公开(公告)号：US06786803B2

公开(公告)日：2004-09-07

申请号：US10299219

申请日：2002-11-19

Applicant: Linden J. Crawforth ,  Douglas J. Werner ,  Benjamin L. Wang ,  Timothy J. Minvielle

Inventor： Linden J. Crawforth ,  Douglas J. Werner ,  Benjamin L. Wang ,  Timothy J. Minvielle

IPC: B24B4900

CPC classification number: G11B5/1871 ,  G11B5/39

Abstract: An onboard electronic lapping guide for lapping a magneto-resistive head having a magneto-resistive sensor element disposed for electrical communication with a pair of sensor electrical leads. The lapping guide includes an electronic lapping guide resistive element disposed for electrical communication with the sensor electrical leads. The resistive element has a predetermined height in a lapping direction and is adapted to produce an electrical resistance in the presence of a lapping current that increases as said resistive element height is reduced during lapping. A lapping method and a method of forming the onboard electronic lapping guide are also disclosed.

公开(公告)号：US06758724B2

公开(公告)日：2004-07-06

申请号：US10043708

申请日：2002-01-09

Applicant: Chin-Tsan Jan

Inventor： Chin-Tsan Jan

IPC: B24B4900

CPC classification number: H01L21/67288 ,  B25J9/1045 ,  B25J9/1674 ,  B25J19/06

Abstract: A method and system for monitoring tension associated with a robot-controlled belt utilized in a semiconductor wafer polishing apparatus. A belt tension monitor can be adapted for use with the semiconductor wafer polishing apparatus to detect a variable tension of the robot-controlled belt. An upper tension limit and a lower tension limit of the robot-controlled belt may then be monitored utilizing the belt tension monitor to prevent a breakage of the robot-controlled belt during a semiconductor wafer polishing operation thereby extending a life of the robot-controlled belt. The belt tension monitor can be installed at an inertial pulley of a robot associated with the semiconductor wafer polishing apparatus to detect the variable tension of the robot-controlled belt.

Abstract translation: 一种用于监测与在半导体晶片抛光装置中使用的机器人控制带相关联的张力的方法和系统。 皮带张力监测器可以适用于半导体晶片抛光装置以检测机器人控制带的可变张力。 然后可以使用皮带张力监测器来监测机器人控制带的上限张力极限和较低张力极限，以防止在半导体晶片抛光操作期间机器人控制带的破损，从而延长机器人控制带的寿命 。 带张力监视器可以安装在与半导体晶片抛光装置相关联的机器人的惯性滑轮处，以检测机器人控制带的可变张力。

公开(公告)号：US06749483B2

公开(公告)日：2004-06-15

申请号：US10430611

申请日：2003-05-05

Applicant: Joseph P. Simon

Inventor： Joseph P. Simon

IPC: B24B4900

CPC classification number: B24B37/013 ,  B24B49/12

Abstract: In a method for determining an endpoint in a chemical mechanical planarization (CMP) operation, the concentration of an oxidizing agent in the slurry byproduct generated during the CMP operation is monitored. The endpoint of the CMP operation is determined based on the concentration of the oxidizing agent in the slurry byproduct. The concentration of the oxidizing agent in the slurry byproduct may be monitored by diverting the slurry byproduct from a surface of a polishing pad, and measuring an optical property of the slurry byproduct diverted from the surface of the polishing pad. A CMP system configured to implement the method for determining an endpoint also is described.

