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公开(公告)号：US20100116063A1
公开(公告)日：2010-05-13
申请号：US12161055
申请日：2007-02-16
申请人： Robert John Sykes
发明人： Robert John Sykes
CPC分类号： G01N3/24 , G01N19/04 , G01N2203/0025 , G01N2203/0091 , G01N2203/0623
摘要： A test apparatus for applying shear loads to a deposit on a substrate comprises a cantilevered shear tool (18) having a tip (24) for contact with the deposit, and a back face having a piezo-electric crystal thereon. In use, the back face is subject to a compressive force, as well as other forces, and a corresponding electrical output from said crystal which is proportional to those forces. In one embodiment, the portion of the shear tool which contacts the deposit is offset rearwardly from the front face of the shear tool to improve the accuracy of the signal produced by the piezo-electric crystal. The apparatus is useful in testing the strength of bonds between deposits and substrates typically found in semiconductor devices.
摘要翻译： 用于将剪切载荷施加到基底上的沉积物的测试装置包括具有用于与沉积物接触的尖端（24）的悬臂剪切工具（18），以及在其上具有压电晶体的背面。 在使用中，背面受到压缩力以及其他力，以及与所述晶体成比例的相应的电输出。 在一个实施例中，接触沉积物的剪切工具的部分从剪切工具的前表面向后偏移，以提高由压电晶体产生的信号的精度。 该装置可用于测试在半导体器件中通常存在的沉积物和底物之间的结合强度。
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公开(公告)号：US07628066B2
公开(公告)日：2009-12-08
申请号：US11678000
申请日：2007-02-22
申请人： Meng Deng , Robert Nering
发明人： Meng Deng , Robert Nering
CPC分类号： G01N19/04 , G01N3/24 , G01N2203/0091
摘要： An apparatus for evaluating the peel adhesion of a test specimen to a substrate. The apparatus includes a base plate having a surface for receiving the substrate; a substrate clamping plate for securing the substrate to the substrate receiving surface of the base plate; a test specimen clamping mechanism, the test specimen clamping mechanism having a first end for securing a first end of the test specimen thereto and a second end; and a pivotable linkage, the pivotable linkage having a first end for connecting to the second end of the test specimen clamping mechanism and a second end pivotably mounted to an adaptor, the adaptor in communication with a source of tensile force, wherein the source of tensile force is applied through or via the adaptor to draw the pivotable linkage and test specimen clamping mechanism away from the base plate and peel the test specimen away from the substrate. Also disclosed is a method for evaluating the peel adhesion of a test specimen to a substrate.
摘要翻译： 一种用于评价试样与基材的剥离粘合性的装置。 该装置包括具有用于接收基板的表面的基板; 用于将基板固定到基板的基板接收表面的基板夹持板; 测试样本夹持机构，所述测试样本夹持机构具有用于固定所述测试样本的第一端的第一端和第二端; 以及可枢转联动装置，所述可枢转联动装置具有用于连接到所述试样夹紧机构的第二端的第一端和可枢转地安装到适配器的第二端，所述适配器与张力源连通，其中所述拉伸力源 通过或通过适配器施加力以拉动可枢转联动装置并将试样夹紧机构远离基板并将试样剥离基板。 还公开了一种用于评价试样与基材的剥离粘合性的方法。
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73.发明申请Method for selecting an insert on the basis of the mechanical resistance thereof 有权基于其机械电阻来选择插入件的方法公开(公告)号：US20040157071A1
公开(公告)日：2004-08-12
申请号：US10473734
申请日：2004-04-13
发明人： Jean-Clement Nugue , Boris Vidal , Emmanuel Nourry
IPC分类号： E06B003/964
CPC分类号： G01N19/04 , B32B17/10036 , B32B17/10761 , B32B17/1099 , G01N2203/0091 , Y10T428/31855
摘要： Method for selecting a polymeric insert intended to be chosen for its mechanical strength qualities so as to be incorporated into the construction of laminated glazing, the method consisting in evaluating the tear strength of the insert, characterized in that it also consists in evaluating the adhesion of said insert to at least one glass substrate
摘要翻译： 选择要由其机械强度质量选择的聚合物嵌入物以便被结合到层压玻璃的结构中的方法，该方法包括评价插入物的撕裂强度，其特征在于其还包括评价粘合剂 所述插入件至少一个玻璃基板
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公开(公告)号：US06408678B1
公开(公告)日：2002-06-25
申请号：US09687673
申请日：2000-10-13
申请人： Manoj Chopra , Charles H. Lee , Thorsten Lohmeyer , Jay Allan Merz , Hoa-Binh Tu
发明人： Manoj Chopra , Charles H. Lee , Thorsten Lohmeyer , Jay Allan Merz , Hoa-Binh Tu
