公开(公告)号：US11906571B2

公开(公告)日：2024-02-20

申请号：US17700441

申请日：2022-03-21

申请人： MPI CORPORATION

发明人： Chien-Yu Chen ,  Po-Han Peng

IPC分类号： G01R31/26 ,  G02B5/00 ,  H01S5/02212 ,  H01S5/00

CPC分类号： G01R31/2635 ,  G02B5/005 ,  H01S5/0085 ,  H01S5/02212

摘要： An optical detection system and a laser providing module without using an optical fiber thereof are provided. The optical detection system includes a carrier module, a laser light providing module, and an electrical detection module. The carrier module is configured to carry a plurality of photodiodes. The laser light providing module is disposed above the carrier module. The electrical detection module is adjacent to the carrier module. The laser light providing module is configured to convert a laser light source into a plurality of laser light beams, thereby simultaneously and respectively exciting two corresponding ones of the photodiodes. The electrical detection module is configured to simultaneously and electrically contact the corresponding photodiodes so as to obtain an electrical signal generated by each of the photodiodes.

公开(公告)号：US11536765B2

公开(公告)日：2022-12-27

申请号：US16892076

申请日：2020-06-03

申请人： MPI Corporation

发明人： Kang-Yen Fu ,  Ya-Hung Lo ,  Shou-Jen Tsai ,  Wei-Cheng Ku

IPC分类号： G01R31/28 ,  H01L21/67 ,  G01R1/073

摘要： A probing apparatus includes a frame, a testing device, a rotatable testing platform, and a probe module. The testing device is disposed on the frame and is displaceable along an X direction and a Y direction perpendicular to the X direction. The rotatable testing platform is disposed on the frame and is rotatable around a rotating axis extending in the X direction. A direction perpendicular to the X direction and the Y direction is a Z direction, and the rotatable testing platform and the testing device are located at different positions of the Z direction. The probe module is disposed on the rotatable testing platform.

公开(公告)号：US11460498B2

公开(公告)日：2022-10-04

申请号：US17034741

申请日：2020-09-28

申请人： MPI CORPORATION

发明人： Yang-Hung Cheng ,  Ya-Hung Lo ,  Chien-Hsun Chen ,  Chia-Nan Chou ,  Chung-Yen Huang ,  Shou-Jen Tsai ,  Fuh-Chyun Tang

IPC分类号： G01R31/28 ,  G01R1/073

摘要： An adjustable probe device includes fixed and movable probes, at least one of which is a signal probe having a coaxial structure. The movable probe is linearly slidable with a ground unit thereof abutted against a ground unit of the fixed probe. Another adjustable probe device includes a first movable probe for being grounded, and fixed and second movable probes both having a coaxial structure. Any of the two movable probes is selectable to be a functioning probe in a way that the contact ends of the functioning and fixed probes are located on a same plane for contacting two pads of a DUT at the same time, and the functioning probe is linearly slidable with a ground unit thereof abutted against a ground unit of the fixed probe. As a result, the probe interval is adjustable, lowering the cost of the impedance testing apparatus for circuit boards.

公开(公告)号：US20220299564A1

公开(公告)日：2022-09-22

申请号：US17699610

申请日：2022-03-21

申请人： MPI CORPORATION

发明人： YI-HSUAN CHENG ,  HUNG-I LIN ,  PO-HAN PENG

IPC分类号： G01R31/28 ,  G01R1/067 ,  G01R1/073

摘要： A wafer inspection system includes a supporting device having electrically connected supporting and contact portions for supporting a wafer's back, and a probe device having a probe and elastic contact members. When a probe tip of the probe contacts the wafer's front, a contact tip of the elastic contact member is abutted against a contact surface of the contact portion. The contact tip is higher than the probe tip. The contact surface is higher than the wafer's front. Alternatively, the contact surface having a radius larger than or equal to twice the wafer's radius. The horizontal distance between the probe tip and the contact tip is larger than or equal to twice the wafer's radius. This satisfies the test requirement of short-pulse test signal and prevents the structural design and transmitting stability of the elastic contact members from being affected by the inspection temperature.

公开(公告)号：US11348221B2

公开(公告)日：2022-05-31

申请号：US17079030

申请日：2020-10-23

申请人： MPI Corporation

发明人： Chien-Yu Chen ,  Han-Yu Chuang ,  Po-Han Peng

IPC分类号： G01N21/95 ,  G06T7/00

摘要： A wafer testing method adapted to test a thin wafer. The thin wafer is combined with a vacuum-release substrate to form a wafer-assembly, and the wafer-assembly is placed in a wafer cassette. The vacuum-release substrate is attached to a front surface of the wafer with an attaching force which is sensitive to air pressure. The method includes the following steps. First, taking out the wafer-assembly from the wafer cassette, then transferring the wafer-assembly to a warpage-detection-device and placing the wafer-assembly on a first stage of the warpage-detection-device. Then, detecting warpage of the wafer. If the warpage of the wafer is less than a warpage threshold, the wafer-assembly is taken out from the first stage, and the wafer-assembly is turned over to place the wafer-assembly on a second stage. Then, applying negative pressure to the vacuum-release substrate to eliminate the attaching force. Then, removing the vacuum-release substrate.

