公开(公告)号：US11534970B2

公开(公告)日：2022-12-27

申请号：US16538779

申请日：2019-08-12

申请人： Callie Zawaski ,  Christopher Williams

发明人： Callie Zawaski ,  Christopher Williams

IPC分类号： B29C64/25 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B29C64/118 ,  B29C64/364 ,  B29C64/232 ,  B29C64/236 ,  B29C64/245 ,  B29C64/295 ,  B29C64/209

摘要： Described herein are 3D printers capable of printing high-performance materials and uses thereof.

公开(公告)号：US11524463B2

公开(公告)日：2022-12-13

申请号：US16899005

申请日：2020-06-11

申请人： Palo Alto Research Center Incorporated

发明人： Svyatoslav Korneev ,  Vaidyanathan Thiagarajan ,  Saigopal Nelaturi

IPC分类号： B33Y50/02 ,  B33Y10/00 ,  B33Y30/00 ,  G06F113/10 ,  G06F119/18 ,  B29C64/393 ,  B29C64/112 ,  B29C64/245 ,  B29C64/295 ,  B29C64/209

摘要： A plurality of scanned prints of a product part and a scan-path are received. A shape of a minimum printable feature of the product part is determined by analyzing the respective prints in a scan-path representation. A manufacturing error of the minimum printable feature is determined based on the analysis. A manufacturing error of a shape of the part is determined based on the determined manufacturing error of the minimum printable feature. An estimated manufactured shape of the part is produced based on the determined manufacturing error of the part.

公开(公告)号：US20220371271A1

公开(公告)日：2022-11-24

申请号：US17775572

申请日：2019-12-20

申请人： Hewlett-Packard Development Company, L.P.

发明人： Heribert Farreny Agras

IPC分类号： B29C64/241 ,  B33Y30/00 ,  B29C64/295 ,  B33Y50/02 ,  B29C64/393 ,  B29C64/25

摘要： A 3D printing module, a build unit and a method are disclosed herein. The 3D printing module comprises a build unit receiving interface to receive a build unit. The build unit comprises a build platform with a build platform drive interface. The 3D printing module further comprises a driving mechanism engageable with the build platform drive interface to controllably move the build platform.

公开(公告)号：US11504904B2

公开(公告)日：2022-11-22

申请号：US16935913

申请日：2020-07-22

申请人： Evapco, Inc.

发明人： Davey Vadder

IPC分类号： B29C64/124 ,  B29C64/245 ,  B29C64/295 ,  B33Y10/00 ,  B29K105/00 ,  B33Y30/00 ,  B29K101/12 ,  G06K15/10

摘要： A method of additively manufacturing parts by selectively cooling a liquefied thermoplastic material.

公开(公告)号：US11498277B2

公开(公告)日：2022-11-15

申请号：US16809245

申请日：2020-03-04

申请人： Oregon State University

发明人： Osman Dogan Yirmibesoglu ,  Yi{hacek over (g)}it Mengüç

IPC分类号： B29C64/209 ,  B29C64/336 ,  B33Y30/00 ,  B33Y10/00 ,  B29C64/227 ,  B29C64/106 ,  B29C64/25 ,  B29C64/295 ,  C08L83/04 ,  B01F27/07 ,  B01F27/91 ,  B01F27/113 ,  B01F27/2124 ,  B01F35/92 ,  B29K83/00 ,  B33Y70/00 ,  B01F35/90 ,  B01F101/00

摘要： Disclosed is direct ink write (DIW) print extrusion head for 3D printing of viscous elastomers. The disclosed print extrusion head comprises a mixer assembly, comprising a fluid distribution cap coupled to a carrier, an in-line mixer coupled to the fluid distribution cap. A cooling jacket surrounds the in-line mixer. A nozzle is coupled to the in-line mixer and protrudes below the cooling jacket over a work surface. The position of the nozzle relative to the work surface is changeable. At least one heat source is on the chassis and disposed adjacent to the fluid distribution cap. The at least one heat source comprises a heat guiding element to direct heat to a region onto the work surface below the nozzle.

公开(公告)号：US11498146B2

公开(公告)日：2022-11-15

申请号：US16585628

申请日：2019-09-27

申请人： Lincoln Global, Inc.