Abstract translation: 在化学机械平坦化（CMP）操作中用于确定端点的方法中，监测在CMP操作期间产生的浆料副产物中的氧化剂的浓度。 基于浆料副产物中氧化剂的浓度确定CMP操作的终点。 可以通过从抛光垫的表面转移浆料副产物并测量从抛光垫的表面转移的浆料副产物的光学性质来监测浆料副产物中氧化剂的浓度。 还描述了被配置为实现用于确定端点的方法的CMP系统。

公开(公告)号：US06746308B1

公开(公告)日：2004-06-08

申请号：US09903267

申请日：2001-07-11

Applicant: Christopher A. Bode ,  Alexander J. Pasadyn

Inventor： Christopher A. Bode ,  Alexander J. Pasadyn

IPC: B24B4900

CPC classification number: H01L22/20

Abstract: In one illustrative embodiment, the method comprises providing a plurality of wafer lots, each of the lots comprising a plurality of wafers, performing at least one process operation on at least some of the wafers in each of the plurality of lots, identifying processed wafers having similar characteristics, re-allocating the wafers to lots based upon the identified characteristics, and performing additional processing operations on the identified wafers having similar characteristics in the re-allocated lots. In one illustrative embodiment, the system comprises a first processing tool for performing processing operations on each of a plurality of wafers in each of a plurality of wafer lots, a controller for identifying processed wafers having similar characteristics and re-allocating the wafers to lots based upon the identified characteristics, and a second processing tool adapted to perform additional processing operations on the identified wafers having similar characteristics in the re-allocated lot.

Abstract translation: 在一个说明性实施例中，该方法包括提供多个晶片批次，每个批次包括多个晶片，对多个批次中的每一个中的至少一些晶片执行至少一个处理操作，识别处理后的晶片具有 类似的特征，基于所识别的特征将晶片重新分配到批次，以及对经重新分配的批次具有相似特征的所识别的晶片执行附加的处理操作。 在一个说明性实施例中，该系统包括用于对多个晶片批次中的每一个中的多个晶片中的每一个执行处理操作的第一处理工具，用于识别具有相似特性并且将晶片重新分配给批次的处理晶片的控制器 以及第二处理工具，其适于对所重新分配的批次中具有相似特征的所识别的晶片执行附加处理操作。

公开(公告)号：US06743074B1

公开(公告)日：2004-06-01

申请号：US09957282

申请日：2001-09-19

Applicant: James D. Pruet ,  David G. Couch

Inventor： James D. Pruet ,  David G. Couch

IPC: B24B4900

CPC classification number: B24B53/017 ,  B08B3/02 ,  B24B37/04

Abstract: A system (10) for manufacturing a photocathode includes a support (12) and a polishing pad (14) disposed adjacent the support (12). The polishing pad (14) is operable to polish the photocathode in response to movable contact of the photocathode relative to the polishing pad (14). The system (10) also includes a rinsing system (16) coupled to the support (12). The rinsing system (16) is operable to deliver a rinsing agent to the polishing pad (14). The system (10) further includes a control system (62) operable to automatically regulate delivery of the rinsing agent to the rinsing system (16) at a predetermined time period.

Abstract translation: 用于制造光电阴极的系统（10）包括邻近支撑件（12）设置的支撑件（12）和抛光垫（14）。 抛光垫（14）可操作以响应于光电阴极相对于抛光垫（14）的可动接触来抛光光电阴极。 系统（10）还包括联接到支撑件（12）的冲洗系统（16）。 冲洗系统（16）可操作以将漂洗剂输送到抛光垫（14）。 系统（10）还包括控制系统（62），其可操作以在预定的时间段内自动调节冲洗剂向漂洗系统（16）的输送。

公开(公告)号：US06739943B2

公开(公告)日：2004-05-25

申请号：US09985547

申请日：2001-11-05

Applicant: Walter Wirz

Inventor： Walter Wirz

IPC: B24B4900

CPC classification number: B23F15/06 ,  Y10T409/101749 ,  Y10T409/102226 ,  Y10T409/106201

Abstract: On account of the constructional form of the tool head (17) according to the invention, the opposite sides (18, 19) of a tool (13) attached to the tool spindle (14) of a numerically controlled continuously generating gear grinding or hobbing machine are capable of machining the upper and lower sets of teeth (2, 3) of a double-sided face-gear (1) in one and the same set-up and without disturbing the synchronization between the rotations of the grinding worm and workpiece maintained during the grinding of the first set of teeth, without risk of collision. This eliminates the need to reset the workpiece (1) between the machining of the two sets of teeth (2, 3), thereby shortening the overall machining time substantially, and allowing the avoidance of accuracy losses due to the resetting of the workpiece (1).