IPC分类号： G01N356
CPC分类号： G01N3/08 , G01N19/04 , G01N2203/0091 , G01N2203/0248 , G01N2203/0282
摘要： The method for testing burnishing tape includes placing the tape on a backing surface and applying a force normal to the abrasive surface of the tape in a localized area of the tape surface. Thereafter, an increasing pulling force is applied to the end of the tape up to a point where the tape moves under the effect of the normal force. Through prior burnishing tape product testing a known normal force N is determined and a delamination pulling force D is likewise determined, such that a burnishing tape can be said to be defective where it is placed under a normal force N and the pulling force required to move it is less than the delamination pulling force D. The values of N and D are determinable for different types of burnishing tape and thereafter utilizable to test further quantities of similar burnishing tape. The testing device of the present invention includes a tape supporting plate, a force gauge for applying a known normal force N to the abrasive surface of the burnishing tape disposed on the plate, and a variable torque motor with a torque sensor that is utilized to apply a known variable pulling force to the tape, such that the pulling force required to move the tape under the normal force N can be determined and then compared to the predetermined delamination force D. Where the pulling force required to move the tape is less than D the tape is determined to be defective, whereas when the pulling force required to move the tape is greater than D the bonding strength of the abrasive layer of the burnishing tape is determined to be adequate such that the burnishing tape can be confidently utilized to burnish hard disk surfaces.
摘要翻译： 用于测试抛光带的方法包括将带放置在背衬表面上，并且在带表面的局部区域中施加垂直于带的研磨表面的力。 此后，增加的拉力被施加到带的端部，直到带子在法向力的作用下移动。 通过现有的抛光带产品测试，确定已知的法向力N，并且同样确定分层拉力D，使得抛光带可以被认为是有缺陷的，其中放置在法向力N下，并且需要移动的拉力 不到剥离拉力D.N和D的值可以用于不同类型的抛光带，然后可用于测试更多数量的类似的抛光带。本发明的测试装置包括带支撑板， 用于将已知的法向力N施加到设置在板上的抛光带的研磨表面的力计，以及具有扭矩传感器的可变转矩电动机，该转矩传感器用于对带施加已知的可变拉力，使得拉力 需要在正常力N下移动胶带，然后与预定的分层力D进行比较。在需要的拉力的情况下 磁带小于D时，磁带被确定为有缺陷的，而当移动磁带所需的拉力大于D时，确定磨光带的磨料层的粘合强度足够，使得抛光带 可以自信地用于抛光硬盘表面。
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公开(公告)号：US06339958B1
公开(公告)日：2002-01-22
申请号：US09208843
申请日：1998-12-10
申请人： Ting Y. Tsui , Young-Chang Joo
发明人： Ting Y. Tsui , Young-Chang Joo
IPC分类号： G01N324
CPC分类号： G01N19/04 , G01N3/42 , G01N2203/0091 , G01N2203/0234 , G01N2203/0278 , G01Q60/366
摘要： A nanoindentation apparatus is used to measure adhesion strength of a hard, thin film to a soft substrate. A variably increasing load is applied to the indenter tip. The indenter tip penetrates into the thin film at a first penetration rate and causes the thin film to sink into the substrate thus causing a tensile stress at the film substrate interface. At a critical value of the applied load, the stress at the interface exceeds the delamination value, and the thin film partially delaminates from the substrate. This causes the indenter tip to sink into the softer substrate at a sudden second, higher penetration rate. A sensor detects the applied load and the indenter tip penetration depth at this point. A computer flags the critical value of the applied load that corresponds to the increased penetration depth rate at the point of delamination of the film. The computer then calculates the critical stress required for delamination and the adhesion strength between the film and the substrate from the critical value of the applied load. The depth sensing indentation technique measurement may be carried out on a thin film integrated test element so as not to damage the rest of the thin film. The method allows non-destructive in-situ adhesion strength measurements for thin films and microelectronic devices.