发明人： Judah B. Henry ,  Daniel P. Fleming ,  Steven R. Peters

IPC分类号： B23K9/04 ,  B29C64/321 ,  B29C64/112 ,  B29C64/295 ,  B29C64/205 ,  B23K9/067 ,  B23K9/133 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00

摘要： A welding or additive manufacturing system includes a contact tip assembly having first and second exit orifices. A wire feeder is configured to deliver a first and second wire electrodes through the exit orifices. An arc generation power supply is configured to output a current waveform to the wire electrodes simultaneously, through the contact tip assembly. The current waveform includes a bridging current portion, and a background current portion having a lower current level than the bridging current portion. The bridging current portion has a current level sufficient to form a bridge droplet between the wire electrodes before the bridge droplet is transferred to a molten puddle during a deposition operation. Solid portions of the wire electrodes do not contact each other during the deposition operation. The bridge droplet is transferred to the molten puddle during a short circuit event between the molten puddle and the wire electrodes.

公开(公告)号：US20220355537A1

公开(公告)日：2022-11-10

申请号：US17813835

申请日：2022-07-20

申请人： Continuous Composites Inc.

发明人： Rachael Kathleen Morris ,  Ryan C. Stockett

IPC分类号： B29C64/118 ,  B29C64/188 ,  B29C64/218 ,  B29C64/241 ,  B29C64/264 ,  B29C64/314 ,  B29C64/209 ,  B29C64/393 ,  B29C64/165 ,  G06F30/23 ,  B29C64/227 ,  B29C64/106 ,  B29C64/245 ,  B29C64/295

摘要： A system is disclosed for use in additively manufacturing a structure. The system may include a print head to discharge a material, and a support to move the print head during discharging to fabricate a structure. The system may also include a receiver mounted to the print head to generate a signal indicative of at least one of a shape, a size, and a location of the discharged material, and a processor in communication with the receiver and the support. The processor may be configured to generate a data cloud of the structure fabricated by the additive manufacturing system based on the signal and based on a known position of the receiver at a time of signal generation. The processor may also be configured to make a comparison of the data cloud and a virtual model of the structure during discharging, and to selectively affect discharging based on the comparison.

公开(公告)号：US20220339871A1

公开(公告)日：2022-10-27

申请号：US17657994

申请日：2022-04-05

申请人： Continuous Composites Inc.

发明人： Nathan Andrew Stranberg ,  Andrew John Overby ,  Andrew Michael Stulc ,  Stephen Tyler Wilson ,  Ryan C. Stocket ,  Brock Adam Jahner

IPC分类号： B29C64/336 ,  B29C64/357 ,  B29C64/295

摘要： A system is disclosed for use in additively manufacturing an object. The system may have a reinforcement supply, a matrix supply, and a wetting module configured to separately receive reinforcement from the reinforcement supply and matrix from the matrix supply and to discharge the reinforcement wetted with the matrix. The wetting module may include a body forming an enclosure and having an inlet end configured to receive the reinforcement and an outlet end configured to discharge the reinforcement wetted with the matrix. The wetting module may also include a plurality of nozzles dividing the enclosure into at least a wetting chamber.

公开(公告)号：US20220332039A1

公开(公告)日：2022-10-20

申请号：US17633975

申请日：2020-08-14

申请人： BASF SE

发明人： Rene ARBTER ,  Rudolf SEILER ,  Thorsten Martin STAUDT

IPC分类号： B29C64/118 ,  B29C64/321 ,  B29C64/295 ,  B29C64/209 ,  B29C64/314 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/10 ,  B33Y70/10

摘要： A process for producing a three-dimensional (3D) object by a fused filament fabrication process employing at least one filament and a three-dimensional (3D) extrusion printer. Within said process, the filament is first fed to a cooling device, where the filament is cooled down to a temperature of 20° C. or colder. Afterwards, the cooled-down filament is transported to a heating device located inside the printing head of the 3D extrusion printer, where the cooled-down filament is heated to a temperature, which is high enough to at least partially melt the filament. The heated filament is extruded through the nozzle of the printing head of the 3D extrusion printer in order to obtain an extruded strand, which in turn is used to form the respective 3D object in a layer by layer way. Further an apparatus is disclosed, to be used within such a fused filament fabrication process or 3D printing technology, respectively.

公开(公告)号：US20220324161A1

公开(公告)日：2022-10-13

申请号：US17808926

申请日：2022-06-24

申请人： Continuous Composites Inc.

发明人： STEPHEN TYLER WILSON ,  Ryan C. Stockett

IPC分类号： B29C64/118 ,  B29C64/188 ,  B29C64/218 ,  B29C64/241 ,  B29C64/264 ,  B29C64/314 ,  B29C64/209 ,  B29C64/393 ,  B29C64/165 ,  G06F30/23 ,  B29C64/227 ,  B29C64/106 ,  B29C64/245 ,  B29C64/295

摘要： A system for additively manufacturing a structure is disclosed. The system may include a support, and a print head operatively connected to and moveable by the support. The print head may have an outlet that is oriented at an oblique angle relative to a central axis of the print head.