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公开(公告)号：US20230215612A1
公开(公告)日：2023-07-06
申请号：US17714167
申请日：2022-04-06
发明人： Hai GUO , Shengcheng XIA , Qintian HOU
CPC分类号： H01F27/022 , H01F27/266 , H01F27/29 , H01F41/0246 , H01F41/04
摘要： Disclosed is a nonlinear inductor, a manufacturing method thereof, and a nonlinear inductor row. The nonlinear inductor includes two magnetic core assemblies, a conductor and a magnetic plastic encapsulation layer; the magnetic core assemblies include magnetic cores; each magnetic core includes a flange and a central column arranged on the flange; two central columns of the two magnetic core assemblies are opposite to each other; a non-uniform air gap exists between the two central columns and/or the magnetic core assemblies are made of different materials; the conductor is arranged on the two central columns; the two magnetic core assemblies and the conductor are located in the magnetic plastic encapsulation layer; electrode parts of the conductor are exposed outside the magnetic plastic encapsulation layer; and the magnetic core assemblies and the magnetic plastic encapsulation layer are made of different materials; thereby the nonlinear inductor has stepped saturation characteristics.
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公开(公告)号：US10679780B2
公开(公告)日：2020-06-09
申请号：US15865200
申请日：2018-01-08
摘要： A composite soft magnetic material includes the following components: 67.9 to 95.54 wt % of FeSiCr, 0.1 to 0.3 wt % of TiO2, 0.15 to 0.75 wt % of SiO2, 0.1 to 0.5 wt % of Mn3O4, 0.1 to 0.5 wt % of ZnO, 3.4 to 25.9 wt % of BaO, 0.4 to 3 wt % of B2O3, 0.2 to 0.85 wt % of CaO, and 0.01 to 0.3 wt % of CuO. The composite soft magnetic material has high initial permeability and high Bs, excellent temperature stability, and low temperature coefficient.
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公开(公告)号：US12100543B2
公开(公告)日：2024-09-24
申请号：US17238224
申请日：2021-04-23
发明人： Yingying Wang , Xinshu Yu , Shengcheng Xia , Youyun Li , Xin Che
CPC分类号： H01F27/346 , H01F27/24 , H01F27/29 , H01F27/33 , H01F41/0246 , H01F41/04
摘要： A molded-forming power inductor comprises a conductor, a magnetic core and a magnetic molding package layer, wherein the conductor comprises an integrally formed insulation-processed base part, an insulation-processed side enclosing part and an electrode part, the base part and the side enclosing part are assembled with the magnetic core in a gapless fit mode, and the magnetic molding package layer is gaplessly wrapped outside the conductor and the magnetic core. A method is provided for manufacturing the molded-forming power inductor. The molding package layer completely covers the prefabricated magnetic core and a part of the conductor except the electrode, the structure is integrally formed, and the leakage magnetic flux is less; when the equivalent magnetic permeability is 60 or more, the equivalent saturation magnetic flux density can be 0.55 T or higher; and the space utilization rate is high to facilitate miniaturization of an inductor design.
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公开(公告)号：US20230162903A1
公开(公告)日：2023-05-25
申请号：US17707933
申请日：2022-03-29
发明人： Hai GUO , Shengcheng XIA , Qintian HOU
CPC分类号： H01F27/06 , H01F27/292 , H01F41/0233 , H01F2027/065
摘要： An inductor with the special-shaped structure includes an inductor main body and a pair of supporting legs fixed below the inductor main body, wherein the pair of supporting legs is conductors and is electrically connected to a pair of electrodes of the inductor main body, and the pair of supporting legs is configured to support the inductor main body during installation, so that a gap space is left below the inductor main body. Due to the unique structural design of the inductor in the present invention, the utilization ratio of the area of the PCB can be effectively increased, and the inductor is particularly suitable for very-high-density component installation on the PCB during power application. Moreover, by changing relative positions of the supporting legs, lower cavities with different sizes may be formed below the inductor main body, thereby facilitating optimal design for meeting different demands.
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公开(公告)号：US20220115176A1
公开(公告)日：2022-04-14
申请号：US17412228
申请日：2021-08-25
发明人： Dafu LU , Jieyong QIN , Zhenren LIANG , Shuyan LI
摘要： A laminated electronic device includes a laminate wherein the laminate includes a plurality of laminated insulator layers, the laminate has a multi-layer coil pattern provided between the plurality of insulator layers in a laminated manner, adjacent layers of the coil pattern are electrically connected through conductive via holes to form an internal coil, a first external electrode and a second external electrode are disposed on a bottom surface of the laminate which is parallel to a direction of lamination. In surface-mounting of the laminated electronic device, it only needs to connect the external electrodes on the bottom surface of the laminate to a soldering board, and needs not to preserve a space for solder wicking in the surrounding, thereby significantly saving the occupied space of surface mount components to achieve high-density mounting; in addition, the Q value of the product is improved.