公开(公告)号：US11346789B2

公开(公告)日：2022-05-31

申请号：US17117477

申请日：2020-12-10

申请人： MPI CORPORATION

发明人： Ping-Ying Wu ,  Chiu-Wang Chen ,  Yung-Chin Liu

IPC分类号： G01N21/88

摘要： An optical inspection system includes a brightness inspection module for inspecting the brightness of a light emitting element, an integrated inspection module for inspecting the near field optical characteristic and the beam quality factor of the light emitting element, and a far field inspection module for inspecting the far field optical characteristic of the light emitting element. As a result, the optical inspection system is space-saving and capable of reducing the distance and time of the movement of the device under test.

公开(公告)号：US20220155365A1

公开(公告)日：2022-05-19

申请号：US17524788

申请日：2021-11-12

申请人： MPI Corporation

发明人： Volker Hansel ,  Sebastian Giessmann ,  Frank Fehrmann ,  Chien-Hung Chen

IPC分类号： G01R31/28 ,  H01L21/66

摘要： A semiconductor inspecting method for ensuring a scrubbing length on a pad includes following steps. First off, a first position of a probe needle from above is defined. In addition, a wafer comprising at least a pad is placed on a wafer chuck of a semiconductor inspecting system. Thereafter, a relative vertical movement between the probe needle and the pad is made by adopting a driving system of the semiconductor inspecting system to generate a scrubbing length on the pad. Next, whether the scrubbing length is equal to or larger than a preset value or not is recognized by adopting the vision system and the relative vertical movement is stopped by adopting the driving system.

公开(公告)号：US20220074970A1

公开(公告)日：2022-03-10

申请号：US17469412

申请日：2021-09-08

申请人： MPI Corporation

发明人： Ming-Hsiang Hsieh ,  Chia-Nan Chou ,  Hao Wei ,  Chia-Jung Liu ,  Chia-An Yu

IPC分类号： G01R1/067

摘要： A probe assembly, adapted to test high-speed signal transmission lines of printed circuit boards, includes two pogo pins for providing high-frequency differential test signals, and both sides of the pogo pin include no metal layer (grounding layer). Experiments have found that when the two pogo pins test a to-be-tested object, the test signal will be coupled to the metal layers on both sides of the pogo pins to generate a radiation resonance, resulting in a loss of the test signal on a specific frequency band, and further reducing the effective bandwidth of the probe assembly. The metal layers on both sides of the pogo pins of the probe assembly are reduced, so that the foregoing radiation resonance phenomenon can be avoided.

公开(公告)号：US20210333219A1

公开(公告)日：2021-10-28

申请号：US16858711

申请日：2020-04-27

申请人： MPI Corporation

发明人： Frank FEHRMANN ,  Chien-Hung CHEN ,  Ching-Yang YANG

IPC分类号： G01N21/95 ,  G01C3/02 ,  G02B21/00

摘要： A method of determining a first distance between a probe and a wafer held by a wafer probe station includes adjusting a microscope at a specific magnification; moving the microscope perpendicularly relative to a chuck to focus on the chuck to obtain a clear image of the chuck; defining a specific position of the microscope after the clear image of the chuck is obtained; maintaining the specific magnification of the microscope and moving the microscope perpendicularly relative to the chuck from the specific position by a travelling distance to focus on the probe to obtain a clear image of the probe; and determining the travelling distance minus a thickness of a wafer to be placed on a side of the chuck facing to the microscope as the first distance between the probe and the wafer.

公开(公告)号：US20210185211A1

公开(公告)日：2021-06-17

申请号：US17118037

申请日：2020-12-10

申请人： MPI CORPORATION

发明人： PING-YING WU ,  YUNG-CHIN LIU ,  HSUAN-CHIAO HUANG

IPC分类号： H04N5/235 ,  G06T7/00

摘要： A light emitting element detecting method and a light emitting element detecting equipment adapted for the method are discloses. The method includes the steps of generating a first control signal to open a shutter of an image capturing device which captures an image toward a light outlet of a light emitting element, generating a pulse signal to light up the light emitting element, generating a second control signal to close the shutter of the image capturing device and obtaining a detection image, and determining the light emitting status of the light outlet of the light emitting element according to the detection image. As a result, the present invention can accurately detect whether the light outlet of the light emitting element has the problem of emitting no light or flashing.