摘要:
Disclosed is a light emitting device including, a second electrode layer, a light emitting structure that includes a second conductive semiconductor layer, an active layer and a first conductive semiconductor layer and that is provided on the second electrode layer, a first electrode layer that includes a pad part and an electrode part connected to the pad part and that is provided on the light emitting structure, and a current blocking layer arranged between the second electrode layer and the light emitting structure in such a way that a part of the current block layer overlaps to correspond to the first electrode layer, wherein a width of the current blocking layer corresponding to the electrode part is different depending upon a clearance with the pad part.
摘要:
Provided are a light emitting device, a light emitting device package, and a light unit. The light emitting device includes a support substrate, a light emitting structure layer disposed on the support substrate, the light emitting structure layer including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer disposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer, an electrode electrically connected to the first conductive type semiconductor layer, and a volume layer disposed on the light emitting structure layer, the volume layer having a thickness greater than a thickness of the electrode.
摘要:
Provided are a light emitting device and a light emitting device package. According to the light emitting device, a light emitting part and an electro-static discharge (ESD) protection part are disposed on a conductive support member. A connection layer electrically connects a first conducitve type semiconductor layer of the light emitting part to a second conductive type semiconductor layer of the ESD protection part. A ptrtection member is disposed on the connection layer and the ESD protection layer.
摘要:
A light emitting device is provided that includes a light emitting structure (including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer), a conductive layer, an insulation layer, and a current blocking layer. The conductive layer may have a first conductive portion that passes through the second conductive type semiconductor layer and the active layer to contact the first conductive type semiconductor layer. The insulation layer may have a first insulation portion that surrounds the first conductive portion of the conductive layer. The current blocking layer may substantially surround the first insulation portion of the insulation layer, the first insulation portion provided between the current blocking layer and the first conductive portion.
摘要:
A touch screen panel in which an occurrence of a scratch at intersections of coupling patterns respectively coupling first sensing cells and second sensing cells to each other in a first direction and in a second direction is prevented. The touch screen panel includes a transparent substrate, sensing patterns formed on a surface of the transparent substrate. The sensing patterns include first sensing cells disposed along a first direction, second sensing cells disposed between the first sensing cells along a second direction intersecting the first direction, first coupling patterns coupling the first sensing cells to each other in the first direction, second coupling patterns coupling the second sensing cells to each other in the second direction, and an insulating layer disposed between the first coupling patterns and the second coupling patterns at intersections of the first coupling patterns and the second coupling patterns. The insulating layer includes a concave part formed below the second coupling patterns in an area where the first coupling patterns and the second coupling patterns intersect and a protruding part positioned around the concave part so as to have a height higher than the concave part.
摘要:
A touch screen panel includes first and second substrates disposed to face each other, conductive sensing cells in a touch active area on a first surface of the first substrate that faces the second substrate, a black matrix in a non-touch active area on a first surface of the second substrate that faces the first substrate, the non-touch active area being positioned outside the touch active area, an adhesive layer between the first and second substrates, the adhesive layer joining the first and second substrates together, and an insulating layer in the touch active area on the first substrate, the insulating layer covering the conductive sensing cells and overlapping a concave portion formed on the first surface of the second substrate by the black matrix.
摘要:
Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer, and a second conductive semiconductor layer on the active layer, an adhesive layer contacting a top surface of the first conductive semiconductor layer, a first electrode contacting a top surface of the first conductive semiconductor and a top surface of the adhesive layer, and a second electrode contacting the second conductive semiconductor layer, wherein the adhesive layer contacting the first electrode is spaced apart from the second electrode.
摘要:
Provided is a substrate for fabricating a light emitting device and a method for fabricating the light emitting device. The method for fabricating the light emitting device may include forming a sacrificial layer having band gap energy less than energy of a laser irradiated on a substrate, forming a growth layer on the sacrificial layer, forming a light emitting structure including a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer on the growth layer, and irradiating the laser onto the sacrificial layer to pass through the substrate, thereby to lift-off the substrate.
摘要:
A light emitting device according to the embodiment includes a conductive support member; a light emitting structure on the conductive support member including a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer between the first and second semiconductor layers; and a protective device on the light emitting structure.
摘要:
A semiconductor light-emitting device is provided that may include an electrode layer, a light-emitting structure including a compound semiconductor layer on the electrode layer, and an electrode on the light-emitting structure, wherein the electrode includes an ohmic contact layer that contacts the compound semiconductor layer, a first barrier layer on the ohmic contact layer, a conductive layer including copper on the first barrier layer, a second barrier layer on the conductive layer, and a bonding layer on the second barrier layer.