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公开(公告)号：US11854735B2
公开(公告)日：2023-12-26
申请号：US17200887
申请日：2021-03-14
发明人： Qiang Su , Youyun Li , Shengcheng Xia , Xinshu Yu
IPC分类号： H01F27/29 , H01F27/30 , H01F41/061 , H01F27/24 , H01F27/28
CPC分类号： H01F27/306 , H01F27/24 , H01F27/2823 , H01F27/29 , H01F41/061
摘要： A winding structure includes a coil having a wire wrap and two wire tails, and a magnetic core having a center column, a flange, four wire-hanging parts and two bosses; the center column is connected at a top surface of the flange, the first boss is disposed in the middle of a first side of the flange, and the second boss is symmetrical to the first boss; transition surfaces of wire-hanging parts to a bottom surface of the flange are chamfered surfaces; first to fourth sections of the first wire tail are sequentially attached to the first wire-hanging part and the first chamfered surface, the bottom surface of the flange, the third chamfered surface, the third wire-hanging part, and the top surface of the flange; first to fourth sections of the second wire tail are symmetrical to first to fourth sections of the first wire tail, respectively.
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公开(公告)号：US11657947B2
公开(公告)日：2023-05-23
申请号：US15931609
申请日：2020-05-14
发明人： Wenjie Wang , Dafu Lu
CPC分类号： H01F27/24 , H01F27/292 , H01F41/0233 , H01L23/495 , H01L24/48 , H01L24/73 , H01L25/16 , H01L2224/48463 , H01L2924/30107
摘要： A switching power supply module includes a power inductor which includes a magnetic core and L-shaped metal end electrodes and a switching power supply chip which includes a packaging body, a bare chip and a bottom bonding pad of the bare chip; the L-shaped metal end electrode includes a first electrode part which is welded at 90° to the magnetic core and a second electrode part which extends in parallel from the first electrode part to the middle of the magnetic core and is perpendicular to the first electrode part; the bare chip and the packaging body are embedded between the first, the second electrode part and the magnetic core; the bottom bonding pad abuts between the two second electrode parts and is insulated from the second electrode part, and the weld face of the bottom bonding pad is flush with that of the second electrode part.
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公开(公告)号：US20220172884A1
公开(公告)日：2022-06-02
申请号：US17527189
申请日：2021-11-16
发明人： Deping ZENG , Hui LIN , Xiaohu TANG , Qunsheng ZHOU , Wei XIE , Yongming HE
IPC分类号： H01F27/29 , H01F27/255 , H01F1/34 , H01F41/02 , H01F41/04
摘要： A surface-mounted transformer includes an adhesive layer and a winding product. The winding product is disposed inside the adhesive layer; the winding product includes an I-shaped magnetic core and a coil wound on a middle pillar of the I-shaped magnetic core; leading-out ends of the coil are connected to electrodes; the electrodes are exposed on the surface of the adhesive layer; and the adhesive layer is obtained through compression molding forming of a magnetic molding material. Compared with a surface-mounted transformer in the prior art, which has equal performance indexes, the surface-mounted transformer has a smaller size with a decrease proportion of over 50%; and a BOBBIN and an insulating rubber tape do not need to be used in processing. The winding product in the surface-mounted transformer is completely covered by the adhesive layer, so that the product is high in reliability and can support a PSIP plastic package environment.
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公开(公告)号：US20220157515A1
公开(公告)日：2022-05-19
申请号：US17200887
申请日：2021-03-14
发明人： Qiang SU , Youyun LI , Shengcheng XIA , Xinshu YU
IPC分类号： H01F27/30 , H01F27/24 , H01F27/28 , H01F41/061
摘要： A winding structure includes a coil having a wire wrap and two wire tails, and a magnetic core having a center column, a flange, four wire-hanging parts and two bosses; the center column is connected at a top surface of the flange, the first boss is disposed in the middle of a first side of the flange, and the second boss is symmetrical to the first boss; transition surfaces of wire-hanging parts to a bottom surface of the flange are chamfered surfaces; first to fourth sections of the first wire tail are sequentially attached to the first wire-hanging part and the first chamfered surface, the bottom surface of the flange, the third chamfered surface, the third wire-hanging part, and the top surface of the flange; first to fourth sections of the second wire tail are symmetrical to first to fourth sections of the first wire tail, respectively.
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公开(公告)号：US20220093320A1
公开(公告)日：2022-03-24
申请号：US17540256
申请日：2021-12-02
发明人： Xiaoyue ZHA , Guo OUYANG , Jingjing REN
摘要： Disclosed is a PCB of a planar transformer including: a PCB substrate with a through hole and a double-sided winding part formed on double sides of the PCB substrate, wherein the double-sided winding part is of a symmetric structure, a via hole consistent with the through hole is formed in the center of the double-sided winding part, the via hole is aligned to the through hole to form a magnetic core hole, and the circumference of the via hole is raised to form wire blocking parts; and forming a wire passing groove in the wall of the magnetic core hole, wherein the wire passing groove allows a metal conducting wire to pass through to be planarly wound from inside to outside on double sides of the double-sided winding part at the same time so as to form two coils in series located on the double sides of the PCB substrate.
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