
公开(公告)日：2022-11-10
申请号：US17623140
申请日：2020-06-25
申请人： SAMWON ACT CO., LTD.
发明人： Kyung Wook LEE , Kyung Yul LEE , Hong Suk HAN , Jae Sung CHOI
摘要： The present invention has the following features. The present invention relates to a flammable flame-proof material provided with a metal material, comprising a metal material and a non-flame-proof-treated thin film sheet on the top of the metal material, wherein an adhesive agent is between the metal material and the non-flame-proof-treated thin film sheet, and relates to an attachment structure for attaching a metal plate with a flammable thin-film construction interior material.
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公开(公告)号：US20220010445A1
公开(公告)日：2022-01-13
申请号：US17295007
申请日：2019-11-27
申请人： SAMWON ACT CO., LTD.
发明人： Kyung Yul LEE , Kwang Jong CHOI , Heung Hyeon SONG , Eun Yoo CHOI
摘要： Disclosed is a circuit pattern continuous manufacturing device capable of quickly manufacturing a circuit pattern having a sufficient thickness. The circuit pattern continuous manufacturing device may include: an unwinder configured to unwind a transfer film to be horizontally unfolded; a rotary drum-type continuous electroforming part configured to form a circuit pattern having a first metal layer on the surface of a rotating cathode drum through electroforming; a continuous transfer part configured to transfer the circuit pattern, formed on the surface of the cathode drum of the rotary drum-type continuous electroforming part, onto the transfer film; a first horizontal plating path configured to additionally plate the circuit pattern, transferred onto the transfer film, with a second metal layer made of the same metal as the rotary drum-type continuous electroforming part; and a rewinder configured to rewind the transfer film.
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公开(公告)号：US11840844B2
公开(公告)日：2023-12-12
申请号：US17371260
申请日：2021-07-09
申请人： SAMWON ACT CO., LTD.
发明人： Kyung Wook Lee , Kyung Yul Lee , Hong Seok Han
IPC分类号： E04F13/08
CPC分类号： E04F13/0833 , E04F13/0885
摘要： The present disclosure has the following configurations. The present disclosure relates to a unit bracket in a square shape, in which outer surfaces of four surfaces of the unit bracket are formed with locking projections configured to insert a metal or plastic panel, and a center portion of the unit bracket is formed with a mesh part to be formed such that the bonding is possible at a vertical tensile strength and a horizontal tensile strength having desired forces even if the unit bracket and a wall or a base material are bonded with an adhesive, in order to bond the unit bracket to the wall or the base material.
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公开(公告)号：US20190029124A1
公开(公告)日：2019-01-24
申请号：US16069893
申请日：2017-01-09
发明人： Kyung Yul LEE , Kyung Wook LEE , Jun Sang JEONG , Yang Seok LEE , Man KIM , Joo Yul LEE , Sang Yeoul LEE
摘要： The present invention relates to a circuit board including: a base board having a circuit region and a terminal region; a circuit pattern formed on an upper portion of the base board; and a low-melting-metal layer formed on an upper portion of the circuit pattern. A circuit board capable of reducing manufacturing time and manufacturing costs may be manufactured by omitting a photoresist process.
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公开(公告)号：USD730056S1
公开(公告)日：2015-05-26
申请号：US29459729
申请日：2013-07-02
申请人： ACT Co. Ltd.
设计人： Shinji Nishimoto
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公开(公告)号：USD712150S1
公开(公告)日：2014-09-02
申请号：US29459733
申请日：2013-07-02
申请人： ACT Co. Ltd.
设计人： Shinji Nishimoto
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