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公开(公告)号：US20240111985A1
公开(公告)日：2024-04-04
申请号：US18553871
申请日：2022-04-06
IPC分类号： G06K19/077
CPC分类号： G06K19/07722
摘要： A card body for a chip card, having two metal layers, between which a nonconductive central layer is arranged, wherein a module opening for receive a chip module is already produced in one metal layer and in the aforementioned metal layer or can still be produced in a module opening zone, and two slots, one of which extends from the peripheral surface of the card body to the module opening or to the module opening zone in a metal layer and severs each of the metal layers at a respective height. The entry angle of the two slots into the metal layer does not equal 90° relative to the surface of the metal layer in each case, and the two slots have opposite inclinations relative to a surface normal of the surface of the metal layer.
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公开(公告)号：US20240127023A1
公开(公告)日：2024-04-18
申请号：US18263999
申请日：2022-02-02
IPC分类号： G06K19/077
CPC分类号： G06K19/07749
摘要： A method for producing a chip card, such that the chip card includes a card body and a chip module arranged thereon. The method has the steps of providing a card body; producing a cavity for receiving the chip module; producing at least one component opening for each of one or more electronic components in an overlap region, which is covered by the chip module arranged later; applying soldering material onto the electronic component(s), into the at least one component opening, and/or onto a lower face of the chip module; placing the electronic component(s) in the at least one component opening; introducing the chip module into the cavity; and heating the soldering material.
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公开(公告)号：US20240062024A1
公开(公告)日：2024-02-22
申请号：US18552273
申请日：2022-03-23
IPC分类号： G06K7/10
CPC分类号： G06K7/10366
摘要： A method is for determining a value of an electromagnetic field strength by means of a chip card, having the steps of: providing a chip card having a coil and an integrated circuit; calibrating the chip card by means of different values of an electromagnetic field strength, wherein a power of the integrated circuit is determined in each case for a specific value of the electromagnetic field strength; correlating the different values of the electro-magnetic field strengths with a corresponding power of the integrated circuit in each case; applying an electromagnetic field strength of an unknown value to the chip card; determining a power of the integrated circuit; and determining the value of the electromagnetic field strength corresponding to this power by means of the correlation.
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公开(公告)号：US20240273328A1
公开(公告)日：2024-08-15
申请号：US18569907
申请日：2022-06-24
IPC分类号： G06K19/077
CPC分类号： G06K19/07718 , G06K19/07722 , G06K19/07749
摘要： A method is provided for producing a chip card body having a metallic core layer for a contactless or dual-interface chip card. A slot in the metallic core layer for reducing eddy currents is generated not in the metallic multiple-copy sheet itself but instead only in the metallic core layer extracted from the metallic multiple-copy sheet. In this way, there are no short-circuit-forming metal chips left in the slot, since the slot is generated only after the extraction of the metallic core layer from the multiple-copy sheet.
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