Abstract translation: 由于根据本发明的工具头（17）的结构形式，安装在工具主轴（14）上的工具（13）的相对侧（18,19）是数字控制的连续发生的齿轮磨削或滚齿 机器能够在同一设置中加工双面面齿轮（1）的上下组齿（2,3），并且不会干扰研磨蜗杆和工件的旋转之间的同步 在研磨第一组牙齿期间保持，没有碰撞的风险。 这消除了在两组齿（2,3）的加工之间复位工件（1）的需要，从而基本上缩短了整体加工时间，并且允许避免由于工件（1）的复位导致的精度损失 ）。

公开(公告)号：US06736708B1

公开(公告)日：2004-05-18

申请号：US09687209

申请日：2000-10-13

Applicant: Craig M. Carpenter

Inventor： Craig M. Carpenter

IPC: B24B4900

CPC classification number: B24B37/12 ,  B24B13/012 ,  B24B37/20 ,  B24B37/26 ,  B24D9/08

Abstract: A plurality of planarizing machines for microelectronic substrate assemblies, and methods of mechanical and chemical-mechanical planarization of microelectronic substrate assemblies are disclosed. The planarizing machines for processing microelectronic substrate assemblies generally include a table, a pad support assembly either positioned on or in the table, and a planarizing medium coupled to the pad support assembly. The pad support assembly includes a fluid container and an elastic membrane coupled to the fluid container. The fluid container generally is a basin either that is either a separate component that is attached to the table, or a depression in the table itself. The fluid container can also be a bladder attached to the table. The membrane generally has a first surface engaging a portion of the fluid container to define a fluid chamber or cavity, and the membrane has a second surface to which the planarizing medium is attached. The planarizing medium can be a polishing pad attached directly to the second surface of the membrane, or the planarizing medium can be a polishing pad with an under-pad that is attached to the second surface of the membrane. The fluid chamber is filled with support fluid to support the elastic membrane over the fluid chamber. The support fluid can be water, glycerin, air, or other suitable fluids that support the elastic membrane in a manner that allows the membrane and the planarizing medium to freely flex inward into the fluid chamber under the influence of a mechanical force to provide at least a substantially uniform distribution of pressure across the substrate.

Abstract translation: 公开了用于微电子衬底组件的多个平面化机器，以及微电子衬底组件的机械和化学机械平面化的方法。 用于处理微电子衬底组件的平面化机器通常包括一个桌子，一个定位在桌子上或桌子上的衬垫支撑组件以及耦合到衬垫支撑组件的平面化介质。 垫支撑组件包括流体容器和联接到流体容器的弹性膜。 流体容器通常是盆地，或者是连接到桌子上的单独部件或桌子本身的凹陷部分。 流体容器也可以是附着在桌子上的气囊。 膜通常具有接合流体容器的一部分以限定流体室或空腔的第一表面，并且膜具有附着有平坦化介质的第二表面。 平坦化介质可以是直接附接到膜的第二表面的抛光垫，或者平坦化介质可以是具有附着到膜的第二表面的底垫的抛光垫。 流体室填充有支撑流体以将弹性膜支撑在流体室上。 支撑流体可以是水，甘油，空气或其它合适的流体，其以允许膜和平坦化介质在机械力的影响下自由地向内进入流体室的方式支撑弹性膜，以至少提供 跨过基底的压力基本均匀分布。

