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公开(公告)号：US20240111985A1
公开(公告)日：2024-04-04
申请号：US18553871
申请日：2022-04-06
IPC分类号： G06K19/077
CPC分类号： G06K19/07722
摘要： A card body for a chip card, having two metal layers, between which a nonconductive central layer is arranged, wherein a module opening for receive a chip module is already produced in one metal layer and in the aforementioned metal layer or can still be produced in a module opening zone, and two slots, one of which extends from the peripheral surface of the card body to the module opening or to the module opening zone in a metal layer and severs each of the metal layers at a respective height. The entry angle of the two slots into the metal layer does not equal 90° relative to the surface of the metal layer in each case, and the two slots have opposite inclinations relative to a surface normal of the surface of the metal layer.
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2.发明公开公开(公告)号：US20240217260A1
公开(公告)日：2024-07-04
申请号：US18556852
申请日：2022-04-26
发明人： Cristina FABIAN , Klaus KOHL , Gunter ENDRES
IPC分类号： B42D25/41 , B42D25/23 , B42D25/309 , B42D25/351
CPC分类号： B42D25/41 , B42D25/23 , B42D25/309 , B42D25/351
摘要： A security feature for a value document, into which markings are introduced by at least one laser beam, includes at least one laser-sensitive recording layer which is transparent in the visible spectral range, light-diffracting or light-refracting structures arranged on a first side of the recording layer, at least one first marking which is introduced into the at least one recording layer by a laser beam from at least one direction through the light-diffracting or light-refracting structures into the at least one recording layer and is visible when viewed from the same direction from a second side, at least one second marking which is introduced into the at least one recording layer with a laser beam from the second side of the recording layer and is visible when viewed from the first and the second side
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公开(公告)号：US20240202697A1
公开(公告)日：2024-06-20
申请号：US18556820
申请日：2022-04-25
发明人： Ranjan GHOSH
CPC分类号： G06Q20/3229 , G06Q20/355 , H04W8/205 , H04W12/35
摘要： A payment solution provisioning system includes a payment card credential transfer interface means between a payment card production system and a remote SIM provisioning system, and by a payment card credential storage at the remote SIM provisioning system, storing payment card credentials received at the remote SIM provisioning system from the payment card production system, storing such that the payment card credentials can be downloaded to an eUICC the way normally subscription profiles are downloaded to a eUICC. The payment card credentials stored in the eUICC are a digital payment solution. The same payment card credentials personalized into a physical payment card at the payment card production system are a physical payment solution. Both together build a combined digital and physical payment solution. A mobile device comprises a payment application.
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公开(公告)号：US20240365106A1
公开(公告)日：2024-10-31
申请号：US18571664
申请日：2022-06-30
发明人： Nils NITSCH , Harry LI , Tommy THORSTENSSON , Dan THORÉN , Markus HAUBNER , Andreas KITZMANN
IPC分类号： H04W8/20
CPC分类号： H04W8/20
摘要： A method, at a data generation server, for generation of a profile image for downloading the profile image from the profile server to an eUICC hosted in a device, is provided for the purpose of installing a profile corresponding to the profile image in the eUICC. The method includes the steps: Ga) provide, on the data generation server, at least one global identifier and at least a first functionality identifier and a second functionality identifier different from the first functionality identifier; Gb) generate, on the data generation server, at least a first profile image and a second profile image; Gc) assign the at least first and second profile images to the same global identifier; Gd) store the at least first and second profile image as profile images assigned to the same global identifier, for providing the first and second profile image to the profile server for download to eUICCs.
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公开(公告)号：US12079678B2
公开(公告)日：2024-09-03
申请号：US18267508
申请日：2021-12-15
IPC分类号： G06K19/063 , G06K19/04 , G06K19/077
CPC分类号： G06K19/063 , G06K19/044 , G06K19/07722
摘要： A method for manufacturing a card body for a chip card, includes the steps of: supplying a metallic base body with two opposite main faces and a circumferential peripheral face connecting the two main faces, wherein in the base body a module opening for receiving a chip module has already been produced or will still be produced in a module opening zone, and producing a slot on the peripheral face between the two main faces. The slot is formed from the peripheral face up to the module opening or up to the module opening zone. An entry angle (α) of the slot into at least one of the two main faces is not equal to ninety degrees with respect to the main face.