摘要翻译： 使用纳米压痕装置测量硬质薄膜与柔性基材的粘合强度。 可变增加的负载施加到压头。 压头尖以第一穿透速率渗入薄膜中，并使薄膜沉入基片中，从而在薄膜基底界面处产生拉伸应力。 在施加负载的临界值时，界面处的应力超过分层值，薄膜与基板部分分层。 这使得压头尖端以突然的第二次较高的穿透速率下沉到较软的基底中。 此时传感器检测施加的载荷和压头尖端的穿透深度。 计算机标记所施加的载荷的临界值，其对应于胶片分层点处的增加的穿透深度速率。 然后，计算机从所施加的负载的临界值计算分层所需的临界应力和膜与基板之间的粘附强度。 深度感测压痕技术测量可以在薄膜集成测试元件上进行，以免损坏薄膜的其余部分。 该方法允许薄膜和微电子器件的非破坏性原位粘附强度测量。
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公开(公告)号：US5847284A
公开(公告)日：1998-12-08
申请号：US260635
申请日：1994-06-16
申请人： Hutton W. Theller
发明人： Hutton W. Theller
CPC分类号： B29C65/8223 , B29C65/18 , B29C66/0342 , B29C66/1122 , B29C66/3432 , B29C66/43 , B29C66/8181 , B29C66/8242 , B29C66/8322 , B29C66/9141 , B29C66/91431 , B29C66/9221 , B29C66/9241 , G01N19/04 , G01N3/18 , B29C2035/1666 , B29C2793/009 , B29C65/305 , G01N2203/0091 , G01N2203/0222 , G01N2203/0242 , G01N2203/0282 , G01N2203/0676
摘要： A procedure and apparatus for testing the hot tack properties of heat sealable flexible packaging materials. A portion of a test strip of heat sealable material is lapped and a segment of this portion heat sealed together. Upon completion of the heat seal the unsealed ends of the test strip are pulled apart at a prescribed constant rate to gradually delaminate the heat seal while the heat seal is cooled at a prescribed rate. Force required to delaminate the seal is continuously recorded as a function of time as the heat seal cools, thus providing data on seal strength for a full range of temperatures of the heat seal as it cools over time. In the apparatus a threading bar intercepts the strip intermediate its ends and pulls a portion through the opening between opposed dies of a heat sealer and in doing so laps the portion of the strip pulled through the opening. The test strip is then liberated from the threading bar during or following heat sealing of the lapped portion, as by cutting the strip at the threader.
摘要翻译： 用于测试可热封软包装材料的热粘性的方法和装置。 可热密封材料的测试条的一部分被研磨并将该部分的一部分热密封在一起。 热封完成后，将测试条的未密封端以规定的恒定速率拉开，以便在以特定的速率冷却热封时逐渐分层热封。 随着热封冷却时，密封件分层所需的力量随着时间的推移而不断被记录下来，因此随着时间的推移，热密封的全部温度范围内提供了密封强度的数据。 在设备中，穿线杆在其端部之间截取条带并且拉动一部分穿过热封机的相对的模具之间的开口，并且这样做使得拉动通过开口的条带的部分。 然后，在研磨部分的热密封过程中或之后，通过在穿线器处切割条带，将测试条从穿线棒释放出来。
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公开(公告)号：US5331858A
公开(公告)日：1994-07-26
申请号：US980853
申请日：1992-11-24
申请人： Hutton W. Theller
发明人： Hutton W. Theller
CPC分类号： B29C65/8223 , B29C65/18 , B29C66/0342 , B29C66/1122 , B29C66/3432 , B29C66/43 , B29C66/8181 , B29C66/8242 , B29C66/8322 , B29C66/9141 , B29C66/91431 , B29C66/9221 , B29C66/9241 , G01N19/04 , G01N3/18 , B29C2035/1666 , B29C2793/009 , B29C65/305 , G01N2203/0091 , G01N2203/0222 , G01N2203/0242 , G01N2203/0282 , G01N2203/0676
摘要： A procedure and apparatus for testing the hot tack properties of heat sealable flexible packaging materials. A portion of a test strip of heat sealable material is lapped and a segment of this portion heat sealed together. Upon completion of the heat seal the unsealed ends of the test strip are pulled apart at a prescribed constant rate to gradually delaminate the heat seal while the heat seal is cooled at a prescribed rate. Force required to delaminate the seal is continuously recorded as a function of time as the heat seal cools, thus providing data on seal strength for a full range of temperatures of the heat seal as it cools over time. In the apparatus a threading bar intercepts the strip intermediate its ends and pulls a portion through the opening between opposed dies of a heat sealer and in doing so laps the portion of the strip pulled through the opening. The test strip is then liberated from the threading bar during or following heat sealing of the lapped portion, as by cutting the strip at the threader.
