Abstract:
Disclosed is a method for forming metal oxide dielectric layers, more particularly HfO2 dielectric layers, using an atomic layer deposition (ALD) method in which a series of thin intermediate layers are formed and treated with one or more oxidizers and nitrogents before the next intermediate layer is formed on the substrate. The intermediate oxidation treatments reduce the number of organic contaminants incorporated into the metal oxide layer from the organometallic precursors to produce a dielectric layer having improved current leakage characteristics. The dielectric layers formed in this manner remain susceptible to crystallization if exposed to temperatures much above 550° C., so subsequent semiconductor manufacturing processes should be modified or eliminated to avoid such temperatures or limit the duration at such temperatures to maintain the performance of the dielectric materials.
Abstract:
A conductive contact plug extends through an opening in the dielectric layer to contact the substrate and includes a widened pad portion extending onto the dielectric layer adjacent the opening. An ohmic pattern is disposed on the pad portion of the plug, and a barrier pattern is disposed on the ohmic pattern. A concave first capacitor electrode is disposed on the barrier pattern and defines a cavity opening away from the substrate. A capacitor dielectric layer conforms to a surface of the first capacitor electrode and a second capacitor electrode is disposed on the capacitor dielectric layer opposite the first capacitor electrode. Sidewalls of the ohmic pattern, the barrier pattern and the pad portion of the contact plug may be substantially coplanar, and the device may further include an etch stopper layer conforming to at least sidewalls of the ohmic pattern, the barrier pattern and the pad portion of the contact plug. Related fabrication methods are described.
Abstract:
A projection system is provided. The projection system includes a light source, a color filter separating light emitted from the light source into colored light, a light-path converter converting a path of the colored light that has passed through the color filter, a lens having a positive refractive power in order to condense the light from the light-path converter, a display device processing the light that has passed through the lens in response to an input signal and forming a color image, and a projection lens unit enlarging and projecting the color image onto a screen.
Abstract:
A semiconductor memory device that includes a composite Al2O3/HfO2 dielectric layer with a layer thickness ratio greater than or equal to 1, and a method of manufacturing the capacitor are provided. The capacitor includes a lower electrode, a composite dielectric layer including an Al2O3 dielectric layer and an HfO2 dielectric layer sequentially formed on the lower electrode, the Al2O3 dielectric layer having a thickness greater than or equal to the HfO2 dielectric layer, and an upper electrode formed on the composite dielectric layer. The Al2O3 dielectric layer has a thickness of 30-60 Å. The HfO2 dielectric layer has a thickness of 40 Å or less.
Abstract translation:一种半导体存储器件,其包括层厚度比大于或等于1的复合Al 2 O 3 / HfO 2 sub>电介质层, 并提供一种制造该电容器的方法。 电容器包括下电极,复合电介质层,其包括依次形成在其上的Al 2 O 3 3电介质层和HfO 2 N 2介电层 下电极,具有大于或等于HfO 2 2电介质层的厚度的Al 2 O 3 3 sub>电介质层,以及形成的上电极 在复合介电层上。 Al 2 O 3介电层具有30-60埃的厚度。 HfO 2 2介电层的厚度为40以下。
Abstract:
A method for manufacturing a capping layer covering a capacitor of a semiconductor memory device, preferably a metal-insulator-metal (MIM) capacitor, wherein the method includes forming a capacitor having a lower electrode, a dielectric layer and an upper electrode on a semiconductor substrate, forming a capping layer on the capacitor, and crystallizing the dielectric layer. Here, forming the capping layer includes stabilizing for deposition of the capping layer without providing oxygen gas, depositing the capping layer by providing a reaction source for the capping layer; and purging an inside of a reactor for forming the capping layer.
Abstract:
A zoom lens barrel structure of a zoom camera includes a fixed barrel fixed to the camera, a double helicoid ring having first and second helicoid portions having different lead angles, a front lens group support body coupled to the first helicoid portion of the double helicoid ring, a rear lens group support body coupled to the second helicoid portion of the double helicoid ring, and guide means for guiding the front lens group support body and the rear lens group support body to move along the optical axis of the camera, the guide means having a cam portion formed along a path where the rear lens group support body is coupled to the second helicoid portion.
Abstract:
A clamp holds a semiconductor wafer during an Al reflow process. The clamp is made of a ceramic material, and thereby clamp surface roughening which damages semiconductor wafers and other damaging of the wafer caused by the deformation of the clamp are avoided. A sloped surface of the clamp pad can also reduce the damage on the wafer by reducing the contact area between the clamp pad and the wafer. In addition, the clamp has several features that can reduce heat dissipation from the wafer to outside during the Al reflow. Slots formed on the pad reduce the amount of heat conduction through the clamp, and the polished inner surface of the clamp cap reflects the heat radiated from the wafer back to the wafer.
Abstract:
A method of forming a metal interconnection includes the steps of forming a first conductive layer on a substrate, and forming an insulating layer on the first conductive layer and on the substrate. A contact hole is formed in the insulating layer thereby exposing a portion of the first conductive layer, a barrier layer is formed on the exposed portion of the first conductive layer in the contact hole, and a thermal treatment is performed on the barrier layer. After the step of performing the thermal treatment, a wetting layer is formed on a sidewall of the contact hole, and a second conductive layer is formed on the barrier layer and on the wetting layer in the contact hole.
Abstract:
A gas sensor and a method for fabricating the same includes a semiconductor substrate, a supporting layer formed on the semiconductor substrate, the supporting layer being electrically insulative and having a pattern groove formed therein, a heater formed in the pattern groove, an electrically insulating layer formed on the heater and the supporting layer, an electrode formed on the insulating layer, and a sensing layer formed on the electrode and the insulating layer to detect a target gas of interest according to a measured change in electrical conductivity or resistance thereof.
Abstract:
An improved plug structure for aquarium fish food containers is disclosed. The plug of this invention has two depressions for receiving a detachable tap and a detachable spoon respectively. The tap is pivoted to the spoon and easily opened by a one touch motion. Both the spoon and the tap can be easily separated from the plug body at the same time. The above plug thus allows the fixed amount of food to be taken out of the food container thereby saving food. The plug also prevents food from dropping when measuring the fixed amount of food using the spoon.