公开(公告)号：US06733364B2

公开(公告)日：2004-05-11

申请号：US10148575

申请日：2002-05-31

Applicant: Selwyn Jonathan Griffiths

Inventor： Selwyn Jonathan Griffiths

IPC: B24B4900

CPC classification number: B24B5/423 ,  B24B19/125 ,  B24B49/00

Abstract: A computer controlled grinding machine programmed so as to control the machine by calculating the wellhead demand positions which takes into account the difference in height between the workpiece axis of rotation and the grinding wheel axis of rotation to produce a height adjusted value for P. The following equation is used to compute the position demand values for a crankpin of a crankshaft, namely: P=(T* cos A)+(R+r)2−((T* sin A)+H)2), where P is the eight adjusted) demand position of the grinding wheel at each instant; R is the current radius of the grinding wheel; r is the target radius for the crankpin (18); T is the throw of the crankpin around the main crankshaft axis (16); A is the angular position of the crankshaft relative to the start position; and H is the vertical height between the two axes (the height error). The value for P is typically calculated for each of 3600 angular positions during one revolution of the crankshaft.

Abstract translation: 计算机控制的磨床被编程为通过计算井口需求位置来控制机器，该位置考虑了工件旋转轴线和砂轮旋转轴线之间的高度差，以产生用于P的高度调整值。以下 公式用于计算曲轴曲柄销的位置需求值，即：P =（T * cos A）+（R + r）<2> - （（T * sin A）+ H）<2>），其中P是砂轮的八个调整的需求位置 瞬间; R是砂轮的当前半径; r是曲柄销（18）的目标半径; T是围绕主曲轴轴线（16）的曲柄销的抛掷; A是曲轴相对于起始位置的角度位置; H是两轴之间的垂直高度（高度误差）。 通常在曲轴的一转期间为3600个角位置中的每一个计算P的值。

公开(公告)号：US06726528B2

公开(公告)日：2004-04-27

申请号：US10146494

申请日：2002-05-14

Applicant: Greg Barbour

Inventor： Greg Barbour

IPC: B24B4900

CPC classification number: B24B37/205 ,  B24B49/12

Abstract: A polishing pad having an optical assembly that does not cause excess wear on a wafer workpiece. The optical assembly is disposed within the pad such that it may move in response to forces applied to the optical assembly.

Abstract translation: 一种抛光垫，具有不会对晶片工件造成过度磨损的光学组件。 光学组件设置在垫内，使得其可以响应于施加到光学组件的力而移动。

公开(公告)号：US06682396B1

公开(公告)日：2004-01-27

申请号：US09546583

申请日：2000-04-11

Applicant: Tsu Shih ,  Chen-Hua Yu

Inventor： Tsu Shih ,  Chen-Hua Yu

IPC: B24B4900

CPC classification number: B24B37/24 ,  B24B21/004 ,  B24B37/26

Abstract: A linear polisher for polishing a substrate that always provides a fresh abrasive surface for polishing and a method for linear polishing a substrate are described. In the linear polisher, a length of a polishing pad is supported on a pair of rollers which are driven by a motor means for either intermittently or continuously advancing the pad during a polishing process. A vibration generator which is connected to the polishing pad through an adaptor provides lateral, or vibration in a transverse direction of the pad throughout the polishing process. The present invention novel linear polisher enables substantially constant removal rate to be achieved throughout the pad life of a polishing pad without deterioration such as that normally seen in a conventional rotary or linear CMP apparatus. Optionally, a rotatable substrate holder is utilized to further improve the polishing uniformity of the linear polishing apparatus.

Abstract translation: 描述了用于抛光总是提供用于抛光的新鲜研磨表面的基板的线性抛光机和用于线性抛光基板的方法。 在线性抛光机中，抛光垫的长度被支撑在一对辊上，该辊由用于在抛光过程中间歇地或连续地推进垫的马达装置驱动。 通过适配器连接到抛光垫的振动发生器在整个抛光过程中提供横向或在横向的振动。 本发明的新型线性抛光机能够在抛光垫的整个焊盘使用寿命期间实现基本上恒定的去除速率，而不会在常规的旋转或线性CMP设备中通常看到这样的劣化。 可选地，可旋转的基板保持器用于进一步改善线性抛光装置的抛光均匀性。