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1.发明申请OXIDATION OF COPPER IN A COPPER ETCHING SOLUTION BY THE USE OF OXYGEN AND/OR AIR AS AN OXIDIZING AGENT 有权通过使用氧气和/或空气作为氧化剂在铜蚀刻溶液中氧化铜公开(公告)号：US20170022616A1
公开(公告)日：2017-01-26
申请号：US15301181
申请日：2015-04-01
Applicant: SIGMA ENGINEERING AB
Inventor： Mats ANDERSSON
Abstract: The present invention relates to a process of oxidizing copper in a copper etching solution by using oxygen gas and/or air as an oxidizing agent, the process comprising the steps of: a) introducing the oxidizing agent into an acidic reduced copper etching solution comprising Cl− and Cu+, b) stirring the solution obtained in step a), and thereby allowing the reaction 2Cu++½O2 (aq)+2H+→2Cu2++H2O to occur, thereby producing an oxidized copper etching solution comprising less Cu+ than the reduced copper etching solution. An advantage of the present invention is that it provides an improved process at least in terms of the speed of the oxidation and the quality of the etching.
Abstract translation: 本发明涉及一种通过使用氧气和/或空气作为氧化剂在铜蚀刻溶液中氧化铜的方法，该方法包括以下步骤：a）将氧化剂引入到包含Cl的酸性还原铜蚀刻溶液中 - 和Cu +，b）搅拌步骤a）中获得的溶液，从而使反应2Cu ++½O2（aq）+ 2H +→2Cu2 ++ H2O发生，从而产生包含比还原的更少的Cu +的氧化铜蚀刻溶液 铜蚀刻溶液。 本发明的一个优点是至少在氧化速度和蚀刻质量方面提供了一种改进的方法。
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公开(公告)号：US09920434B2
公开(公告)日：2018-03-20
申请号：US15301181
申请日：2015-04-01
Applicant: SIGMA ENGINEERING AB
Inventor： Mats Andersson
Abstract: The present invention relates to a process of oxidizing copper in a copper etching solution by using oxygen gas and/or air as an oxidizing agent, the process comprising the steps of: a) introducing the oxidizing agent into an acidic reduced copper etching solution comprising Cl− and Cu+, b) stirring the solution obtained in step a), and thereby allowing the reaction 2Cu++½O2 (aq)+2H+→2Cu2++H2O to occur, thereby producing an oxidized copper etching solution comprising less Cu+ than the reduced copper etching solution. An advantage of the present invention is that it provides an improved process at least in terms of the speed of the oxidation and the quality of the etching.
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公开(公告)号：US08236189B2
公开(公告)日：2012-08-07
申请号：US12665960
申请日：2008-07-07
Applicant: Harald Ottertun
Inventor： Harald Ottertun
CPC classification number: C23F1/46 , B01D11/0457 , C23F1/18 , H05K3/068
Abstract: An etching and recovery method is described, wherein articles made of copper are etched with an acid aqueous solution of etching chemicals containing Cu2+ for oxidizing Cu0 to Cu+, chloride ions, oxidizing agent which oxidizes Cu+ to Cu2+, and pH-adjusting hydrochloric acid. The technical problem to be solved is to make it possible to circulate the etching solution between the etching process and the recovery process during the recovery of used etching solution in such a manner that a closed circuit can be maintained between the processes. This is effected in that a regenerated etching solution containing a lower quantity of Cu2+ than the used etching solution is produced and in that the recovery process has an extraction step in which removed etching solution is mixed with an organic extraction solution of a complexing compound with which Cu2+ forms a copper complex which can be extracted in the organic extraction solution, after which the two mixed liquids are separated once again in order to obtain an organic extraction solution containing said copper complex, and regenerated etching solution. The method is carried out with an etching solution having a pH above 1.5 and a high copper content.
Abstract translation: 描述了一种蚀刻和回收方法，其中用铜氧化CuO至Cu +的氯化物离子，氧化Cu 2+至Cu 2+的氧化剂和pH调节盐酸的含Cu2 +的腐蚀化学品的酸性水溶液蚀刻由铜制成的制品。 要解决的技术问题是使得可以在蚀刻工艺和恢复过程之间循环蚀刻溶液，这是在这些工艺之间可以保持闭合电路的方法。 这是因为产生了比所使用的蚀刻溶液含有较少量的Cu 2+的再生蚀刻溶液，并且回收工艺具有萃取步骤，其中将去除的蚀刻溶液与络合化合物的有机萃取溶液混合， Cu2 +形成可以在有机萃取溶液中萃取的铜络合物，然后再次分离两种混合液体，以获得含有铜络合物的有机萃取溶液和再生蚀刻溶液。 该方法用pH高于1.5且铜含量高的蚀刻溶液进行。
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