Semiconductor package, and package on package having the same

    公开(公告)号:US11581263B2

    公开(公告)日:2023-02-14

    申请号:US17024852

    申请日:2020-09-18

    Abstract: A semiconductor package includes: a redistribution layer including a plurality of redistribution insulating layers, a plurality of redistribution line patterns that constitute lower wiring layers, and a plurality of redistribution vias that are connected to some of the plurality of redistribution line patterns while penetrating at least one of the plurality of redistribution insulating layers; at least one semiconductor chip arranged on the redistribution layer; an expanded layer surrounding the at least one semiconductor chip on the redistribution layer; and a cover wiring layer including at least one base insulating layer, a plurality of wiring patterns that constitute upper wiring layers, and a plurality of conductive vias that are connected to some of the plurality of wiring patterns while penetrating the at least one base insulating layer.

    Beam steering device and optical apparatus including the same

    公开(公告)号:US10605901B2

    公开(公告)日:2020-03-31

    申请号:US15436111

    申请日:2017-02-17

    Abstract: Beam steering devices and optical apparatuses including the beam steering devices are provided. A beam steering device includes a light source configured to generate input lights having first different wavelengths, a multiplexer configured to simultaneously receive the generated input lights, and multiplex the received input lights into a multiplexed light, and an optical splitter configured to split the multiplexed light. The beam steering device further includes an optical modulator configured to modulate the split light, and an emitter configured to simultaneously emit output lights having second different wavelengths to different points arranged in a first direction, based on the modulated light.

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