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71.
公开(公告)号:US11171306B2
公开(公告)日:2021-11-09
申请号:US15974903
申请日:2018-05-09
Applicant: BOE TECHNOLOGY GROUP CO., LTD
Inventor: Chengyuan Luo
Abstract: A package substrate, a manufacturing method thereof, an organic light-emitting diode (OLED) display panel and a manufacturing method thereof are provided. The package substrate includes a transparent substrate; a plurality of spacers disposed on the transparent substrate; and auxiliary electrodes provided on the spacers and in a non-light-emitting region. Orthographic projections of the spacers on an array substrate fall within orthographic areas of a pixel define layer (PDL) on the array substrate.
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公开(公告)号:US10784323B2
公开(公告)日:2020-09-22
申请号:US16408164
申请日:2019-05-09
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Chengyuan Luo
Abstract: A display panel, a method for producing the same, and a display device are disclosed. The display panel has: a base substrate; a thin film transistor array, which is on a surface of the base substrate; a UV light shielding layer, which is on a side of the thin film transistor array away from the base substrate; a pixel definition layer, which is on a side of the UV light shielding layer away from the base substrate; a thin film encapsulation layer, which is on a side of the pixel definition layer away from the base substrate, wherein the pixel definition layer has a light conversion material, which emits UV light by excitation of infrared light, and the thin film encapsulation layer has a UV-cured material.
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公开(公告)号:US20200098838A1
公开(公告)日:2020-03-26
申请号:US16408164
申请日:2019-05-09
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Chengyuan Luo
Abstract: A display panel, a method for producing the same, and a display device are disclosed. The display panel has: a base substrate; a thin film transistor array, which is on a surface of the base substrate; a UV light shielding layer, which is on a side of the thin film transistor array away from the base substrate; a pixel definition layer, which is on a side of the UV light shielding layer away from the base substrate; a thin film encapsulation layer, which is on a side of the pixel definition layer away from the base substrate, wherein the pixel definition layer has a light conversion material, which emits UV light by excitation of infrared light, and the thin film encapsulation layer has a UV-cured material.
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公开(公告)号:US09985244B2
公开(公告)日:2018-05-29
申请号:US15357245
申请日:2016-11-21
Applicant: BOE Technology Group Co., Ltd.
Inventor: Chengyuan Luo , Chun-jan Wang
CPC classification number: H01L51/525 , H01L51/5237 , H01L51/5246 , H01L51/5259 , H01L51/56 , H01L2227/323
Abstract: A light emitting display panel includes a cover plate and a substrate disposed opposite to each other; a plurality of light emitting devices located between the cover plate and the substrate; and a packaging structure surrounding the plurality of light emitting devices. The packaging structure includes at least three rows of protruded frames and a first packaging material which is located between adjacent protruded frames, each of the protruded frames having four sides which are looped and the at least three rows of protruded frames being adjacent to and embedded into each other in an outward direction. The packaging structure further includes a third packaging material which is located between the cover plate and the substrate, and located outside the outermost one of the at least three rows of protruded frames and inside the innermost one of the at least three rows of protruded frames.
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75.
公开(公告)号:US09960384B2
公开(公告)日:2018-05-01
申请号:US15121889
申请日:2015-10-14
Applicant: BOE Technology Group Co., Ltd.
Inventor: Chengyuan Luo , Chun-Jan Wang
CPC classification number: H01L51/5253 , H01L51/0097 , H01L51/5246 , H01L51/5259 , H01L51/56 , H01L2251/301 , H01L2251/5315 , H01L2251/5338 , Y02E10/549
Abstract: The present invention discloses a packaging method for an organic light emitting diode including: providing a first substrate that is made of metallic foil; providing an organic light emitting diode on the first substrate; providing, outside the organic light emitting diode, a passivation layer for covering the organic light emitting diode; coating an encapsulation adhesive onto the first substrate entirely, so that the encapsulation adhesive covers the passivation layer; providing a second transparent substrate at least on a portion of the encapsulation adhesive covering the passivation layer; and curing the encapsulation adhesive, to form a package of the organic light emitting diode. The present invention also discloses a packaging structure for an organic light emitting diode, and an organic light emitting diode device having the packaging structure.
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公开(公告)号:US09768409B2
公开(公告)日:2017-09-19
申请号:US14762048
申请日:2014-12-04
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor: Donghui Yu , Chun Jan Wang , Chengyuan Luo
IPC: H01L51/52
CPC classification number: H01L51/5246
Abstract: An electroluminescent device and a display device are provided. The electroluminescent device includes: a base substrate (100), a first surface of which is provided with a luminous element (110); a first substrate (210) having a first groove arranged to be opposed to the first surface of the base substrate (100); a sealing element (300) hermetically secured with a wall of the first groove, protruding from a notch of the first groove, and having a sealing groove provided to be opposed to a first surface of the base substrate (100); a part of the sealing element (300) protruding from the notch of the first groove is hermetically secured with the base substrate (100), and the luminous element (110) is arranged within the sealing groove. The electroluminescent device and display device depress the probability of the moisture in the air entering the sealing element and contacting with the luminous element, thus improving the performance and life of the electroluminescent device.
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77.
公开(公告)号:US20170155083A1
公开(公告)日:2017-06-01
申请号:US15121889
申请日:2015-10-14
Applicant: BOE Technology Group Co., Ltd.
Inventor: Chengyuan Luo , Chun-Jan Wang
CPC classification number: H01L51/5253 , H01L51/0097 , H01L51/5246 , H01L51/5259 , H01L51/56 , H01L2251/301 , H01L2251/5315 , H01L2251/5338 , Y02E10/549
Abstract: The present invention discloses a packaging method for an organic light emitting diode including: providing a first substrate that is made of metallic foil; providing an organic light emitting diode on the first substrate; providing, outside the organic light emitting diode, a passivation layer for covering the organic light emitting diode; coating an encapsulation adhesive onto the first substrate entirely, so that the encapsulation adhesive covers the passivation layer; providing a second transparent substrate at least on a portion of the encapsulation adhesive covering the passivation layer; and curing the encapsulation adhesive, to form a package of the organic light emitting diode. The present invention also discloses a packaging structure for an organic light emitting diode, and an organic light emitting diode device having the packaging structure.
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