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公开(公告)号：US20240236105A9
公开(公告)日：2024-07-11
申请号：US18490994
申请日：2023-10-20
IPC分类号： H04L9/40 , H04L67/306 , H04W8/18 , H04W12/30
CPC分类号： H04L63/102 , H04L67/306 , H04W8/18 , H04W12/30
摘要： A profile provisioning platform, includes a profile database which allows access by at least two different profile providers or/and at least two different use case owners or/and at least two different UICC requesters; and which includes a business relation manager managing access of the different profile providers, use case owners and UICC requesters to data in the profile database.
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公开(公告)号：US20240127023A1
公开(公告)日：2024-04-18
申请号：US18263999
申请日：2022-02-02
IPC分类号： G06K19/077
CPC分类号： G06K19/07749
摘要： A method for producing a chip card, such that the chip card includes a card body and a chip module arranged thereon. The method has the steps of providing a card body; producing a cavity for receiving the chip module; producing at least one component opening for each of one or more electronic components in an overlap region, which is covered by the chip module arranged later; applying soldering material onto the electronic component(s), into the at least one component opening, and/or onto a lower face of the chip module; placing the electronic component(s) in the at least one component opening; introducing the chip module into the cavity; and heating the soldering material.
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公开(公告)号：US20240062024A1
公开(公告)日：2024-02-22
申请号：US18552273
申请日：2022-03-23
IPC分类号： G06K7/10
CPC分类号： G06K7/10366
摘要： A method is for determining a value of an electromagnetic field strength by means of a chip card, having the steps of: providing a chip card having a coil and an integrated circuit; calibrating the chip card by means of different values of an electromagnetic field strength, wherein a power of the integrated circuit is determined in each case for a specific value of the electromagnetic field strength; correlating the different values of the electro-magnetic field strengths with a corresponding power of the integrated circuit in each case; applying an electromagnetic field strength of an unknown value to the chip card; determining a power of the integrated circuit; and determining the value of the electromagnetic field strength corresponding to this power by means of the correlation.
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9.发明公开公开(公告)号：US20240320460A1
公开(公告)日：2024-09-26
申请号：US18694485
申请日：2022-09-22
发明人： Mikko KAHKONEN , Ashwini PANDEY , Thomas TARANTINO
IPC分类号： G06K19/077
CPC分类号： G06K19/0772
摘要： A card-like data carrier includes an electronic chip module with at least one chip and a contact structure, and a card body with an arrangement region for receiving the chip module. The chip module is arranged in the arrangement region of the card body and is connected to the card body by means of at least one adhesive, wherein the adhesive is configured to be releasable thermolytically in a predetermined temperature range and/or chemically in order to separate the connection between the chip module and the card body. A method is provided for releasing an adhesive connection for a card-like data carrier.
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10.发明公开公开(公告)号：US20240160884A1
公开(公告)日：2024-05-16
申请号：US18552245
申请日：2022-03-23
发明人： Andreas MINKS
IPC分类号： G06K19/077 , G06K1/12
CPC分类号： G06K19/07749 , G06K1/12
摘要： A card element for a chip card, includes an outer metal layer with a flat surface interrupted only by a module opening for receiving a chip module. The module opening extends to an inner side and includes a ferrite layer located on the inner side and through which the opening extends. An inner metal layer is disposed on the ferrite layer through which a portion of the module opening has a reduced cross-section extends. A slit extends from a peripheral surface of the inner metal layer to the module opening and extends through the entire thickness of the inner metal layer. A final layer is made of plastic and disposed on the inner metal layer.
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