公开(公告)号：US2439190A

公开(公告)日：1948-04-06

申请号：US54477144

申请日：1944-07-13

申请人： WESTERN ELECTRIC CO

发明人： SCHROEDER LEROY E

IPC分类号： C25D17/08

CPC分类号： C25D17/08

公开(公告)号：US2073679A

公开(公告)日：1937-03-16

申请号：US500835

申请日：1935-02-05

申请人： WESTERN ELECTRIC CO

发明人： MORRIS BROWN ,  O'CONNOR STEPHEN F

IPC分类号： C25D5/02 ,  C25D17/08

CPC分类号： C25D5/02 ,  C25D17/08

公开(公告)号：US1970459A

公开(公告)日：1934-08-14

申请号：US61368232

申请日：1932-05-26

申请人： KELLY JOHN N

发明人： KELLY JOHN N

IPC分类号： C25D17/08

CPC分类号： C25D17/08

公开(公告)号：US1838187A

公开(公告)日：1931-12-29

申请号：US32446828

申请日：1928-12-07

申请人： FRETZ MOON TUBE COMPANY INC

发明人： MOON JOHN W

IPC分类号： C25D17/08 ,  C25D21/10

CPC分类号： C25D17/08 ,  C25D21/10

公开(公告)号：US1750807A

公开(公告)日：1930-03-18

申请号：US32222328

申请日：1928-11-27

申请人： CHROMEPLATE INC

发明人： LOUIS LICHTMAN

IPC分类号： C25D17/08

CPC分类号： C25D17/08

公开(公告)号：US12054846B2

公开(公告)日：2024-08-06

申请号：US17943376

申请日：2022-09-13

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Taiseung Cha ,  Taewan Kang ,  Donghwan Park ,  Sunggon Kim ,  Sungkeun Lee

IPC分类号： C25D5/18 ,  C25D7/12 ,  C25D17/00 ,  C25D17/08 ,  C25D21/08 ,  C25D21/12 ,  C25D21/18

CPC分类号： C25D5/18 ,  C25D7/123 ,  C25D17/001 ,  C25D17/002 ,  C25D17/08 ,  C25D21/08 ,  C25D21/12 ,  C25D21/18

摘要： An electroplating apparatus includes: an electroplating bath including an anode region, in which an anode electrode is arranged, a cathode region and a membrane; a head unit including a contact ring holding a wafer and configured so that a first cathode potential is applied to the contact ring during an electroplating process; a reverse potential electrode arranged adjacent to the membrane and configured so that a second cathode potential is applied to the reverse potential electrode during the electroplating process, and a reverse cathode potential is applied to the reverse potential electrode during a rinsing process; and a power supply unit configured to apply the first cathode potential and the second cathode potential during the electroplating process, and further configured to apply the reverse cathode potential and a reverse anode potential to the anode electrode during the rinsing process.

公开(公告)号：US11793615B2

公开(公告)日：2023-10-24

申请号：US15769538

申请日：2016-10-18

申请人： LES LABORATOIRES OSTEAL MEDICAL

发明人： Daniel Bouchot ,  Thierry Tisserand

IPC分类号： A61C13/12 ,  C25D17/08 ,  C25D11/00 ,  A61C8/00 ,  C25D11/26 ,  A61C19/00 ,  B08B13/00 ,  C25D11/02

CPC分类号： A61C13/12 ,  A61C8/0015 ,  A61C19/002 ,  B08B13/00 ,  C25D11/005 ,  C25D11/02 ,  C25D11/26 ,  C25D17/08 ,  A61L2430/12

摘要： A support element (S) for supporting implants (I), such as dental implants, the support element comprising a bar (S1) and a plurality of pins (S5) that are fitted to the bar (S1) and that are arranged parallel to one another, each pin (S5) defining a free end that is provided with reception means (S8) that are suitable for co-operating with the implant (S) so as to hold it on the reception means (S8) of the pin (S5), the bar (S1) including at least one mounting end (S4) for mounting the bar (S1) on another support device, thereby forming a support structure;



the support element being characterized in that each pin (S5) is provided with a removal system (S9) for removing the implant (S) from the reception means (S8), without coming into contact with an exposed portion of the implant (S).

公开(公告)号：US11598018B2

公开(公告)日：2023-03-07

申请号：US16295995

申请日：2019-03-07

申请人： SunPower Corporation

发明人： Hung-Ming Wang ,  Paul W. Loscutoff ,  Raphael M. Manalo ,  Arnold V. Castillo ,  Mohamad Ridzwan Mustafa ,  Mark A. Kleshock ,  Neil G. Bergstrom

IPC分类号： C25D17/08 ,  C25D7/12 ,  C25D17/00 ,  H01L31/05

摘要： A wafer plating fixture for use in simultaneously electroplating a two substrates. The wafer plating fixture including: an electrically conductive carrier bus; a plurality of contact clips electrically coupled to the carrier bus and configured to hold the two substrates in place and electrically couple the two substrates to the carrier bus; and a non-conductive substrate backer to separate the two substrates coupled to the carrier bus. A method of electroplating a plurality of substrates. The method including: mounting two substrates to be plated onto a wafer plating fixture; mounting the wafer plating fixture on a continuous belt of plating system; dipping the wafer plating fixture with the two substrates held thereon into an electroplating bath; and applying a voltage to the two substrates via the wafer plating fixture.

公开(公告)号：US11519093B2

公开(公告)日：2022-12-06

申请号：US17050395

申请日：2019-04-26

申请人： MODUMETAL, Inc.

发明人： Christina A. Lomasney ,  Guohua Li ,  Nicholas Angelo

IPC分类号： C25D17/08 ,  C25D5/56 ,  C25D7/04 ,  C25D17/12

摘要： Provided herein are apparatuses, systems, and methods for the electrodeposition of nano- or microlaminate coatings, which have improved heat, wear, and corrosion resistance, on a plurality of workpieces.

公开(公告)号：US20220298667A1

公开(公告)日：2022-09-22

申请号：US17639514

申请日：2020-09-02

申请人： LAM RESEARCH CORPORATION

发明人： Frederick Dean WILMOT ,  Robert RASH ,  Nirmal Shankar SIGAMANI ,  Gabriel GRAHAM

IPC分类号： C25D17/00 ,  C25D17/08 ,  C25D17/10

摘要： A cell to process a substrate includes at least one chamber wall, a membrane frame, and a membrane. The at least one chamber wall is arranged to form a cavity below a holder of the substrate. The membrane frame is disposed on the at least one chamber wall and across the cavity. The membrane is supported by the membrane frame and separating a first electrolyte from a second electrolyte. The membrane includes a surface extending from a center of the cavity radially outward at an angle relative to a reference plane, and wherein the angle is greater than or equal to 0° and less than or equal to 3°.