摘要翻译： 用于测试可热封软包装材料的热粘性的方法和装置。 可热密封材料的测试条的一部分被研磨并将该部分的一部分热密封在一起。 热封完成后，将测试条的未密封端以规定的恒定速率拉开，以便在以特定的速率冷却热封时逐渐分层热封。 随着热封冷却时，密封件分层所需的力量随着时间的推移而不断被记录下来，因此随着时间的推移，热密封的全部温度范围内提供了密封强度的数据。 在设备中，穿线杆在其端部之间截取条带并且拉动一部分穿过热封机的相对的模具之间的开口，并且这样做使得拉动通过开口的条带的部分。 然后，在研磨部分的热密封过程中或之后，通过在穿线器处切割条带，将测试条从穿线棒释放出来。
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78.发明授权
公开(公告)号：US4899581A
公开(公告)日：1990-02-13
申请号：US351330
申请日：1989-05-04
申请人： Mark G. Allen , Stephen D. Senturia
发明人： Mark G. Allen , Stephen D. Senturia
CPC分类号： G01N19/04 , G01N2203/0091 , G01N2203/0298
摘要： A device for quantitatively measuring adherence of thin films provides a first substrate having an upper surface and a second substrate having a surface coplanar therewith. The second substrate is spaced on all sides from the first substrate by a cavity. The thin film is suspended over the cavity and adhered to the surfaces of the two substrates. A characteristic length of the area of the surface of the second substrate to which the film is adhered is made small relative to the characteristic length of the cavity. A pressure differential is applied across the thickness of the film such that the film debonds from the surface of the second substrate. Mechanical characteristics of the debonding of the film are observed and measured. The characteristics are thereafter related to provide a quantitative measurement of adherence of the thin film to the second substrate. A measurement of relative adherence between different films is obtained by testing a multilayered film structure. Other layers of various materials may be used to define a smaller area of adherence to which the film may be adhered.
摘要翻译： 用于定量测量薄膜粘附性的装置提供具有上表面的第一基底和具有与其共面的表面的第二基底。 第二基板通过空腔与第一基板的所有侧面间隔开。 薄膜悬挂在空腔上并粘附到两个基板的表面上。 相对于空腔的特征长度，薄膜附着的第二基板的表面的面积的特征长度变小。 在膜的厚度上施加压差，使得膜从第二基板的表面剥离。 观察并测量薄膜脱粘的机械特性。 此后的特征涉及提供薄膜对第二基底的粘附的定量测量。 通过测试多层膜结构获得不同膜之间的相对粘附度的测量。 可以使用各种材料的其它层来限定薄膜附着的更小的粘附面积。
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公开(公告)号：US20180230278A1
公开(公告)日：2018-08-16
申请号：US15656376
申请日：2017-07-21
发明人： Sunghyun HAN , Chanjae AHN , Won Suk CHANG , A Ra JO , Sungwon CHOI
CPC分类号： C08J5/18 , C08G73/1039 , C08G73/1042 , C08G73/1067 , C08G73/1078 , C08G73/14 , C08J2379/08 , G01N3/42 , G01N3/44 , G01N2203/0091 , G01N2203/0282
摘要： A polyimide film, which is a reaction product of a diamine including an amide structural unit in an amount of greater than about 0 mol % and less than or equal to about 80 mol % and an aromatic dianhydride, wherein the polyimide film has a Martens hardness of about 14 N/mm2 to about 120 N/mm2 at a thickness of about 30 μm to about 100 μm.
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公开(公告)号：US09983116B2
公开(公告)日：2018-05-29
申请号：US14899530
申请日：2013-07-18
发明人： Paul C. Landrum , Xiaoqi Zhou , Stephen Ledak
IPC分类号： G01N19/04
CPC分类号： G01N19/04 , G01N2203/0091
摘要： Testing a peel force of an adhesive medium includes an elevator assembly slidably connected to a column, the elevator assembly includes a connection to a gripper plate, and the gripper plate includes a first slot sized to accommodate a free portion of an adhesive medium and a jammer sized to secure the free portion of the adhesive medium in the first slot.
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