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公开(公告)号：US20240355986A1
公开(公告)日：2024-10-24
申请号：US18633418
申请日：2024-04-11
发明人： Shiou-Yi KUO , Guo-Yi SHIU , Chin-Hung LO , Chih-Hao LIN , Cheng-Hsien LI , Wei-Yuan MA
IPC分类号： H01L33/62 , H01L23/00 , H01L25/075
CPC分类号： H01L33/62 , H01L24/19 , H01L24/20 , H01L25/0753 , H01L2224/19 , H01L2224/211 , H01L2933/0066
摘要： A micro light-emitting diode package structure and a forming method thereof are provided. The micro light-emitting diode package structure includes micro light-emitting diode dies, a light-transmitting layer, a first insulating layer, redistribution layers, and conductive elements. The micro light-emitting diode dies are disposed side by side and each includes an electrode surface, a light-emitting surface, and side surfaces. The electrode surface and the light-emitting surface are opposite to each other, and the side surfaces are between them. The light-transmitting layer covers the light-emitting surface and the side surfaces. The first insulating layer is under the micro light-emitting diode dies and in direct contact with the electrode surface. The redistribution layers are disposed under the first insulating layer and pass through the first insulating layer to electrically connect the electrode surface. The conductive elements are disposed under the redistribution layers and electrically connected to the redistribution layers.
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公开(公告)号：US12113152B2
公开(公告)日：2024-10-08
申请号：US17246693
申请日：2021-05-02
发明人： Jih-Kang Chen , Shih-Wei Yang , Tsai-Chen Sung
CPC分类号： H01L33/382 , H01L27/156 , H01L33/22 , H01L33/405 , H01L33/42 , H01L33/44 , H01L33/62
摘要： The light emitting device includes a substrate, a light-emitting semiconductor structure, conductive pillars, an insulating layer, and first and second electrodes. The light-emitting semiconductor structure includes a first-type semiconductor layer, a light-emitting layer and a second-type semiconductor layer disposed on the substrate from bottom to top. The conductive pillars are disposed in the light-emitting semiconductor structure. The conductive pillars penetrates is in contact with the second-type semiconductor layer and electrically connected to the substrate. A first portion of the insulating layer is disposed between the first-type semiconductor layer and the substrate, and a second portion of the insulating layer electrically insulates the first-type semiconductor layer and the light emitting-layer from the conductive pillars. The first electrode is electrically connected to the first-type semiconductor layer and electrically insulated from the conductive pillars. The second electrode is electrically connected to the conductive pillar.
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公开(公告)号：US20240268019A1
公开(公告)日：2024-08-08
申请号：US18424225
申请日：2024-01-26
发明人： Hsin-Lun SU , Jo-Hsiang CHEN , Chun-Min LIN
CPC分类号： H05K1/036 , H05K1/116 , H05K1/181 , H05K2201/0212 , H05K2201/10106
摘要： A micro light-emitting package is provided. The micro light-emitting package includes a multilayer resin wiring board, a plurality of micro LED chips, and an encapsulating layer. The multilayer resin wiring board includes a black resin structure and a conductive structure disposed in the black resin structure. The plurality of the micro LED chips is arranged on the multilayer resin wiring board and electrically-connected to the conductive structure. The encapsulating layer covers the plurality of the micro LED chips.
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公开(公告)号：US12040434B2
公开(公告)日：2024-07-16
申请号：US17447574
申请日：2021-09-13
发明人： Yu-Jing Fang , Hsiang-Chun Hsu , Cheng-Ping Chang
IPC分类号： H01L33/58 , H01L21/56 , H01L23/31 , H01L31/0203 , H01L31/0232 , H01L31/18 , H01L33/00 , H01L33/54
CPC分类号： H01L33/58 , H01L21/565 , H01L23/3135 , H01L31/0203 , H01L31/02327 , H01L31/18 , H01L33/005 , H01L33/54 , H01L2933/005 , H01L2933/0058
摘要： A diode package structure includes a substrate, at least one diode chip and an opaque encapsulating layer. The substrate has an electrically conductive layer. At least one diode chip is mounted on the substrate and electrically connected to the electrically conductive layer. The opaque encapsulating layer has a cap portion and a sidewall portion, wherein the sidewall portion is connected to and surrounds the substrate to jointly form a concave structure, the cap portion is connected between a sidewall of the diode chip and the sidewall portion, wherein a first contact vertex of the cap portion and the sidewall of the diode chip is higher than a second contact vertex of the cap portion and the sidewall portion.
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公开(公告)号：US20240194848A1
公开(公告)日：2024-06-13
申请号：US18587974
申请日：2024-02-27
发明人： Chih-Hao LIN , Jo-Hsiang CHEN , Shih-Lun LAI , Min-Che TSAI , Jian-Chin LIANG
CPC分类号： H01L33/62 , H01L33/0095 , H01L33/58 , H01L2933/0058 , H01L2933/0066
摘要： The light emitting diode packaging structure includes a flexible substrate, micro light emitting elements disposed on the flexible substrate, a conductive pad, a redistribution layer, and an electrode pad. The micro light emitting elements have a first surface facing to the flexible substrate and a second surface opposite to the first surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting elements. The redistribution layer covers the micro light emitting elements and the conductive pad. The redistribution layer includes an insulating layer and a circuit layer embedded in the insulating layer. The circuit layer is electrically connected to the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer.
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公开(公告)号：US20240136483A1
公开(公告)日：2024-04-25
申请号：US18393602
申请日：2023-12-21
发明人： Chien-Hsin TU
CPC分类号： H01L33/58 , H01L33/483 , H01L33/50
摘要： A light emitting diode (LED) package structure include an electrically-insulated frame, a trough, a LED chip, a fluorescent colloid and at least two spacing members. The electrically-insulated frame has a surface with four corners. The trough is recessed in the surface. The LED chip is located in the trough. The fluorescent colloid is filled within the trough to cover the LED chip. The spacing members protrude from two of the four corners on the surface, wherein a glue escape gap is defined between each spacing member and a boundary of the trough.
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公开(公告)号：US11879084B2
公开(公告)日：2024-01-23
申请号：US17103972
申请日：2020-11-25
发明人： Chun-Che Lin , Chun-Han Lu , Yi-Ting Tsai , Yu-Chun Lee , Tzong-Liang Tsai
CPC分类号： C09K11/717 , H01L33/502
摘要： In the present disclosure embodiments, a phosphate phosphor including an activation center of trivalent chromium and a light emitting device are provided. The light emitting device includes a light source and the above mentioned phosphate phosphor, such that the phosphate phosphor is excited by the light source and emits a wide spectrum of the infrared light. The light emitting device with wide emission spectrum of the infrared light may be widely applied in detecting devices.
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公开(公告)号：US20230400171A1
公开(公告)日：2023-12-14
申请号：US18203984
申请日：2023-05-31
发明人： Shu-Wei CHEN , Jia-Jhang KUO , Ching-Chi CHIANG
CPC分类号： F21V19/0065 , F21V7/0058 , F21V3/02 , F21V17/101
摘要： A light source module is provided. The light source module includes a lead frame, a light source, a cup part, and a reflector. The light source is disposed on the lead frame, wherein the light source provides a light. The cup part is disposed on the lead frame, wherein the cup part includes an opening, a plurality of thick-wall portions and a plurality of thin-wall portions. The thick-wall portions and the thin-wall portions surround the light source and define a space. The reflector covers the opening. At least a portion of the light is reflected by the reflector, and is emitted through the thick-wall portions and the thin-wall portions.
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公开(公告)号：US11778845B2
公开(公告)日：2023-10-03
申请号：US17663431
申请日：2022-05-15
发明人： Hui-Ru Wu , Jian-Chin Liang , Jo-Hsiang Chen , Lung-Kuan Lai , Cheng-Yu Tsai , Hsin-Lun Su , Ting-Kai Chen
IPC分类号： H10K50/125 , H01L33/60 , H10K50/856 , H10K50/86 , H10K50/80
CPC分类号： H10K50/125 , H01L33/60 , H10K50/856 , H10K50/865 , H10K50/868
摘要： A pixel array package structure includes: a substrate; a pixel array disposed on the substrate, in which the pixel array includes a plurality of light emitting diode chips, and the light emitting diode chips include at least one red diode chip, at least one green diode chip, at least one blue diode chip, and a combination thereof; a reflective layer disposed on the substrate and between any two adjacent of the light emitting diode chips; a light-absorbing layer disposed on the reflective layer and surrounding the pixel array; and a light-transmitting layer disposed on the pixel array, the reflective layer, and the light-absorbing layer, in which the light-transmitting layer has an upper surface and a lower surface opposite thereto, and the lower surface is in contact with the pixel array, and the upper surface has a roughness of 0.005 mm to 0.1 mm.
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公开(公告)号：US11664483B2
公开(公告)日：2023-05-30
申请号：US17078098
申请日：2020-10-23
发明人： Shiou-Yi Kuo , Jian-Chin Liang , Jo-Hsiang Chen , Chih-Hao Lin
IPC分类号： H01L33/62 , H01L33/00 , H01L33/54 , H01L25/075 , H01L25/16 , H01L33/50 , H01L33/38 , H01L33/48
CPC分类号： H01L33/62 , H01L33/005 , H01L33/54 , H01L2933/005 , H01L2933/0066
摘要： A light-emitting device includes a micro light-emitting diode chip (micro LED chip), a first electrical connecting layer, a second electrical connecting layer and a housing layer. The micro LED chip includes a light exit surface, a bottom surface opposite to the light exit surface and first and second electrodes located on the bottom surface. The first and second electrical connecting layers respectively connect to the first and second electrodes and extend along two opposite sidewalls to two sides of a perimeter of the light exit surface. The housing layer encloses the micro LED chip and the first and second electrical connecting layer. The light exit surface of the micro LED chip and top surfaces of the first and second electrical connecting layers are not enclosed by the housing layer.
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